JPH0369199B2 - - Google Patents
Info
- Publication number
- JPH0369199B2 JPH0369199B2 JP59117197A JP11719784A JPH0369199B2 JP H0369199 B2 JPH0369199 B2 JP H0369199B2 JP 59117197 A JP59117197 A JP 59117197A JP 11719784 A JP11719784 A JP 11719784A JP H0369199 B2 JPH0369199 B2 JP H0369199B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- machine
- lead
- electronic components
- shaping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003780 insertion Methods 0.000 claims description 62
- 230000037431 insertion Effects 0.000 claims description 62
- 238000007493 shaping process Methods 0.000 claims description 22
- 210000000078 claw Anatomy 0.000 description 12
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は、プリント基板等に電子部品を自動
的に実装する電子部品自動挿入機に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an automatic electronic component insertion machine that automatically mounts electronic components onto a printed circuit board or the like.
従来この種の装置としては、DIP−ICのリード
先端をＶ状に切断してプリント基板への挿入を容
易にする等の自動挿入機があつた。
Conventionally, as this type of device, there has been an automatic insertion machine that cuts the lead end of the DIP-IC into a V shape to facilitate insertion into a printed circuit board.
また、デイスクリート部品のリード加工機とし
ては、それぞれ部品形状対応で第６図に示すよう
なリード加工ができる専用機があつた。 In addition, as a lead processing machine for discrete parts, there was a dedicated machine capable of processing leads as shown in FIG. 6, depending on the shape of each part.
従来のDIP−ICのリード加工においては、DIP
−IC専用の自動挿入機についてのみ用いられる
ので、多品種、多形状の電子部品挿入機には、該
多品種，多形状部品のうちDIP−ICについてのみ
その方式を適用することはできても、他の部品に
ついては適用できず、多品種，多形状部品を対象
とした自動挿入機は得られなかつた。また、リー
ド加工機は、リードの加工もしくはリード整形が
できても装置が大型であり、電子部品自動挿入機
の部品供給過程にこれを複数台備えることは困難
であつた。また、事前にリード整形等を施す場合
には、リード形状が特異な形になるため、部品ケ
ースの断面構造が複雑化したり、大型化したり、
また部品供給姿勢が不安定になる等の欠点があつ
た。 In conventional DIP-IC lead processing, DIP
- Since it is used only for automatic insertion machines dedicated to ICs, it is possible to apply this method only to DIP-ICs among electronic component inserters that handle a wide variety of products and shapes. However, it could not be applied to other parts, and an automatic insertion machine that could handle many types of parts and many shapes could not be obtained. Further, even if lead processing machines can process or shape leads, they are large-sized devices, and it has been difficult to provide a plurality of them in the component supply process of an automatic electronic component insertion machine. In addition, when lead shaping is performed in advance, the lead shape becomes unique, which may complicate the cross-sectional structure of the component case, increase its size, or
Further, there were drawbacks such as unstable parts feeding position.
この発明は上記のような従来のものの欠点を除
去するためになされたもので、各種類の部品を収
納する複数の部品ケースからなる部品収納機と、
部品を基板に自動挿入する部品挿入機との中間工
程に電子部品形状毎に所望のリード加工ができる
リード加工機を複数台具備し、これら各構成機素
を同一の基台に配置させたものとし、上記部品収
納機から部品をリード加工機に搬送してリード整
形した後、部品挿入機で部品を基板に実装する一
連の動作を行なうようにすることで、多品種、多
形状の電子部品を１台の装置で自動挿入できる電
子部品自動挿入機を提供することを目的としてい
る。
This invention was made in order to eliminate the drawbacks of the conventional ones as described above, and includes a parts storage machine consisting of a plurality of parts cases for storing various types of parts,
Equipped with multiple lead processing machines that can perform desired lead processing for each electronic component shape in the intermediate process between a component insertion machine that automatically inserts components into the board, and each of these components arranged on the same base. By carrying out a series of operations such as transporting the components from the component storage machine to the lead processing machine, shaping the leads, and then mounting the components on the board using the component insertion machine, electronic components of various types and shapes can be processed. The purpose of the present invention is to provide an automatic electronic component insertion machine that can automatically insert electronic components with a single device.
