JPH0272984U - - Google Patents
Info
- Publication number
- JPH0272984U JPH0272984U JP15209288U JP15209288U JPH0272984U JP H0272984 U JPH0272984 U JP H0272984U JP 15209288 U JP15209288 U JP 15209288U JP 15209288 U JP15209288 U JP 15209288U JP H0272984 U JPH0272984 U JP H0272984U
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- heat
- high temperature
- temperature test
- dual
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 5
- 230000009977 dual effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Description
第１図はこの考案の一実施例を示すＩＣ加熱器
の断面図、第２図は第１図のＩＣ加熱器を使用し
て高温テストを行う場合の説明図、第３図は従来
の高温テストを行う場合の説明図である。
Ａ…加熱器本体、Ｂ…断熱材、Ｃ…クツシヨン
、Ｄ…止め具、Ｅ…発熱体、Ｆ…熱センサー、Ｇ
…ＩＣ、Ｈ…ソケツト又は実装基板、Ｌ…コント
ロールボツクス、ａ…発熱体の端子、ｂ…熱セン
サーの端子、ｄ…止め具の係止部分。なお、図中
、同一符号は同一、または相当部分を示す。
Figure 1 is a sectional view of an IC heater showing an embodiment of this invention, Figure 2 is an explanatory diagram of a high temperature test using the IC heater of Figure 1, and Figure 3 is a conventional high temperature test. It is an explanatory diagram when performing a test. A...Heating device body, B...Insulating material, C...Cushion, D...Stopper, E...Heating element, F...Heat sensor, G
...IC, H...socket or mounting board, L...control box, a...terminal of heating element, b...terminal of thermal sensor, d...locking part of stopper. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
ンサーを密着させ、発熱体からの熱をＩＣに伝え
、ＩＣの高温テストを実行できるようにしたこと
を特徴とするＩＣ加熱器。 An IC heater characterized in that a heating element and a heat sensor are brought into close contact with the surface of a dual in-line IC, and the heat from the heating element is transmitted to the IC, thereby making it possible to perform a high temperature test on the IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15209288U JPH0272984U (en) | 1988-11-22 | 1988-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15209288U JPH0272984U (en) | 1988-11-22 | 1988-11-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0272984U true JPH0272984U (en) | 1990-06-04 |
Family
ID=31426714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15209288U Pending JPH0272984U (en) | 1988-11-22 | 1988-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0272984U (en) |
-
1988
- 1988-11-22 JP JP15209288U patent/JPH0272984U/ja active Pending