JPH0377273B2 - - Google Patents
Info
- Publication number
- JPH0377273B2 JPH0377273B2 JP13152085A JP13152085A JPH0377273B2 JP H0377273 B2 JPH0377273 B2 JP H0377273B2 JP 13152085 A JP13152085 A JP 13152085A JP 13152085 A JP13152085 A JP 13152085A JP H0377273 B2 JPH0377273 B2 JP H0377273B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- target
- sputtering
- resin target
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13152085A JPS61291964A (ja) | 1985-06-17 | 1985-06-17 | スパツタ用樹脂タ−ゲツト |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13152085A JPS61291964A (ja) | 1985-06-17 | 1985-06-17 | スパツタ用樹脂タ−ゲツト |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61291964A JPS61291964A (ja) | 1986-12-22 |
JPH0377273B2 true JPH0377273B2 (enrdf_load_stackoverflow) | 1991-12-10 |
Family
ID=15059972
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13152085A Granted JPS61291964A (ja) | 1985-06-17 | 1985-06-17 | スパツタ用樹脂タ−ゲツト |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61291964A (enrdf_load_stackoverflow) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3628554B2 (ja) * | 1999-07-15 | 2005-03-16 | 株式会社日鉱マテリアルズ | スパッタリングターゲット |
WO2005007924A1 (en) * | 2003-07-07 | 2005-01-27 | Honeywell International Inc. | Sputtering target constructions |
JP2008531298A (ja) | 2005-01-12 | 2008-08-14 | ニュー・ヨーク・ユニヴァーシティ | ホログラフィック光ピンセットによりナノワイヤを処理するためのシステムおよび方法 |
JP5029431B2 (ja) * | 2007-03-09 | 2012-09-19 | 三菱マテリアル株式会社 | 蒸着材及び該蒸着材を用いて蒸着膜を形成する方法 |
KR20110117565A (ko) * | 2010-04-21 | 2011-10-27 | 박영춘 | 단차구조를 포함하는 스퍼터 타켓 및 이를 이용하는 스퍼터링 장치 |
AT15050U1 (de) * | 2015-12-18 | 2016-11-15 | Plansee Composite Mat Gmbh | Beschichtungsquelle mit Strukturierung |
-
1985
- 1985-06-17 JP JP13152085A patent/JPS61291964A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61291964A (ja) | 1986-12-22 |
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