以下、この発明の一実施例を図について説明す
る。
An embodiment of the present invention will be described below with reference to the drawings.
第１図ないし第３図は本発明の一実施例による
電子部品自動挿入機を示し、図において、１は複
数種の電子部品を種類毎に収納する複数の部品ケ
ースからなり、各ケースからの部品を矢印ｘ０
１，ｘ０２，ｘ０３で示すように順次供給できる
部品収納機、３７は該部品収納機１から所望の電
子部品３６ａ〜３６ｃを１個毎取り出すことので
きる腕２を具備し、矢印Ｙ２方向に位置決め移送
できる部品取出移送機、５１は上記部品収納機１
内の各部品ケースを部品が空になつた時点で取り
出すことことのできる腕５０を具備し、該取り出
した部品ケースを矢印Ｙ３方向に位置決め移送で
き、さらに該部品ケースを所定の位置に配設され
た排出箱３８に排出できる部品ケース取出移送機
（マガジン取出移送機）、１０ａ，１０ｂ，１０ｃ
は上記部品取出移送機３７によつて１個毎選択取
出しされた電子部品３６ａ〜３６ｃに対し、所望
の挿入仕様に基づいて、そのリードを整形できる
ようそれぞれ構成され、さらに該部品を矢印ｘ１
０，ｘ２０，ｘ３０方向に移送できるリード整形
機、３はリード整形された電子部品をプリント基
板１１上に自動挿入できるよう構成された部品挿
入ヘツド４を有し、かつ該部品挿入ヘツド４を矢
印Ｙ１方向に位置決め動作できるように構成され
た部品挿入機、３５は上記部品挿入ヘツド４に装
着され、かつ挿入部品の形状、種類により自動的
に交換できる挿入爪を収納し、さらに矢印Ｘ２方
向に位置決め移動できるよう構成された挿入爪収
納機、５は上記部品挿入機３と直交して矢印Ｘ１
方向に位置決め移動でき、プリント基板１１を位
置決め保持できるよう構成された基板位置決め
機、６は部品収納機１を載置しているベース、５
は部品挿入機３を載置しているベース、８は部品
挿入機３での不良品、即ちリジエクト部品を入れ
るためのケース、７は装置全体の基台である。 1 to 3 show an automatic electronic component insertion machine according to an embodiment of the present invention. In the figures, 1 is composed of a plurality of component cases that store a plurality of types of electronic components according to type, and the electronic component 1 from each case is Arrow parts x0
As shown by 1, x02, and x03, a component storage machine 37 that can sequentially supply electronic components 37 is equipped with an arm 2 that can take out desired electronic components 36a to 36c one by one from the component storage machine 1, and is positioned in the direction of arrow Y2. 51 is the parts storage machine 1 that can be transferred.
It is equipped with an arm 50 that can take out each component case inside when the parts are empty, and can position and transfer the taken-out component case in the direction of arrow Y3, and further arranges the component case at a predetermined position. Component case take-out transfer machine (magazine take-out transfer machine) capable of discharging into the discharge box 38, 10a, 10b, 10c
is configured to shape the leads of the electronic components 36a to 36c selected and extracted one by one by the component extraction and transfer machine 37 based on desired insertion specifications, and furthermore, the electronic components 36a to 36c are selectively extracted one by one by the component extraction and transfer machine 37, and the leads are shaped by the arrow x1.
