JPH0376782B2 - - Google Patents

Info

Publication number
JPH0376782B2
JPH0376782B2 JP60026846A JP2684685A JPH0376782B2 JP H0376782 B2 JPH0376782 B2 JP H0376782B2 JP 60026846 A JP60026846 A JP 60026846A JP 2684685 A JP2684685 A JP 2684685A JP H0376782 B2 JPH0376782 B2 JP H0376782B2
Authority
JP
Japan
Prior art keywords
plunger
cylinder
resin
mold
supply port
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60026846A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61185940A (ja
Inventor
Minoru Tanaka
Itaru Matsuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2684685A priority Critical patent/JPS61185940A/ja
Publication of JPS61185940A publication Critical patent/JPS61185940A/ja
Publication of JPH0376782B2 publication Critical patent/JPH0376782B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/1753Cleaning or purging, e.g. of the injection unit

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2684685A 1985-02-13 1985-02-13 半導体素子用樹脂封止装置 Granted JPS61185940A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2684685A JPS61185940A (ja) 1985-02-13 1985-02-13 半導体素子用樹脂封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2684685A JPS61185940A (ja) 1985-02-13 1985-02-13 半導体素子用樹脂封止装置

Publications (2)

Publication Number Publication Date
JPS61185940A JPS61185940A (ja) 1986-08-19
JPH0376782B2 true JPH0376782B2 (US08124317-20120228-C00026.png) 1991-12-06

Family

ID=12204636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2684685A Granted JPS61185940A (ja) 1985-02-13 1985-02-13 半導体素子用樹脂封止装置

Country Status (1)

Country Link
JP (1) JPS61185940A (US08124317-20120228-C00026.png)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH025931U (US08124317-20120228-C00026.png) * 1988-06-24 1990-01-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH025931U (US08124317-20120228-C00026.png) * 1988-06-24 1990-01-16

Also Published As

Publication number Publication date
JPS61185940A (ja) 1986-08-19

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