JPH0449497B2 - - Google Patents
Info
- Publication number
- JPH0449497B2 JPH0449497B2 JP16558685A JP16558685A JPH0449497B2 JP H0449497 B2 JPH0449497 B2 JP H0449497B2 JP 16558685 A JP16558685 A JP 16558685A JP 16558685 A JP16558685 A JP 16558685A JP H0449497 B2 JPH0449497 B2 JP H0449497B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- present
- less
- strength
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 21
- 239000000843 powder Substances 0.000 claims description 15
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 13
- 239000002131 composite material Substances 0.000 claims description 12
- 239000002241 glass-ceramic Substances 0.000 claims description 10
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims description 2
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 2
- 229910052593 corundum Inorganic materials 0.000 claims description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 2
- 239000000463 material Substances 0.000 description 9
- 238000010304 firing Methods 0.000 description 8
- 238000005452 bending Methods 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000004017 vitrification Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2214/00—Nature of the non-vitreous component
- C03C2214/04—Particles; Flakes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Dispersion Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
Description
産業上の利用分野
本発明はガラスセラミツク複合材、より具体的
にはエレクトロニクスにおける回路形成用絶縁
材、パツケージング材、基板材等として広範な用
途が期待されるガラスセラミツク複合材に関する
ものである。
従来技術
従来より回路形成用絶縁材、パツケージング材
及び基板材としてはアルミナセラミツク、プラス
チツク、ガラス等が主に用いられている。しかし
ながらアルミナセラミツクは強度、熱伝導性、機
密性に優れているものの必要な特定形状にするた
めには1600℃以上の高温で焼成しなければならず
生産コストが高くなりがちである。またプラスチ
ツクもしくはこれに無機物粒子をフイラーとして
添加した複合材は、低い焼成温度で必要な特定形
状に成形しやすいが、セラミツクやガラスに比べ
気密性に劣り、高い信頼性が要求される用途には
適さない。更にガラスは、特定形状の成形しやす
く気密性にも優れ、金属やセラミツク等に融着さ
せることができるが、その曲げ強度はたかだか
1000Kg／cm2で機械的強度が低いという問題があ
る。
発明の目的
本発明は、上記事情に鑑みなされたもので、
1000℃以下の低温焼成で必要な特定形状に成形で
きるため生産コストが安価で且つ高強度を有する
ガラスセラミツク複合材を提供することを目的と
するものである。
発明の構成
本発明のガラスセラミツク複合材は重量百分率
で、SiO2 40〜65％、CaO ５〜15％、PbO 10
〜25％、MgO 0.5〜10％、Na2Ｏ １〜10％、
K2Ｏ １〜10％、Al2O3 ０〜20％、B2O3 ０
〜10％、ZnO ０〜５％の組成を有するガラス粉
末35〜60％と、アルミナ粉末40〜65％からなるこ
とを特徴とする。
本発明のガラスセラミツク複合材を構成するガ
ラス粉末、アルミナ粉末について組成範囲を上記
のように限定したのは次の理由による。
本発明の複合材の強度を高くするには、ガラス
を結晶化させる方が好ましいが、SiO2の含量が
40％以下の場合は、ガラスの析出結晶量が少なく
なり、充分な強度の材料が得られない。65％以上
の場合は、ガラスの溶融性が悪くなると共に、軟
化点が高くなり、低温焼成が困難になる。CaO
は、フラツクス剤として含有され、その含量が５
％以下の場合はガラス化が困難になり、15％以上
の場合は、結晶化が強くなりすぎて緻密な材料が
得られない。PbO含量は、フラツクス剤として含
有され、その含量が10％以下の場合は、ガラス化
が困難になり、25％以上の場合、軟化点が低くな
りすぎる。MgO含量が0.5％以下の場合は、緻密
な材料が得られず、10％以上の場合はガラスの溶
融性が悪くなる。Na2Ｏは、フラツクス剤として
含有され、その含量が１％以下の場合は、焼成時
にガラスの軟化温度が高くなつて成形が困難にな
り、10％以上の場合は、製造した材料の絶縁性が
低下する。K2Ｏは、フラツクス剤として含有さ
れ、その含量が１％以下の場合は、ガラス化が困
難になり、10％以上の場合は、ガラスの結晶化を
抑制する。Al2O3含量が20％以上の場合は、ガラ
スの溶融性が困難になると共に焼成時にガラスの
軟化温度が高くなる。B2O3含量が10％以上の場
合は、焼成時にB2O3が溶出し、回路材料として
使用する場合、導体や抵抗体等と反応するので好
ましくない。ZnOは、ガラスの軟化温度を調整す
る効果を有するが、その含量が５％以上の場合
は、ガラスの結晶化を抑制する。
本発明のガラスセラミツク複合材においては、
先記ガラス粉末の35〜60％に対し、アルミナ粉末
を40〜65％混合することを特徴とするが、アルミ
ナ粉末が40％以下の場合は充分な強度が得られな
くなり、65％以上の場合は緻密な材料が得られず
強度が低下する。
また本発明のガラスセラミツク複合材における
ガラス粉末及びアルミナ粉末の粒度は、20μ以下
であることが好ましい。すなわち両者の粒度が
20μ以上である場合は、軟化温度が高くなると共
に両者の融着性が悪くなり、緻密な焼結体が得ら
れず強度が低下する。
実施例
次に本発明のガラスセラミツク複合材の実施例
を示す。次の表は本発明のガラス粉末組成、ガラ
ス粉末とアルミナ粉末の割合、焼成温度、抗折強
度を示したものである。
INDUSTRIAL APPLICATION FIELD The present invention relates to a glass-ceramic composite material, and more specifically to a glass-ceramic composite material that is expected to have a wide range of uses as insulating materials for circuit formation, packaging materials, substrate materials, etc. in electronics. Prior Art Conventionally, alumina ceramics, plastics, glass, etc. have been mainly used as insulating materials, packaging materials, and substrate materials for circuit formation. However, although alumina ceramic has excellent strength, thermal conductivity, and airtightness, it must be fired at a high temperature of 1,600°C or higher in order to form the required specific shape, which tends to increase production costs. Furthermore, plastics or composite materials made by adding inorganic particles to them as fillers are easy to mold into the required specific shape at low firing temperatures, but they are less airtight than ceramics or glass, and are not suitable for applications that require high reliability. Not suitable. Furthermore, glass is easy to form into specific shapes, has excellent airtightness, and can be fused to metals, ceramics, etc., but its bending strength is limited at most.
