JPH0372376U - - Google Patents
Info
- Publication number
- JPH0372376U JPH0372376U JP13458889U JP13458889U JPH0372376U JP H0372376 U JPH0372376 U JP H0372376U JP 13458889 U JP13458889 U JP 13458889U JP 13458889 U JP13458889 U JP 13458889U JP H0372376 U JPH0372376 U JP H0372376U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- case
- insulating
- case body
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009413 insulation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Description
第１図は断熱ケースのケース本体と蓋の斜視図
、第２図はＩＣ測定箇所の拡大断面図、第３図は
押え板とダミーＩＣ′部分の拡大図である。
１……断熱ケース、２……ケース本体、３……
蓋、４……ソケツト、６……テストボード、７…
…ポゴピン、１４……ばね、１５……押え板、２
０……ヒータ、２４……温度センサ、ＩＣ′……
ダミーのＩＣ、２２……ペルチエ素子。
FIG. 1 is a perspective view of the case body and lid of the heat insulating case, FIG. 2 is an enlarged sectional view of the IC measurement location, and FIG. 3 is an enlarged view of the holding plate and dummy IC' portion. 1...Insulation case, 2...Case body, 3...
Lid, 4...Socket, 6...Test board, 7...
...Pogo pin, 14...Spring, 15...Press plate, 2
0...Heater, 24...Temperature sensor, IC'...
Dummy IC, 22...Peltier element.
Claims (1)
に設けられたＩＣ用のソケツトと、ケース本体の
上方を覆う断熱性の蓋と、蓋の内側に取り付けら
れて各ソケツト上のＩＣを固定する押え部材と、
から成るＩＣの温度試験用断熱ケース。 (2) 押え部材に温度調整手段を組み込んだこと
を特徴とする請求項(1)に記載のＩＣの温度試験
用断熱ケース。 (3) 温度センサを内蔵したダミーＩＣ′を一部
のソケツトに取り付けたことを特徴とする請求項
(1)または(2)に記載のＩＣの温度試験用断熱ケー
ス。[Scope of claim for utility model registration] (1) A heat-insulating case body, an IC socket provided inside the case body, a heat-insulating lid covering the upper part of the case body, and a heat-insulating lid attached to the inside of the lid. a holding member for fixing the IC on each socket;
An insulated case for temperature testing of ICs. (2) The heat-insulating case for IC temperature testing according to claim (1), characterized in that a temperature adjustment means is incorporated in the holding member. (3) A claim characterized in that a dummy IC' with a built-in temperature sensor is attached to some of the sockets.
An insulated case for temperature testing of the IC described in (1) or (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989134588U JPH0738868Y2 (en) | 1989-11-20 | 1989-11-20 | Thermal insulation case for IC temperature test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989134588U JPH0738868Y2 (en) | 1989-11-20 | 1989-11-20 | Thermal insulation case for IC temperature test |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0372376U true JPH0372376U (en) | 1991-07-22 |
| JPH0738868Y2 JPH0738868Y2 (en) | 1995-09-06 |
Family
ID=31681914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989134588U Expired - Fee Related JPH0738868Y2 (en) | 1989-11-20 | 1989-11-20 | Thermal insulation case for IC temperature test |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0738868Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009097968A (en) * | 2007-10-16 | 2009-05-07 | Akim Kk | Apparatus and method for temperature characteristics measurement |
| JP2013130423A (en) * | 2011-12-20 | 2013-07-04 | Sharp Corp | Burn-in device |
| WO2020188792A1 (en) * | 2019-03-20 | 2020-09-24 | 日新ネオ株式会社 | Electronic component testing device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5619767U (en) * | 1979-07-24 | 1981-02-21 | ||
| JPS63115074A (en) * | 1986-10-31 | 1988-05-19 | Mitsubishi Electric Corp | Semiconductor high-temperature acceleration testing device |
-
1989
- 1989-11-20 JP JP1989134588U patent/JPH0738868Y2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5619767U (en) * | 1979-07-24 | 1981-02-21 | ||
| JPS63115074A (en) * | 1986-10-31 | 1988-05-19 | Mitsubishi Electric Corp | Semiconductor high-temperature acceleration testing device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009097968A (en) * | 2007-10-16 | 2009-05-07 | Akim Kk | Apparatus and method for temperature characteristics measurement |
| JP2013130423A (en) * | 2011-12-20 | 2013-07-04 | Sharp Corp | Burn-in device |
| WO2020188792A1 (en) * | 2019-03-20 | 2020-09-24 | 日新ネオ株式会社 | Electronic component testing device |
| WO2020188844A1 (en) * | 2019-03-20 | 2020-09-24 | 日新ネオ株式会社 | Electronic component testing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0738868Y2 (en) | 1995-09-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |