JPH0375564U - - Google Patents
Info
- Publication number
- JPH0375564U JPH0375564U JP13540389U JP13540389U JPH0375564U JP H0375564 U JPH0375564 U JP H0375564U JP 13540389 U JP13540389 U JP 13540389U JP 13540389 U JP13540389 U JP 13540389U JP H0375564 U JPH0375564 U JP H0375564U
- Authority
- JP
- Japan
- Prior art keywords
- mount device
- surface mount
- substrate
- thermally conductive
- conductive filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011231 conductive filler Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13540389U JPH0375564U (un) | 1989-11-24 | 1989-11-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13540389U JPH0375564U (un) | 1989-11-24 | 1989-11-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0375564U true JPH0375564U (un) | 1991-07-29 |
Family
ID=31682673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13540389U Pending JPH0375564U (un) | 1989-11-24 | 1989-11-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0375564U (un) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003098967A (ja) * | 2001-09-26 | 2003-04-04 | Srl Inc | プライバシー保護対応検体容器識別ラベル |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5415172A (en) * | 1977-07-07 | 1979-02-03 | Fujitsu Ltd | Way of fixing electronic parts |
| JPS5921093A (ja) * | 1982-07-27 | 1984-02-02 | 富士ゼロックス株式会社 | リ−ドレスチツプキヤリアの取付方法 |
| JPS6476799A (en) * | 1987-09-17 | 1989-03-22 | Fujitsu Ltd | Method of controlling packaging thickness of heat conductive adhesive |
-
1989
- 1989-11-24 JP JP13540389U patent/JPH0375564U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5415172A (en) * | 1977-07-07 | 1979-02-03 | Fujitsu Ltd | Way of fixing electronic parts |
| JPS5921093A (ja) * | 1982-07-27 | 1984-02-02 | 富士ゼロックス株式会社 | リ−ドレスチツプキヤリアの取付方法 |
| JPS6476799A (en) * | 1987-09-17 | 1989-03-22 | Fujitsu Ltd | Method of controlling packaging thickness of heat conductive adhesive |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003098967A (ja) * | 2001-09-26 | 2003-04-04 | Srl Inc | プライバシー保護対応検体容器識別ラベル |