There is a problem that the mechanical strength is low at 1000Kg/cm 2 . Purpose of the invention The present invention was made in view of the above circumstances, and
The purpose of the present invention is to provide a glass-ceramic composite material that is low in production cost and has high strength because it can be formed into a specific shape required by low-temperature firing at 1000°C or less. Structure of the Invention The glass-ceramic composite of the present invention contains, in weight percentages, SiO 2 40-65%, CaO 5-15%, PbO 10
~25%, MgO 0.5-10%, Na2O 1-10%,
K2O 1-10%, Al2O3 0-20 %, B2O3 0
-10%, ZnO 0-5%, 35-60% glass powder, and 40-65% alumina powder. The composition ranges of the glass powder and alumina powder constituting the glass-ceramic composite of the present invention are limited as described above for the following reason. In order to increase the strength of the composite material of the present invention, it is preferable to crystallize the glass, but if the content of SiO2 is
If it is less than 40%, the amount of precipitated glass crystals will be small and a material with sufficient strength will not be obtained. If it is more than 65%, the melting properties of the glass will be poor and the softening point will be high, making low temperature firing difficult. CaO
is contained as a fluxing agent, and its content is 5
If it is less than 15%, vitrification becomes difficult, and if it is more than 15%, crystallization becomes too strong and a dense material cannot be obtained. The PbO content is contained as a fluxing agent, and if the content is less than 10%, vitrification becomes difficult, and if it is more than 25%, the softening point becomes too low. When the MgO content is less than 0.5%, a dense material cannot be obtained, and when it is more than 10%, the meltability of the glass deteriorates. Na 2 O is contained as a fluxing agent, and if its content is less than 1%, the softening temperature of the glass will increase during firing, making it difficult to mold, and if it is more than 10%, it will affect the insulation properties of the manufactured material. decreases. K 2 O is contained as a fluxing agent, and if the content is less than 1%, vitrification becomes difficult, and if it is more than 10%, it suppresses crystallization of the glass. If the Al 2 O 3 content is 20% or more, the meltability of the glass becomes difficult and the softening temperature of the glass increases during firing. If the B 2 O 3 content is 10% or more, B 2 O 3 will be eluted during firing and will react with conductors, resistors, etc. when used as a circuit material, which is not preferable. ZnO has the effect of adjusting the softening temperature of glass, but when its content is 5% or more, it suppresses crystallization of glass. In the glass-ceramic composite material of the present invention,
It is characterized by mixing 40-65% of alumina powder with 35-60% of the glass powder mentioned above, but if the alumina powder is less than 40%, sufficient strength will not be obtained, and if it is more than 65% In this case, a dense material cannot be obtained and the strength decreases. Further, the particle size of the glass powder and alumina powder in the glass-ceramic composite material of the present invention is preferably 20 μm or less. In other words, the granularity of both is
If it is 20μ or more, the softening temperature increases and the fusion properties between the two deteriorate, making it impossible to obtain a dense sintered body and resulting in a decrease in strength. Examples Next, examples of the glass-ceramic composite material of the present invention will be shown. The following table shows the composition of the glass powder, the ratio of glass powder to alumina powder, firing temperature, and bending strength of the present invention.
