JPH0375625B2 - - Google Patents

Abstract

1. A process for adjusting leaf-spring like components, in particular contact springs which are clamped at one end, by deflecting the free end of the spring, by means of local heating operating on one side of the spring only, or by local softening, e.g. by laser beams (3), characterised in that for adjustment in either direction the spring end is loaded with forces (P) which have an effect in the appropriate direction.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for adjusting a leaf spring-like component fixed on one side by locally heating one side and displacing the free end of the free spring.

In almost all electrical devices, contact springs are used whose contact force or contact distance complies with specified conditions. As the responsibilities of devices become more complex, the requirements for maintaining specified conditions are increasing. In that case, for a constant contact spring, the contact force or the contact stroke within a constant time can be calculated in advance by means of a constant displacement force. However, practical retention of pre-calculated values is dependent on non-adjustable material constants and only partially adjustable manufacturing tolerances. It is therefore inevitable that certain requirements are met by supplementary adjustment processes.

Generally, this adjustment process is carried out by bending or compressing the parts or by adjusting specifically provided adjustment elements (clamping devices, removable screw devices and wedge devices, screw fasteners with slotted holes).

A contactless automatic adjustment method for precision machining equipment, especially contact springs, has been published as a patent application published in the Federal Republic of Germany.
It is described and illustrated in the publication No. 2918100. According to this method, a constant warpage is produced in the area requiring adjustment by controlled localized heating, for example by a force-free laser beam. however,
Adjustment in both directions is only possible by laser projection on both sides.

The object of the present invention is to further improve the method defined at the beginning and to provide an adjustment method that allows correction in both directions even when only one side of the component to be adjusted is heated. The purpose is to make the spring end subject to a force acting in the corresponding direction for adjustment in both directions, in combination with local unilateral heating or local melting, for example by a laser beam. It will be achieved.

An essential advantage of the invention is that by mechanical construction even relay parts that can be illuminated from only one side can be adjusted. Adjustment methods that are adjustable in both directions are better than those that only work in one direction because they do not require 100% adjustment of all parts.

An embodiment of the present invention for adjusting contact springs will be explained with reference to FIGS. 2 and 3. FIG.

In the figure, a contact spring fixed on one side in a holding device 2 is designated with reference numeral 1. The arrows schematically indicate the direction of the laser beam 3 on one side. In FIG. 2, a force P is acting on the free end of the spring 1. According to FIG. 3, the free end of the spring 1 is pressed by a stop 4. Broken line 5
shows the displacement of the spring due to the laser beam alone.

Adjustment by the laser beam 3 always results in a displacement only in the direction of the irradiated laser beam. If a further force P (FIG. 2) is applied, the upward displacement is weakened or the predetermined amount of force P is reversed into a downward displacement. In that case, if an additional force acts opposite to the action in the direction of the beam, the displacement will be strengthened.
For example, a stop 4 (FIG. 3) or an already existing counter contact can be used as an additional force. However, the force can also be applied by force transmission devices such as pressure gauges, spring scales, etc. Depending on the force and stroke readings, the laser power or laser energy, the point of action of the laser, the magnitude of the additional force and the point of application of the additional force can be varied and therefore automated in the above manner. is possible. Combinations of these selection points are also possible.

The adjustment process can be carried out iteratively, for example by mostly fumbling to a desired value. The measurements need not be taken at the adjusted position of the part.

Depending on the various geometries of the treated heat-treated or melted regions, such as overlapping melted regions, across the spring, along the spring edges, or any other melted region, the spring Deformation of various strengths can occur.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram showing a conventional contact spring adjustment method, FIG. 2 is an explanatory diagram showing one embodiment of the present invention, and FIG. 3 is an explanatory diagram showing another embodiment of the present invention. 1...Contact spring, 2...Holding device, 3...Laser beam, 4...Stopper, 5...Displacement of spring only by laser beam.

Claims (1)

[Claims] 1. A method for adjusting a leaf spring-like component fixed on one side by locally heating one side and displacing the free end of the spring, for example by locally heating the other side with a laser beam 3. A method for adjusting a leaf spring-like part, characterized in that, in combination with heating or local melting on one side, the spring end is subjected to a force P acting in the corresponding direction for adjustment in both directions. 2. Method according to claim 1, characterized in that the force P is brought about by a contact force or a preload of a leaf spring-like part. 3. The method according to claim 1 or 2, characterized in that force measurement and stroke measurement are performed in order to automate the process. 4. The method according to claim 1, characterized in that the magnitude of the displacement is changed by selecting the laser projection point or the application point of the additional force.