JPH0378242A - Method and apparatus for securing adhesive film - Google Patents

Abstract

PURPOSE:To facilitate fixture of a film without disordering arranged chip group and to apply it to an automatic conveyance of a wafer by press-adhering a clamp frame from above in a state that an adhesive film is extended, and cutting the film. CONSTITUTION:After a cut wafer 3 is press-adhered to an adhesive film 1, the outer periphery of the film 1 is secured by a jig 6, and a clamp frame 2 is press-adhered from above in a state that the film 1 is extended. When the film 1 is cut near the outer periphery of the frame 2, the film 1 at the outer periphery of the frame 2 is contracted by its recovery force, folded on the nonadhesive surface of the frame 2 and secured.

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention is directed to the use of a thermoplastic film (hereinafter referred to as a film) having adhesive strength to cover a semiconductor wafer (hereinafter referred to as a wafer) in the manufacturing process of semiconductor integrated circuits. Crimp the surface.
The present invention relates to a film fixing method and apparatus which can be suitably used in a step of widening the intervals between the chips after cutting the wafer into a large number of strip-shaped semiconductor elements (hereinafter referred to as chips).

<Prior Art> A representative example of the prior art in the above-mentioned technical field is the "method for manufacturing a semiconductor device" disclosed in Japanese Patent Application Publication No. 58-21428.

In this prior art, a wafer is placed on the surface of an adhesive thermoplastic film 10, as shown in FIGS. 6, 7, and 8.
11 is crimped and then cut into individual semiconductor element pieces to form chips 12. Next, in the step of widening the intervals between the chips 12, as shown in FIG.
3, insert the circular expansion jig 14 from below, and move the film fixing jig 13 relative to the expansion jig 14 so that its upper circular surface pushes up the lower surface of the film 10 evenly. By lowering the film 10, the film 10 is expanded on the surface of the expansion jig 14, and the individually cut chips 1z are arranged at certain intervals as shown in FIG. By fitting a rubber ring 16 of a size that fits into the groove 15 previously provided in the film 10 from the outer periphery of the film 10, the film is firmly placed in the expansion jig 14 in the state shown in FIG. 8, and the chips 12 are arranged in a spaced arrangement state. is maintained. The expansion jig 14 has a structure that can be removed from the expansion fixing jig 17, so if the film 10 on which a large number of chips 12 are arranged is cut below the rubber ring 16, the expansion jig 14 can be removed as needed in the state shown in FIG. It is something that can be transported or stored.

<Problems to be Solved by the Invention> However, in the conventional technique of fixing the film using the rubber ring 16, the following problems were observed.

First, the rubber ring 16 is fitted into the expansion jig 14 manually by an operator, and the work of stretching the highly elastic rubber ring places a large burden on the operator.

Furthermore, by providing the groove 15 on the side surface of the expansion jig 14 for fitting the rubber ring 16, the size of the expansion jig in the height direction (thickness) increases, making it difficult to store it in a cassette. There was a big problem in that automatic transfer of wafers was not possible.

Therefore, the present invention is capable of easily fixing the film without disturbing the chip groups that are neatly subdivided and arranged at appropriate intervals by being pressure-bonded onto the adhesive film.
The object of the present invention is to provide a film fixing method and device suitable for automatic wafer transport.

<Means for Solving the Problems> In order to achieve the above object, the method and apparatus of the present invention have the following characteristic components.

fil Fix the outer periphery of an expandable and resilient adhesive film on which a wafer or a large number of semiconductor chips are crimped, and with the film expanded, apply one side of a thin plate-shaped clamp frame with an opening in the center to the wafer. Crimp the film, and then cut out the film near the outside of the clamp frame.

(2) One side of a thin plate-like clamp frame having an opening in the center by fixing the outer periphery of an expandable and resilient adhesive film to which a wafer or a number of semiconductor chips are crimped, and without expanding the film. After crimping the film to the film, expand only the outside of the clamp frame, and then cut out the film near the outside of the clamp frame.

(3) A film fixing jig that fixes the outer periphery of an expandable and resilient adhesive film to which a wafer or a large number of semiconductor chips are crimped; and a film fixing jig that works together with the film fixing jig to expand the film. a knife for cutting out the film at the position of the cutting groove provided in the expansion jig; and a knife for cutting out the film at the position of the cutting groove provided in the expansion jig; A thin plate-shaped clamp frame having an opening in the center where the film is to be crimped and fixed is provided.

After the cut wafer is crimped onto the adhesive film, the outer periphery of the adhesive film is fixed, and with the film expanded, a clamp frame is crimped from above, and then the adhesive film is attached near the outer periphery of the clamp frame. When you cut the
The adhesive film on the outer periphery of the clamp frame contracts due to its restoring force, is folded back onto the non-crimped surface of the clamp frame, and is fixed.

Before expanding the film, crimp the clamp frame,
Even if the film is then cut at the same position after expanding only the film outside the clamp frame, the adhesive film is similarly fixed to the clamp frame.

<Example> Hereinafter, a method of fixing a wafer expansion film of the present invention will be described with reference to drawings showing preferred examples thereof.

FIG. 1 shows a state in which a cut wafer 3 is pressure-bonded to the adhesive surface of the film 1, placed on an expansion jig 5, and the outer peripheral portion of the film is fixed by a film fixing jig 6.