A lead shaping machine 3 capable of transferring in 0, x 20, and x 30 directions has a component insertion head 4 configured to automatically insert lead-shaped electronic components onto a printed circuit board 11, and the component insertion head 4 is pointed in the direction of an arrow. The component inserter 35 is configured to be able to perform positioning operations in the Y1 direction, and houses an insertion claw that is attached to the component insertion head 4 and can be automatically replaced depending on the shape and type of the inserted component, and is further configured to perform positioning operations in the X2 direction. An insertion claw storage machine 5 is configured to be able to move in position and is orthogonal to the component insertion machine 3, as indicated by the arrow X1.
a board positioning machine configured to be able to position and move the printed circuit board 11 in the direction and to position and hold the printed circuit board 11; 6, a base on which the component storage machine 1 is placed;
Reference numeral 8 indicates a base on which the component inserter 3 is placed, 8 a case for storing defective products from the component inserter 3, that is, reject parts, and 7 the base of the entire apparatus.
次に、部品供給部の構成をさらに詳細に第４図
について説明する。図において、１は電子部品を
収納する部品ケース１２ａ，１２ｂ，１２ｃを所
望の角度傾斜させて多段に積み重ねて収納する部
品収納機で、その先端下部にシユート１７及び電
子部品の浮き上がりを防止する押え板１６を有し
ている。上記部品収納機１は、支持板１４，１５
でそれぞれ支持されている。なお、部品収納機１
にはこれが矢印Ｚ方向に自重で落下しないよう
に、支持板１５の上端部５４と係止するストツパ
３０が設けられている。５１は摺動レール２１上
を図示しない例えばボールネジ等で位置決め駆動
される部品ケース取出移送機であり、その一端の
テーブル１９にはつかみ１８が矢印ａ方向に移動
可能に設けられている。該テーブル１９は摺動台
２２に矢印ｂ方向に移動できるよう構成されてい
る。 Next, the configuration of the component supply section will be explained in more detail with reference to FIG. 4. In the figure, reference numeral 1 denotes a component storage machine that stores electronic component cases 12a, 12b, and 12c by tilting them at a desired angle and stacking them in multiple stages.At the bottom of the tip, there is a chute 17 and a presser to prevent the electronic components from floating up. It has a plate 16. The parts storage machine 1 includes support plates 14 and 15.
Each is supported by In addition, parts storage machine 1
is provided with a stopper 30 that engages with the upper end 54 of the support plate 15 to prevent it from falling under its own weight in the direction of arrow Z. Reference numeral 51 denotes a parts case takeout transfer machine which is driven for positioning on the slide rail 21 by, for example, a ball screw (not shown), and a grip 18 is provided on the table 19 at one end of the machine so as to be movable in the direction of arrow a. The table 19 is configured to be movable on a sliding table 22 in the direction of arrow b.
また、３７は摺動レール２７上を図示しない例
えばボールネジ等で位置決め駆動される部品取出
移送機である。そして、２４は摺動台２６の一端
に軸５５により回動自在に取付けられた保持部
材、２３は電子部品を把持するつかみ、２３ａは
把持爪、２５はつかみ２３を矢印ｃ方向に移動さ
せるシリンダであり、このようにしてつかみ２３
は軸５５を支点とする矢印ｄ方向及び矢印ｃ方向
にそれぞれ回動，移動できるよう設けられてい
る。 Further, numeral 37 is a component take-out transfer machine that is driven for positioning on the slide rail 27 by, for example, a ball screw (not shown). 24 is a holding member rotatably attached to one end of the slide table 26 by a shaft 55; 23 is a grip for gripping the electronic component; 23a is a gripping claw; 25 is a cylinder for moving the grip 23 in the direction of arrow c. In this way, grab 23
is provided so that it can rotate and move in the direction of arrow d and the direction of arrow c, respectively, with shaft 55 as a fulcrum.
