JPH0378799B2 - - Google Patents

Info

Publication number
JPH0378799B2
JPH0378799B2 JP60257588A JP25758885A JPH0378799B2 JP H0378799 B2 JPH0378799 B2 JP H0378799B2 JP 60257588 A JP60257588 A JP 60257588A JP 25758885 A JP25758885 A JP 25758885A JP H0378799 B2 JPH0378799 B2 JP H0378799B2
Authority
JP
Japan
Prior art keywords
heat
frame
printed board
shelf
heat pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60257588A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62118600A (ja
Inventor
Katsushi Arai
Yasushi Kojima
Mitsusada Toyama
Jun Sakiura
Mitsuaki Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP25758885A priority Critical patent/JPS62118600A/ja
Publication of JPS62118600A publication Critical patent/JPS62118600A/ja
Publication of JPH0378799B2 publication Critical patent/JPH0378799B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP25758885A 1985-11-19 1985-11-19 高放熱架構造 Granted JPS62118600A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25758885A JPS62118600A (ja) 1985-11-19 1985-11-19 高放熱架構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25758885A JPS62118600A (ja) 1985-11-19 1985-11-19 高放熱架構造

Publications (2)

Publication Number Publication Date
JPS62118600A JPS62118600A (ja) 1987-05-29
JPH0378799B2 true JPH0378799B2 (enrdf_load_stackoverflow) 1991-12-16

Family

ID=17308353

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25758885A Granted JPS62118600A (ja) 1985-11-19 1985-11-19 高放熱架構造

Country Status (1)

Country Link
JP (1) JPS62118600A (enrdf_load_stackoverflow)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57102195U (enrdf_load_stackoverflow) * 1980-12-16 1982-06-23
JPS57166396U (enrdf_load_stackoverflow) * 1981-04-14 1982-10-20
JPS5899890U (ja) * 1981-12-26 1983-07-07 株式会社明電舎 プリント基板冷却装置

Also Published As

Publication number Publication date
JPS62118600A (ja) 1987-05-29

Similar Documents

Publication Publication Date Title
CA2561769C (en) Low-profile thermosyphon-based cooling system for computers and other electronic devices
US5168919A (en) Air cooled heat exchanger for multi-chip assemblies
US7958935B2 (en) Low-profile thermosyphon-based cooling system for computers and other electronic devices
JPH10215094A (ja) Pcカードアレイからの熱除去装置
WO2015049807A1 (ja) サーバ装置
JPH05335454A (ja) 電子機器の冷却装置
JP3364764B2 (ja) 密閉機器筐体冷却装置
US6510053B1 (en) Circuit board cooling system
JP3079773B2 (ja) 熱伝導スペーサーの実装構造
US3730264A (en) Frontal heat exchanger for racks of heat dissipating apparatus
JP2004247724A (ja) 電子基板から熱を放散させるシステムおよび方法
JP2504059B2 (ja) 電子回路パッケ−ジの冷却構造
JPH0378799B2 (enrdf_load_stackoverflow)
JPH02155296A (ja) 発熱装置の高放熱構造
JPH012397A (ja) 電子回路パッケ−ジの冷却構造
CN216566086U (zh) 液冷散热装置、液冷散热系统及电子装置
JPH05315781A (ja) 印刷配線板搭載部品の放熱構造
US6452799B1 (en) Integrated circuit cooling system
CN216250711U (zh) 一种用于贴片式功率电子器件的局部冷却结构
JPS59155158A (ja) 半導体装置の冷却構造
JPH06260784A (ja) 冷却装置
CN213662271U (zh) 散热模组
JPS6271299A (ja) 電子装置の冷却構造
CN118158968A (zh) 石墨烯高导热模块及使用该模块的电子设备
JP4078400B2 (ja) 電子デバイスの放熱システム