On the surface of the expansion jig 5, a cutting groove 7 with a depth of 511 mm and a groove width of 3 m is formed on the outer periphery, and a cutting groove 7 with a depth of 1 inch and a groove width of 16.5 mm is formed on the inside thereof.
m frame grooves 8 are provided.

FIG. 2 shows the expanded state of the film. When the outer periphery of the film 1 is fixed to the film with the fixing jig 6 and the expansion jig 5 is pushed upward, the film 1 is expanded and the chips 3 and 4 of the crimped wafer 3 are neatly divided into small pieces. Outer diameter 166aw corresponding to the frame groove 8 provided in the expansion jig 5
Thin plate-shaped clamp frame 2 with an inner diameter of 150 mm, a thickness of 1 mm, an opening in the center, and a flat film fixing surface on both hands.
This shows the state in which the film is pressed onto the film surface from above.

FIG. 3 shows the state in which the film shrinks and is folded back onto the surface of the clamp frame 2 after the film is cut.

Now, while the clamp frame 2 is being crimped onto the film 1 using the frame groove 8 provided in the expansion jig 5 (the crimping mechanism is not shown), the clamp frame 2 is placed on the outer periphery about 7 inches away from the frame groove 8. When the film is cut with a knife 9 using the cutting groove 7 with a depth of 5 m and a width of 3 grooves, the film inside the clamp frame 2 remains expanded, but the film on the outer periphery remains expanded. is contracted by its restoring force, is folded back naturally, and is adhered and fixed to the upper surface of the clamp frame 2.

FIG. 4 shows the film 1 fixed to the clamp frame 2 taken out from the expansion jig 5, and FIG. 5 shows its cross section.

In this example, the outer periphery of the film 1 is fixed, the entire inner area is expanded, the clamp frame 2 is crimped, and the film 1 is cut at a position outside the outer periphery of the clamp frame. When crimping an uncut wafer to a group of chips, after crimping and fixing the clamp frame 2 to the film 1, the outer periphery of the film 1 is expanded, and only the outer periphery of the film 1 of the clamp frame 2 is expanded. It can also be cut and folded back onto the other side of the clamp frame using the restoring force.

That is, the film 1 within the opening of the clamp frame 2 is not expanded.

The clamp frame 2 may be crimped onto the film 1 by applying pressure from above, or by using a ferromagnetic material for the clamp frame 2 and utilizing magnetic attraction in cooperation with the expansion jig 5.

Further, the clamp frame 2 may be made of metal such as stainless steel or aluminum, or plastic. Moreover, the shape may be a quadrilateral or the like other than the circle of this embodiment.

<Effects of the Invention> The method of fixing the wafer expansion film of the present invention allows the film to be fixed without disturbing the spacing and arrangement of the chip groups, eliminates the need for rubber rings as in the prior art, and improves the fit. Work was also omitted.

In addition, the height dimension has been changed from the conventional approximately 20cm to 1cm and 20cm.
The clamp frame can be stored in a cassette, making it possible to automatically transport wafers, shortening the manufacturing process, improving product productivity, and significantly reducing manufacturing costs. Ta.

[Brief explanation of drawings]

Fig. 1 is a cross-sectional view showing a state in which a wafer is crimped onto a film and placed on the stage of an expansion device, Fig. 2 is a cross-sectional view showing a state in which the film is expanded and a clamp frame is attached to it, and Fig. 3 4 is a cross-sectional view of the main parts of the expansion device showing the film cut and folded back onto the clamp frame, FIG. 4 is a plan view showing the expanded film fixed to the clamp frame, and FIG. 6 to 8 are reference views illustrating the prior art, in which FIG. 6 is a sectional view showing the film in a fixed state, and FIG. 7 is a sectional view in an expanded state. 8 are sectional views showing a state in which the rubber ring is fixed after expansion. 6,13 Film fixing jig

Claims (3)

[Claims] (1) Fix the outer periphery of an expandable and resilient adhesive film to which a wafer or a large number of semiconductor chips are crimped, and with the film expanded, one side of a thin plate-like clamp frame with an opening in the center A method for fixing an adhesive film, the method comprising: pressing the film onto the film, and then cutting out the film near the outside of the clamp frame. (2) One side of a thin plate-like clamp frame having an opening in the center by fixing the outer periphery of an expandable and resilient adhesive film to which a wafer or a number of semiconductor chips are crimped, and without expanding the film. 1. A method for fixing an adhesive film, which comprises: compressing the film to the film, expanding only the film outside the clamp frame, and then cutting out the film near the outside of the clamp frame. (3) A film fixing jig 6 for fixing the outer periphery of the expandable and resilient adhesive film 1 to which a wafer or a large number of semiconductor chips is crimped; and the film fixing jig 6
an expansion jig 5 for expanding the film 1 in cooperation with the expansion jig 5; a knife 9 for cutting out the film 1 at the position of the cutting groove 7 provided in the expansion jig 5; An adhesive film characterized by comprising a thin plate-like clamp frame 2 having an opening in the center to which the film 1 is to be crimped and fixed at the position of a frame groove 8 provided near the inner side of the cutting groove 7. Fixation device.