次に部品挿入部についてその構成をさらに詳細
に第５図及び第６図に基づいて説明する。図にお
いて、３は部品挿入ヘツド４をボールネジ４０を
介してモータ４８でＹ１方向に位置決め駆動でき
る部品挿入機、４は歯車４３，４４を介してモー
タ４２で矢印ｅ方向に旋回駆動できる部品挿入爪
４５ａを備えた挿入ヘツド本体５６を有し、アク
チユエータ４１で、該挿入ヘツド本体５６を矢印
ｆ方向に駆動できるようフレーム４７に支持され
た部品挿入ヘツドである。３５は複数種の挿入爪
４５を収納できる挿入爪収納機で、ボールネジ５
８を介して、モータ５９で矢印Ｘ２方向に位置決
め駆動できるよう構成されている。そして、挿入
爪４５ａはアクチユエータ４６でクランプされて
保持されており、挿入爪収納機３５に収納された
挿入爪４５ｂと自動的に交換できるよう構成され
ている。１０はリード整形機群で、電子部品３６
ａ，３６ｂそれぞれ部品形状毎に所望のリード整
形ができるようにそれぞれ構成された電子部品の
リード整形機１０ａ，１０ｂを部品形状対応で有
している。１１はプリント基板で、上記部品挿入
機３と直交する矢印Ｘ１方向にボールネジ３２を
介してモータ３１で位置決め駆動できるよう構成
されている。 Next, the structure of the component insertion section will be explained in more detail with reference to FIGS. 5 and 6. In the figure, reference numeral 3 indicates a component insertion machine that can position and drive the component insertion head 4 in the Y1 direction with a motor 48 via a ball screw 40, and 4 a component insertion claw that can be rotated in the direction of arrow e with a motor 42 via gears 43 and 44. The component insertion head has an insertion head main body 56 having a diameter 45a, and is supported by a frame 47 so that the insertion head main body 56 can be driven in the direction of arrow f by an actuator 41. 35 is an insertion nail storage machine that can store multiple types of insertion nails 45;
8, the motor 59 is configured to drive for positioning in the direction of arrow X2. The insertion claw 45a is clamped and held by an actuator 46, and is configured to be automatically replaced with an insertion claw 45b stored in the insertion claw storage device 35. 10 is a group of lead shaping machines, electronic parts 36
Lead shaping machines 10a and 10b for electronic components are respectively configured so as to be able to perform desired lead shaping for each part shape. Reference numeral 11 denotes a printed circuit board, which is configured so that it can be driven for positioning by a motor 31 via a ball screw 32 in the direction of arrow X1 perpendicular to the component inserter 3.
第６図に上記リード整形機１０ａ，１０ｂ等で
リード整形される電子部品の代表例を示す。図
ａ，ｂはトランジスタ１００のリードをそれぞれ
部品直下から所望の位置に凹部を有するようリー
ド整形し、これによりプリント基板１１上から部
品本体を浮かし付けするためのリード整形例、
ｃ，ｄは固定抵抗１０１のリードをそれぞれ直角
に折り曲げる整形例、ｅ，ｆは固定抵抗１０１を
プリント基板１１上から所望の高さに浮かし付け
するためのリードの２段曲げ整形例である。 FIG. 6 shows a typical example of an electronic component whose leads are shaped by the lead shaping machines 10a, 10b, etc. Figures a and b show examples of lead shaping in which the leads of the transistor 100 are each shaped to have a concave portion at a desired position from directly below the component, thereby floating the component body from above the printed circuit board 11.
c and d are examples of shaping in which the leads of the fixed resistor 101 are bent at right angles, and e and f are examples of two-stage bending of the leads to float the fixed resistor 101 from the printed circuit board 11 to a desired height.
なお、リード整形機１０ａ，１０ｂは、部品形
状毎に図示しない整形治具等でそれぞれ所望のリ
ード加工ができるよう構成されており、第２図に
示すように、部品取出移送機３７で移送されてき
た電子部品３６ａ〜３６ｃそれぞれがその一端に
供給されると下方からリード加工を施した後、図
示しない例えばプツシヤ等で他端に移送すること
ができるよう構成されている。 The lead shaping machines 10a and 10b are configured to be able to perform desired lead processing for each component shape using a shaping jig (not shown), respectively, and as shown in FIG. When each of the electronic components 36a to 36c is supplied to one end, lead processing is performed from below, and then the electronic components 36a to 36c can be transferred to the other end using, for example, a pusher (not shown).
次に部品供給動作について説明する。 Next, the component supply operation will be explained.
