JPH0369242U - - Google Patents
Info
- Publication number
- JPH0369242U JPH0369242U JP13106689U JP13106689U JPH0369242U JP H0369242 U JPH0369242 U JP H0369242U JP 13106689 U JP13106689 U JP 13106689U JP 13106689 U JP13106689 U JP 13106689U JP H0369242 U JPH0369242 U JP H0369242U
- Authority
- JP
- Japan
- Prior art keywords
- support
- solder
- copper
- package
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
Description
第1図、第2図は従来品放熱器の断面を示す。
第3図は本考案による放熱器の断面図、第4図は
その斜面図、第5図はICパツケージに支柱を固
着した使用状態図、第6図はその斜面図を示す。
図中、3……支柱、4……羽根、7……接着剤
。
FIGS. 1 and 2 show cross sections of conventional heat sinks.
FIG. 3 is a sectional view of the heat radiator according to the present invention, FIG. 4 is a perspective view thereof, FIG. 5 is a usage state in which a support is fixed to an IC package, and FIG. 6 is a perspective view thereof. In the figure, 3...post, 4...wing, 7...adhesive.
Claims (1)
材料、又は銅材を使用した羽根を支柱に圧入し、
羽根のツバ部分と支柱部分を半田、銀ロウ等の接
着剤によつて固着して成るICパツケージ用放熱
器。 A material made of aluminum with copper plating or nickel plating, or a blade made of copper material is press-fitted into the support.
A radiator for IC package cages, which is made by fixing the wing part and the support part with an adhesive such as solder or silver solder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13106689U JPH0369242U (en) | 1989-11-13 | 1989-11-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13106689U JPH0369242U (en) | 1989-11-13 | 1989-11-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0369242U true JPH0369242U (en) | 1991-07-09 |
Family
ID=31678594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13106689U Pending JPH0369242U (en) | 1989-11-13 | 1989-11-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0369242U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60100458A (en) * | 1983-11-04 | 1985-06-04 | Aichi Steel Works Ltd | Manufacture of aluminum laminated cooler |
-
1989
- 1989-11-13 JP JP13106689U patent/JPH0369242U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60100458A (en) * | 1983-11-04 | 1985-06-04 | Aichi Steel Works Ltd | Manufacture of aluminum laminated cooler |
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