JPH0375239A - Sealing material - Google Patents
Sealing materialInfo
- Publication number
- JPH0375239A JPH0375239A JP20987489A JP20987489A JPH0375239A JP H0375239 A JPH0375239 A JP H0375239A JP 20987489 A JP20987489 A JP 20987489A JP 20987489 A JP20987489 A JP 20987489A JP H0375239 A JPH0375239 A JP H0375239A
- Authority
- JP
- Japan
- Prior art keywords
- filler
- spherical
- alumina
- sealing material
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003566 sealing material Substances 0.000 title claims abstract description 19
- 239000000945 filler Substances 0.000 claims abstract description 48
- 239000011521 glass Substances 0.000 claims abstract description 23
- 238000002844 melting Methods 0.000 claims abstract description 15
- 238000002156 mixing Methods 0.000 claims abstract description 6
- 239000002245 particle Substances 0.000 claims description 20
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 18
- 230000008018 melting Effects 0.000 abstract description 13
- 238000007789 sealing Methods 0.000 abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000843 powder Substances 0.000 abstract description 6
- 230000007704 transition Effects 0.000 abstract description 4
- 239000000377 silicon dioxide Substances 0.000 abstract description 3
- 229910052593 corundum Inorganic materials 0.000 abstract description 2
- 239000000155 melt Substances 0.000 abstract description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract description 2
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 230000006866 deterioration Effects 0.000 abstract 1
- 238000010791 quenching Methods 0.000 abstract 1
- 230000000171 quenching effect Effects 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 229910052845 zircon Inorganic materials 0.000 description 7
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 7
- 229910052878 cordierite Inorganic materials 0.000 description 6
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000005357 flat glass Substances 0.000 description 3
- 238000005469 granulation Methods 0.000 description 2
- 230000003179 granulation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 229910000174 eucryptite Inorganic materials 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 229910052844 willemite Inorganic materials 0.000 description 1
Landscapes
- Glass Compositions (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は低融点ガラスとフィラーとを混合してなり、Ｉ
Ｃセラミックパッケージ、螢光表示管、ＣＲＴバルブ等
の電子部品を封着するのに好適な封着材料に関するもの
である。[Detailed description of the invention] [Industrial application field] The present invention is made by mixing a low melting point glass and a filler,
The present invention relates to a sealing material suitable for sealing electronic components such as C ceramic packages, fluorescent display tubes, and CRT bulbs.
［従来の技術］
従来よりＩＣセラミックパッケージ等の電子部品を封着
する際に使用する低融点ガラスとしては、重量百分率で
Ｐｂ０４Ｇ−９０％、Ｂ２０．８〜１５％からなるＰｂ
Ｏ−Ｂ２０ａ系ガラス、ＰｂＯ８５〜８５％、ＺｎＯＯ
；５〜！５％、Ｂ、０．７〜２０％からなるＰｂＯ−Ｚ
ｎＯ−Ｂ２Ｏ，３系ガラス、Ｐｂ０４０〜８０％、８２
０３８〜２０％、５ｉ０２５〜４５％からなるＰｂ０Ｊ
Ｑ０３−ＳｉＯＱ系ガラスが知られている。[Prior Art] Conventionally, low melting point glass used for sealing electronic components such as IC ceramic packages is Pb, which is composed of Pb04G-90% and B20.8 to 15% by weight percentage.
O-B20a glass, PbO85-85%, ZnOO
;5~! PbO-Z consisting of 5%, B, 0.7-20%
nO-B2O, 3-based glass, Pb040-80%, 82
Pb0J consisting of 038~20%, 5i025~45%
Q03-SiOQ glass is known.
一般にこれらの低融点ガラスの熱膨張係数は約１００Ｘ
ＩＯ−’／℃であり、これらを熱膨張係数が４０〜８０
Ｘ１０− ’／℃の被封着物と封着すると低融点ガラス
に大きな応力が生じ、クラックや割れの原因となるため
ガラスに低膨張性のフィラーを混合して熱膨張係数を被
封着物のそれに合わした封着材料が主に用いられている
。Generally, the coefficient of thermal expansion of these low melting point glasses is about 100X
IO-'/℃, and these have thermal expansion coefficients of 40 to 80.
When sealed with an object having a temperature of Combined sealing materials are mainly used.
