JPH0379166U

JPH0379166U -

Info

Publication number: JPH0379166U
Application number: JP14055589U
Authority: JP
Priority date: 1989-12-04
Filing date: 1989-12-04
Publication date: 1991-08-12

Description

[Brief explanation of the drawing]

第１図は本考案のプレスフイツトピンの一実施
例を示す図であり、同図ａは正面図、同図ｂは同
図ａのＷ部詳細図、同図ｃは同図ｂのＰ−Ｐ断面
図、同図ｄは同図ｃの微視断面図、第２図は従来
のプレスフイツトピンの一例を示す図であり、同
図ａは正面図、同図ｂは同図ａのＶ部詳細図、同
図ｃは同図ｂのＱ−Ｑ断面図、同図ｄは同図ｃの
微視断面図である。Ａ……端子、Ｂ……接触部、Ｃ……半田メツキ
層、Ｄ……プリント基板、Ｅ……通孔。 Fig. 1 is a diagram showing an embodiment of the press fit pin of the present invention; Fig. 1a is a front view, Fig. 1b is a detailed view of the W part in Fig. 1a, and Fig. 1c is a detailed view of the W part in Fig. 1b. -P sectional view, figure d is a microscopic cross-sectional view of figure c, figure 2 is a diagram showing an example of a conventional press fit pin, figure a is a front view, figure b is figure a Figure c is a sectional view taken along the line QQ in figure b, and figure d is a microscopic cross-sectional view of figure c. A...terminal, B...contact part, C...solder plating layer, D...printed circuit board, E...through hole.

Claims

[Scope of utility model registration request]

A terminal A is formed at the lower end, and a contact part B is formed above it.
are arranged in series, and a solder plating layer C is formed on at least the outer peripheral surface of the contact portion B. When the contact portion B side is inserted and press-fitted into a through hole E formed in a printed circuit board D, etc., the solder is removed. The plating layer C is the same through hole E
In the press fit pin which is pressed against the inner circumferential surface of the pin so that the two are electrically connected, the solder plating layer C is reflow-treated to form the solder plating layer C to have a substantially uniform thickness. Features a press fit pin.