JPH0378404B2 - - Google Patents

Info

Publication number
JPH0378404B2
JPH0378404B2 JP18437084A JP18437084A JPH0378404B2 JP H0378404 B2 JPH0378404 B2 JP H0378404B2 JP 18437084 A JP18437084 A JP 18437084A JP 18437084 A JP18437084 A JP 18437084A JP H0378404 B2 JPH0378404 B2 JP H0378404B2
Authority
JP
Japan
Prior art keywords
fatty acid
resin composition
divalent
mold release
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP18437084A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6162516A (ja
Inventor
Toshiro Takeda
Akira Toko
Koichi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP18437084A priority Critical patent/JPS6162516A/ja
Publication of JPS6162516A publication Critical patent/JPS6162516A/ja
Publication of JPH0378404B2 publication Critical patent/JPH0378404B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP18437084A 1984-09-05 1984-09-05 半導体封止用樹脂組成物 Granted JPS6162516A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18437084A JPS6162516A (ja) 1984-09-05 1984-09-05 半導体封止用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18437084A JPS6162516A (ja) 1984-09-05 1984-09-05 半導体封止用樹脂組成物

Publications (2)

Publication Number Publication Date
JPS6162516A JPS6162516A (ja) 1986-03-31
JPH0378404B2 true JPH0378404B2 (enrdf_load_stackoverflow) 1991-12-13

Family

ID=16152031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18437084A Granted JPS6162516A (ja) 1984-09-05 1984-09-05 半導体封止用樹脂組成物

Country Status (1)

Country Link
JP (1) JPS6162516A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6475554A (en) * 1987-09-17 1989-03-22 Toshiba Corp Epoxy resin composition and resin-sealing type semiconductor device
JP2768695B2 (ja) * 1988-08-25 1998-06-25 鐘淵化学工業株式会社 成形用樹脂組成物
JPH06200127A (ja) * 1993-01-07 1994-07-19 Matsushita Electric Works Ltd 封止用エポキシ樹脂成形材料

Also Published As

Publication number Publication date
JPS6162516A (ja) 1986-03-31

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