この低膨張性のフィラーとしては、各種の物質が存在し
、通常チタン酸鉛、ウイレマイト、コーディエライト、
β−ユークリプタイト、ジルコン、酸化錫、ムライト、
アルミナ、ジルコニア等のセラミックの微粉砕物が使用
され、その含有量が多くなるほど、あるいはその粒径が
大きくなるほど封着材料の熱膨張係数は低下する。Various materials exist as this low-expansion filler, and are usually lead titanate, willemite, cordierite,
β-eucryptite, zircon, tin oxide, mullite,
Finely pulverized ceramic such as alumina or zirconia is used, and the larger the content or the larger the particle size, the lower the thermal expansion coefficient of the sealing material.
［発明が解決しようとする問題点コ
先記したようにフィラーの含有量を多くしたり、粒径を
大きくするほど封着材料の熱膨張係数は低下するが、そ
れに反比例して封着材料の流動性が悪くなるという問題
が生じる。封着材料の流動性が悪くなるということは、
被封着物を低温で短時間に封着できなくなるということ
であり、各種用途に要求される封着条件を満足できなく
なる恐れが生じる。[Problems to be solved by the invention] As mentioned earlier, the larger the filler content or the larger the particle size, the lower the thermal expansion coefficient of the sealing material. A problem arises in that liquidity deteriorates. Poor fluidity of the sealing material means that
This means that the objects to be sealed cannot be sealed at low temperatures in a short time, and there is a risk that the sealing conditions required for various uses may not be satisfied.
すなわち、例えば半導体素子をＩＣセラ主ツクパッケー
ジに実装した後パッケージの封着を高温下で長時間かけ
て行うと半導体素子の特性劣化を招きやすく歩留りが悪
くなる等の問題が生じ、そのためできるだけ低い温度で
短時間に、具体的には４３０℃以下の温度で１０分間以
内に封着できることが要求される。That is, for example, if a semiconductor element is mounted on an IC cell-based package and the package is sealed for a long time at high temperatures, the characteristics of the semiconductor element may deteriorate, resulting in poor yield. It is required that the sealing can be performed at a high temperature in a short time, specifically within 10 minutes at a temperature of 430° C. or lower.
本発明の目的は、フィラーの含有量を多くしたり、ある
いは粒径を大きくしても従来のフィラーを用いた場合に
比較して流動性の低下が抑制されるため低温で短時間に
封着可能な封着材料を提供することである。The purpose of the present invention is that even if the filler content is increased or the particle size is increased, the decrease in fluidity is suppressed compared to when conventional fillers are used, so sealing can be achieved at low temperatures in a short time. The object of the present invention is to provide a possible sealing material.
［問題点を解決するための手段］
本発明の封着材料は低融点ガラスとフィラーを混合して
なる封着材料において、該フィラーの形状が球形であり
、且つ平均粒径が３〜６０μであることを特徴とする。[Means for Solving the Problems] The sealing material of the present invention is a sealing material made by mixing low melting point glass and a filler, in which the filler has a spherical shape and an average particle size of 3 to 60μ. characterized by something.
また本発明において用いるフィラーの製造方法としては
、大きく分けて溶融法と造粒法の２つの方法がある。溶
融法は、フィラー原料の微粉砕物を高温の雰囲気中を通
過させることによって溶融させて、表面張力で球状化さ
せた後、急冷する方法である。また造粒法は、仮焼した
フィラー原料を球状になるように造粒した後、焼成する
方法である。Furthermore, there are two main methods for producing the filler used in the present invention: a melting method and a granulation method. The melting method is a method in which a finely pulverized filler raw material is passed through a high-temperature atmosphere, melted, spheroidized by surface tension, and then rapidly cooled. Furthermore, the granulation method is a method in which a calcined filler raw material is granulated into a spherical shape and then fired.
［作用コ
低融点ガラスとフィラーを混合してなる封着材料が良好
に流動するためには加熱されて粘度の低くなったガラス
の流れに乗ってフィラー粒子が滑らかに動くことが必要
である。しかしながら従来のフィラーは表面が角ばった
微粉砕物であり、そのためガラス中で動きに＜＜、その
結果フィラーの含有量が多くなったり、粒径が大きくな
ると封着材料の流動性が低下する。それに対し本発明に
用いるフィラーはその形状が球形であるためガラス中で
滑らかに動きやすく、含有量が多くなったり、粒径が大
きくなっても封着材料の流動性の低下が抑制される。し
かし、平均粒径が６０μ以上になると封着材料の機械的
強度を向上させる効果が小さくなり、また平均粒径が３
μ以下になるとガラスに溶は込みやすくなって先記した
形状が球形であることによる効果が得られず、逆に流動
性が悪くなる。[Function] In order for the sealing material made by mixing low melting point glass and filler to flow well, it is necessary that the filler particles move smoothly along with the flow of the heated glass whose viscosity has been lowered. However, conventional fillers are finely pulverized materials with angular surfaces, and therefore they do not move easily in the glass.As a result, when the filler content increases or the particle size increases, the fluidity of the sealing material decreases. On the other hand, since the filler used in the present invention has a spherical shape, it moves smoothly in the glass, and even if the content increases or the particle size increases, the decrease in fluidity of the sealing material is suppressed. However, when the average particle size exceeds 60 μm, the effect of improving the mechanical strength of the sealing material becomes small;
When it is less than μ, the melt tends to penetrate into the glass, and the above-mentioned effect of the spherical shape cannot be obtained, and on the contrary, the fluidity deteriorates.
尚、本発明のフィラーは、必ずしも真球である必要はな
く、表面が角ぼっていない限り先記した作用が生じるの
で使用可能である。また本発明のフィラーは、従来のセ
ラミック微粉砕物からなるとフィラーと併用することも
可能である。Note that the filler of the present invention does not necessarily have to be a true sphere, and can be used as long as the surface is not rounded, as the above-described effect will occur. Furthermore, the filler of the present invention can be used in combination with a conventional filler made of a finely pulverized ceramic material.
［実施例］ 以下本発明の封着材料を実施例に基づいて説明する。[Example] The sealing material of the present invention will be described below based on Examples.
実施例１
まず電気溶融したアルミナを高温の雰囲気中を通過させ
ることによって再溶融して球形にした後、。Example 1 First, electrically melted alumina was remelted into a spherical shape by passing through a high temperature atmosphere.
急冷して平均粒径が２５μの球状アルミナフィラーを作
製した。一方比較のため電気溶融アルミナをボールミル
で微粉砕して平均粒径２５μの粒子からなるアルミナフ
ィラーを作製した。A spherical alumina filler having an average particle size of 25 μm was produced by rapid cooling. On the other hand, for comparison, an alumina filler consisting of particles having an average particle size of 25 μm was prepared by finely pulverizing electrically fused alumina using a ball mill.
次に先記のように作製した２種のアルミナフィラーの各
々を４０体積％と低融点ガラス粉末（重量百分率でＰｂ
０８５．３％、８２０３１２．７％、５１０ｚ １．０
％Ａｌ２Ｏ３１，０％、転移点３１０℃、３０〜２５０
℃における熱膨張係数ｏｏｘｔｏ−’／℃） ８０体積
Ｖヲ混合１．、この混合物の真比重に相当するグラム数
の試料を金型成形して外径２０ｍａ＋、高さ５ｍｍのボ
タンを作製し、このボタンを板ガラス（３０〜２５０℃
における熱膨張係数８０Ｘ１０−’／”Ｃ）の上に載せ
て電気炉内で４５０℃、１０分間の条件で加熱した。Next, 40% by volume of each of the two types of alumina fillers prepared as described above and low melting point glass powder (Pb in weight percentage) were added.
085.3%, 820312.7%, 510z 1.0
%Al2O3 1,0%, transition point 310℃, 30-250
Thermal expansion coefficient at °C ooxto-'/°C) 80 volume V mixed 1. A sample weighing in grams corresponding to the true specific gravity of this mixture was molded into a button with an outer diameter of 20 ma+ and a height of 5 mm.
It was placed on a substrate having a thermal expansion coefficient of 80 x 10-'/''C) and heated in an electric furnace at 450°C for 10 minutes.
その結果、球状アルミナフィラーを混合した試料ボタン
は外径が２８ｍｍ程度になるまで流動したが、一方ボー
ルミルで粉砕したアルミナフィラーを混合した試料ボタ
ンは外径が２１ｍｍ程度になるまでしか流動せず、従っ
て球状アルミナフィラーを用いる方が流動性に優れてい
ることがわかった。As a result, the sample button mixed with spherical alumina filler flowed until the outer diameter was about 28 mm, while the sample button mixed with alumina filler crushed by a ball mill only flowed until the outer diameter became about 21 mm. Therefore, it was found that the use of spherical alumina filler has superior fluidity.