【表】
表のNo.１〜８の試料は次のように調製した。
試料No.１〜８の各ガラス組成になるように調合
した原料バツチを白金ルツボに入れ1500〜1600℃
で２〜３時間溶融、水砕し、さらにアルミナボー
ルミルで粉砕する。次に分級して適当な粒径に
し、それをアルミナ粉末と混合した後、金型に入
れ、５×５×50mmの棒状にプレス成形する。その
後850〜950℃で２時間焼成し、棒状焼成物を作製
し、各々抗折強度について測定した。
この結果、本発明品が850〜950℃の低温で焼成
でき抗折強度も2250〜3000Kg／cm2と高強度である
ことがわかる。
尚、本発明における抗折強度は、棒状焼成物を
周知の三点荷重方式によつて測定した。
発明の効果
以上のように本発明のガラスセラミツク複合材
は、焼成温度が1000℃以下と低いため生産コスト
を安くすることができ、且つ高い強度を有するた
め、回路形成用絶縁材、パツケージング材、基板
材等として各種広範な用途に利用できる。[Table] Samples No. 1 to 8 in the table were prepared as follows. Raw material batches prepared to have the respective glass compositions of sample Nos. 1 to 8 were placed in a platinum crucible at 1500 to 1600°C.
The mixture is melted for 2 to 3 hours, pulverized, and further pulverized in an alumina ball mill. Next, the particles are classified to a suitable particle size, mixed with alumina powder, placed in a mold, and press-formed into a rod shape of 5 x 5 x 50 mm. Thereafter, it was fired at 850 to 950°C for 2 hours to produce rod-shaped fired products, and each was measured for bending strength. The results show that the product of the present invention can be fired at a low temperature of 850 to 950°C and has a high bending strength of 2250 to 3000 Kg/cm 2 . Incidentally, the bending strength in the present invention was measured by a well-known three-point loading method on a rod-shaped fired product. Effects of the Invention As described above, the glass-ceramic composite material of the present invention has a low firing temperature of 1000°C or less, which can reduce production costs, and has high strength, so it can be used as an insulating material for circuit formation, and as a packaging material. It can be used in a wide variety of applications, such as as a substrate material.
Claims (1)
15％、PbO 10〜25％、MgO 0.5〜10％、Na2Ｏ
１〜10％、K2Ｏ １〜10％、Al2O3 ０〜20
％、B2O3 ０〜10％、ZnO ０〜５％の組成を有
するガラス粉末35〜60％と、アルミナ粉末40〜65
％からなるガラスセラミツク複合材。1 In weight percentage, SiO 2 40-65%, CaO 5-
15%, PbO 10-25%, MgO 0.5-10%, Na2O
1-10%, K2O 1-10%, Al2O3 0-20
%, B2O3 0-10 %, ZnO 0-5% glass powder 35-60% and alumina powder 40-65%.
Glass-ceramic composite material consisting of %.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16558685A JPS6227353A (en) | 1985-07-25 | 1985-07-25 | Glass ceramic composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16558685A JPS6227353A (en) | 1985-07-25 | 1985-07-25 | Glass ceramic composite material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6227353A JPS6227353A (en) | 1987-02-05 |
| JPH0449497B2 true JPH0449497B2 (en) | 1992-08-11 |
Family
ID=15815169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16558685A Granted JPS6227353A (en) | 1985-07-25 | 1985-07-25 | Glass ceramic composite material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6227353A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4643778B2 (en) * | 1999-08-04 | 2011-03-02 | 日本特殊陶業株式会社 | Circuit board using glass ceramic composition and manufacturing method thereof |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2713376B2 (en) * | 1987-06-09 | 1998-02-16 | 旭硝子株式会社 | Glass composition for insulating layer |
| JP2800176B2 (en) * | 1987-08-18 | 1998-09-21 | 旭硝子株式会社 | Glass ceramic composition |
| JPH05299916A (en) * | 1992-04-21 | 1993-11-12 | Sumitomo Special Metals Co Ltd | Strip line resonator |
| JP3860336B2 (en) * | 1998-04-28 | 2006-12-20 | 日本特殊陶業株式会社 | Glass ceramic composite |
| CN102515539B (en) * | 2011-12-24 | 2013-12-04 | 杭州诺贝尔集团有限公司 | Novel microcrystallite glass-ceramic composite brick and production method thereof |
-
1985
- 1985-07-25 JP JP16558685A patent/JPS6227353A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4643778B2 (en) * | 1999-08-04 | 2011-03-02 | 日本特殊陶業株式会社 | Circuit board using glass ceramic composition and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6227353A (en) | 1987-02-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |