JPS6476935A - Resin composition for sealing semiconductor device - Google Patents
Resin composition for sealing semiconductor deviceInfo
- Publication number
- JPS6476935A JPS6476935A JP23096587A JP23096587A JPS6476935A JP S6476935 A JPS6476935 A JP S6476935A JP 23096587 A JP23096587 A JP 23096587A JP 23096587 A JP23096587 A JP 23096587A JP S6476935 A JPS6476935 A JP S6476935A
- Authority
- JP
- Japan
- Prior art keywords
- tio2
- glass particles
- resin composition
- sio2
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Glass Compositions (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To obtain a resin composition of high moldability and low expansion, by mixing glass particles which is composed of SiO2 and TiO2 to a resin. CONSTITUTION:The subject resin composition for sealing semiconductor devices is composed of glass particles containing SiO2 and TiO2 and of a resin. The glass particles preferably contains the both oxides more than 99.9mol.%, and the remaining 0.1mol.% may be oxides of alkaline earth metals such as Mg, Ca, or the like, P2O5, B2O3, Al2O3, GeO2, etc. Especially preferable composition is 90-99mol.% of SiO2 and 1-10mol.% of TiO2. When the content of TiO2 exceeds 10mol.%, devitrification by TiO2 takes place and the thermal expansion undesirably tends to become large. The shape of the glass particles preferably is a perfect sphere as much as possible, so that the flowability may not lowered, even when large amounts of them are used in the composition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23096587A JPS6476935A (en) | 1987-09-17 | 1987-09-17 | Resin composition for sealing semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23096587A JPS6476935A (en) | 1987-09-17 | 1987-09-17 | Resin composition for sealing semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6476935A true JPS6476935A (en) | 1989-03-23 |
Family
ID=16916097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23096587A Pending JPS6476935A (en) | 1987-09-17 | 1987-09-17 | Resin composition for sealing semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6476935A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0375239A (en) * | 1989-08-14 | 1991-03-29 | Nippon Electric Glass Co Ltd | Sealing material |
JPH03232741A (en) * | 1990-02-07 | 1991-10-16 | Shin Etsu Chem Co Ltd | Highly transparent silica-titania glass particle and production thereof |
-
1987
- 1987-09-17 JP JP23096587A patent/JPS6476935A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0375239A (en) * | 1989-08-14 | 1991-03-29 | Nippon Electric Glass Co Ltd | Sealing material |
JPH03232741A (en) * | 1990-02-07 | 1991-10-16 | Shin Etsu Chem Co Ltd | Highly transparent silica-titania glass particle and production thereof |
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