実施例２
まずＺｒ０Ｑ１１ｉ５．８％、５ｉ０２３２．３％、Ｆ
ｅａ０３ Ｌ、９％になるようにジルコニア、シリカ、
酸化第２鉄の各原料を配合し、１４５０℃で５時間仮焼
した後、平均粒径が３μ程度になるように微粉砕した。Example 2 First, Zr0Q11i5.8%, 5i0232.3%, F
ea03 L, zirconia, silica, to 9%
The raw materials for ferric oxide were mixed, calcined at 1450°C for 5 hours, and then finely ground to have an average particle size of about 3 μm.
この微粉砕物にポリエチレングリコールの１０％溶液を
添加してスラリー状にし、スプレードライヤーによって
平均粒径が１２μの球状になるように造粒した後、この
造粒物を１４５０℃で１８時間焼成することによって平
均粒径がｌＯμの球状のジルコンフィラーを作製した。A 10% solution of polyethylene glycol is added to this finely pulverized material to form a slurry, which is then granulated using a spray dryer into spheres with an average particle size of 12 μm.The granulated material is then baked at 1450°C for 18 hours. As a result, spherical zircon fillers with an average particle size of 1Oμ were produced.
一方比較のため先記した微粉砕物をプレス成形した後、
１４５０℃で１６時間加熱し、ボールミルで微粉砕して
平均粒径が１０μのジルコンフィラーを作製した。On the other hand, for comparison, after press-molding the finely pulverized product mentioned above,
It was heated at 1450° C. for 16 hours and pulverized in a ball mill to produce a zircon filler with an average particle size of 10 μm.
次に先記のように作製した２種のジルコンフィラーの各
々を４０体積％と実施例１で用いた低融点ガラス粉末６
０体積％を混合し、この混合物の真比重に相当するグラ
ム数の試料を金型成形して外径２０＋１１１１１高さ５
ｍｍのボタンを作製し、このボタンを実施例１で用いた
板ガラスの上に載せて電気炉内で４５０℃、１０分間の
条件で加熱した。Next, 40% by volume of each of the two types of zircon fillers prepared as described above and the low melting point glass powder 6 used in Example 1 were added.
0% by volume and molded a sample with a number of grams corresponding to the true specific gravity of this mixture using a mold to obtain an outer diameter of 20 + 11111 and a height of 5.
A button with a diameter of 1 mm was prepared, placed on the plate glass used in Example 1, and heated in an electric furnace at 450° C. for 10 minutes.
その結果、球状ジルコンフィラーを混合した試料ボタン
は、外径が２８ｍｍ程度になるまで流動したが、一方ボ
ールミルで粉砕したジルコンフィラーを混合した試料ボ
タンは外径が２４ｍｍ程度になるまでしか流動せず、従
って球状ジルコンフィラーを用いる方が流動性に優れて
いることがわかった。As a result, the sample button mixed with spherical zircon filler flowed until the outer diameter reached approximately 28 mm, whereas the sample button mixed with zircon filler ground in a ball mill flowed only until the outer diameter reached approximately 24 mm. Therefore, it was found that the use of spherical zircon filler had better fluidity.
実施例３
まず２Ｍｇ０・２Ａ１２０３・５Ｓ１０２の組成のガラ
スになるようにマグネシウム、アルミナ、シリカの各原
料を配合し、１５５０℃で５時間溶融、成形した後、平
均粒径が５μ程度になるように微粉砕した。この微粉砕
物を約１８００℃の高温の雰囲気中を通過させることに
よって球状ガラスとした後、これを１０００℃で１０時
間再加熱することにより結晶化させて平均粒径が５μの
球状のコーディエライトフィラーを作製した。一方比較
のため先記した微粉砕物を１０００℃で１０時間加熱し
て結晶化させて平均粒径が５μのコーディエライトフィ
ラーを作製した。Example 3 First, raw materials of magnesium, alumina, and silica were blended to form a glass with a composition of 2Mg0, 2A1203, and 5S102, and after melting and forming at 1550°C for 5 hours, the glass was made to have an average particle size of about 5μ. Finely ground. This finely pulverized material is made into spherical glass by passing through a high temperature atmosphere of about 1800°C, and then reheated at 1000°C for 10 hours to crystallize it into spherical cordier with an average particle size of 5μ. A light filler was produced. On the other hand, for comparison, the above-mentioned finely pulverized product was heated at 1000° C. for 10 hours to crystallize it, thereby producing a cordierite filler having an average particle size of 5 μm.
次に先記のように作製した２種のコーディエライトフィ
ラーの各々を４０体積％と低融点ガラス粉末（重量百分
率でＰｂＯ８４，３％、ＺｎＯ２，８％、Ｂ２０３１１
．９％、５ｉｎ２１．０％、転移点３００℃、３０〜２
５０℃における熱膨張係数１１２ＸｌＧ−’／’Ｃ）
８０体積％を混合し、この混合物の真比重に相当するグ
ラム数の試料を金型成形して外径２０ｍｒｘ１高さ５ｒ
ｔｒｍのボタンを作製し、このボタンを実施例１で用い
た板ガラスの上に載せて電気炉内で４５０″Ｇ、 １０
分間の条件で加熱した。Next, 40% by volume of each of the two types of cordierite fillers prepared as described above and low melting point glass powder (weight percentages of PbO84.3%, ZnO2.8%, B20311
．． 9%, 5in21.0%, transition point 300℃, 30~2
Thermal expansion coefficient at 50°C 112XlG-'/'C)
80% by volume was mixed, and a sample of the number of grams corresponding to the true specific gravity of this mixture was molded into a mold with an outer diameter of 20 mr x 1 height of 5 r.
A trm button was made, placed on the plate glass used in Example 1, and heated at 450″G in an electric furnace.
Heated for 1 minute.
その結果、球状コーディエライトフィラーを混合した試
料ボタンは外径が２７ｍｒｘ程度になるまで流動したが
、一方散粉砕物を結晶化させたコーディエライトフィラ
ーを混合した試料ボタンは外径が２２問程度になるまで
した流動せず、従って球状コーディエライトフィラーを
用いる方が流動性に優れていることがわかった。As a result, the sample button mixed with spherical cordierite filler flowed until the outer diameter was about 27 mrx, while the sample button mixed with cordierite filler made by crystallizing the crushed powder had an outer diameter of 22 mrx. It was found that the use of spherical cordierite filler had superior fluidity.
実施例４
実施例１で用いた２種のアルミナフィラーの各々を２５
体積％と結晶性低融点ガラス粉末（重量百分率でＰｂ０
７４．８％、８２０３９．０％、ＺｎＯ１１，９％、Ｓ
ｔｏ、 ２％、ＢａＯ２％、ＺｒＯ２０，５％、転移点
３２０℃、３０〜２５０℃における熱膨張係数１００Ｘ
ＩＯ−’／’Ｃ） ７５体積％を混合し、この混合物の
真比重に相当するグラム数の試料を金型成形して外径２
０ｍｍ、高さ５ｍｍのボタンを作製し、このボタンを実
施例１で用いた板ガラスの上に載せて電気炉内で４５０
℃、３０分間の条件で加熱した。Example 4 Each of the two types of alumina fillers used in Example 1 was
Volume % and crystalline low melting point glass powder (weight percentage Pb0
74.8%, 82039.0%, ZnO11.9%, S
to, 2%, BaO2%, ZrO20.5%, transition point 320℃, thermal expansion coefficient 100X at 30-250℃
IO-'/'C) 75% by volume was mixed, and a sample with a number of grams corresponding to the true specific gravity of this mixture was molded to have an outer diameter of 2.
A button with a diameter of 0 mm and a height of 5 mm was made, placed on the plate glass used in Example 1, and heated in an electric furnace for 450 min.
It was heated at ℃ for 30 minutes.
その結果、球状アルミナフィラーを混合した試料ボタン
は外径が２３ｍｍ程度になるまで流動したが、一方ボー
ルミルで粉砕したアルミナフィラーを混合した試料ボタ
ンはほとんど流動せず、従って実施例１と同様球状アル
ミナフィラーを用いる方が流動性に優れていることがわ
かった。As a result, the sample button mixed with spherical alumina filler flowed until the outer diameter reached approximately 23 mm, while the sample button mixed with alumina filler ground by a ball mill hardly flowed. It was found that the use of filler had better fluidity.
［発明の効果コ
以上のように本発明の封着材料は、フィラーの含有量を
多くしたり、あるいは粒径を大きくしても従来のフィラ
ーを用いた場合に比較して流動性の低下が抑制されるた
め低温で短時間に封着可能であり、電子部品の封着材料
として好適である。[Effects of the Invention] As described above, the sealing material of the present invention shows that even if the filler content is increased or the particle size is increased, the fluidity does not decrease compared to when conventional fillers are used. Since it is suppressed, sealing can be performed at low temperatures in a short time, and it is suitable as a sealing material for electronic components.
Claims (1)
において、該フィラーの形状が球形であり、且つ平均粒
径が３〜６０μであることを特徴とする。 封着材料(1) A sealing material made by mixing low-melting glass and a filler, characterized in that the filler has a spherical shape and an average particle size of 3 to 60 μm. Sealing material
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1209874A JP2557326B2 (en) | 1989-08-14 | 1989-08-14 | Sealing material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1209874A JP2557326B2 (en) | 1989-08-14 | 1989-08-14 | Sealing material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0375239A true JPH0375239A (en) | 1991-03-29 |
| JP2557326B2 JP2557326B2 (en) | 1996-11-27 |
Family
ID=16580072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1209874A Expired - Lifetime JP2557326B2 (en) | 1989-08-14 | 1989-08-14 | Sealing material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2557326B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006151774A (en) * | 2004-12-01 | 2006-06-15 | Nippon Electric Glass Co Ltd | Sealing material |
| JP2007042376A (en) * | 2005-08-02 | 2007-02-15 | Futaba Corp | Airtight container |
| JP2007297249A (en) * | 2006-05-01 | 2007-11-15 | Taiyo Nippon Sanso Corp | Glass frit |
| JP2009062263A (en) * | 2007-08-10 | 2009-03-26 | Nippon Electric Glass Co Ltd | Sealing material, and a method of manufacturing the same |
| JP2009155200A (en) * | 2007-12-06 | 2009-07-16 | Nippon Electric Glass Co Ltd | Sealing material |
| CN104326678A (en) * | 2014-10-16 | 2015-02-04 | 中国建筑材料科学研究总院 | Refractory filler particle and preparation method thereof |
| JP2020011851A (en) * | 2018-07-13 | 2020-01-23 | 日本電気硝子株式会社 | Sealing material |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61261233A (en) * | 1985-05-15 | 1986-11-19 | Mitsubishi Electric Corp | Sealing low-melting glass composition |
| JPS6395137A (en) * | 1986-10-06 | 1988-04-26 | Nippon Electric Glass Co Ltd | Sealing glass having low-melting point |
| JPS63310750A (en) * | 1987-06-11 | 1988-12-19 | Asahi Glass Co Ltd | Sealing composition |
| JPS6476935A (en) * | 1987-09-17 | 1989-03-23 | Asahi Glass Co Ltd | Resin composition for sealing semiconductor device |
-
1989
- 1989-08-14 JP JP1209874A patent/JP2557326B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61261233A (en) * | 1985-05-15 | 1986-11-19 | Mitsubishi Electric Corp | Sealing low-melting glass composition |
| JPS6395137A (en) * | 1986-10-06 | 1988-04-26 | Nippon Electric Glass Co Ltd | Sealing glass having low-melting point |
| JPS63310750A (en) * | 1987-06-11 | 1988-12-19 | Asahi Glass Co Ltd | Sealing composition |
| JPS6476935A (en) * | 1987-09-17 | 1989-03-23 | Asahi Glass Co Ltd | Resin composition for sealing semiconductor device |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006151774A (en) * | 2004-12-01 | 2006-06-15 | Nippon Electric Glass Co Ltd | Sealing material |
| JP4692918B2 (en) * | 2004-12-01 | 2011-06-01 | 日本電気硝子株式会社 | Sealing material |
| JP2007042376A (en) * | 2005-08-02 | 2007-02-15 | Futaba Corp | Airtight container |
| JP2007297249A (en) * | 2006-05-01 | 2007-11-15 | Taiyo Nippon Sanso Corp | Glass frit |
| JP2009062263A (en) * | 2007-08-10 | 2009-03-26 | Nippon Electric Glass Co Ltd | Sealing material, and a method of manufacturing the same |
| JP2009155200A (en) * | 2007-12-06 | 2009-07-16 | Nippon Electric Glass Co Ltd | Sealing material |
| CN104326678A (en) * | 2014-10-16 | 2015-02-04 | 中国建筑材料科学研究总院 | Refractory filler particle and preparation method thereof |
| JP2020011851A (en) * | 2018-07-13 | 2020-01-23 | 日本電気硝子株式会社 | Sealing material |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2557326B2 (en) | 1996-11-27 |
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