第４図において、部品ケース１２ａに収納され
た電子部品は、自重によりシユート１７の先端解
放部５３の位置まで順次落下すると図示しない検
出器により部品の有無を検出し、つかみ２３によ
つて把持され取り出される。先端の部品が順次取
り出されると次々と部品ケース１２ａ内の部品が
シユート１７上に落下し、部品ケース１２ａはい
ずれ空になる。空になると図示しない検出器で検
出し、部品ケース取出移送機５１が該空の部品ケ
ース１２ａに到達し、つかみ１８が矢印ａ方向に
上昇し、空になつたケース１２ａを把持する。把
持するとつかみ１８は次に矢印ｂ方向の右上方向
に移動し、部品ケース１２ａの一端を切欠部１３
から突き出させ、部品ケース１２ａの他端を支持
部６０から外す。次に、つかみ１８を矢印ａ方向
に下降させた後、矢印ｂ方向の左下方向につかみ
１８を移動させると、部品ケース１２ａは支持部
６０，３０のいずれからも離脱し、部品ケース２
０に一端を支持されて部品ケース収納部から取り
出される。部品ケース１２ａが取り出されると部
品ケース１２ｂが１段落下し再び部品がシユート
１７上に落下してくる。なお上記部品ケースは部
品ケース収納機に複数段積載されている。 In FIG. 4, when the electronic components stored in the component case 12a fall one by one to the position of the open end portion 53 of the chute 17 due to their own weight, a detector (not shown) detects the presence or absence of the components, and the electronic components are gripped by the grips 23. taken out. When the parts at the tip are taken out one after another, the parts in the parts case 12a fall one after another onto the chute 17, and the parts case 12a eventually becomes empty. When the case is empty, it is detected by a detector (not shown), the component case take-out and transfer machine 51 reaches the empty component case 12a, and the grip 18 moves up in the direction of arrow a to grip the empty case 12a. When gripped, the grip 18 then moves to the upper right in the direction of arrow b, and holds one end of the component case 12a in the notch 13.
The other end of the component case 12a is removed from the support portion 60. Next, when the grip 18 is lowered in the direction of the arrow a and then moved to the lower left in the direction of the arrow b, the component case 12a is detached from both of the supports 60 and 30, and the component case 12
0 and is taken out from the component case storage section. When the component case 12a is taken out, the component case 12b is lowered one step and the components fall onto the chute 17 again. Note that the above-mentioned component cases are stacked in multiple stages on the component case storage machine.
次に部品挿入動作について説明する。 Next, the component insertion operation will be explained.
第１図，第５図において、上記部品取出移送機
３７によつて順次移送されてくる部品は部品形状
と対応したリード整形機１０の一端に供給され
る。供給された部品は図示しないリード整形治具
とプツシヤによつてリード整形されて他端まで移
送され、部品挿入機３によつてプリント基板１１
上に自動的に挿入される。この時、動作軸Ｙ１方
向には部品挿入機４が、同様に動作軸Ｘ１方向に
は基板位置決め機５がそれぞれ独立して動作する
ことによつてプリント基板１１上の所望の位置に
部品を挿入することができる。また、電子部品の
挿入方向としてはモータ４２によつて所望の方向
にこれを挿入することもできる。 In FIGS. 1 and 5, the parts that are sequentially transferred by the parts take-out and transfer machine 37 are supplied to one end of the lead shaping machine 10 that corresponds to the part shape. The supplied components are lead-shaped by a lead shaping jig and pusher (not shown) and transferred to the other end, where they are inserted into the printed circuit board 11 by the component inserter 3.
automatically inserted above. At this time, the component insertion machine 4 operates independently in the direction of the motion axis Y1, and the board positioning machine 5 operates independently in the direction of the motion axis X1, thereby inserting the component into the desired position on the printed circuit board 11. can do. Furthermore, the electronic component can also be inserted in a desired direction using the motor 42.
次に挿入爪４５ａ，４５ｂの交換動作について
説明する。 Next, the operation of exchanging the insertion claws 45a, 45b will be explained.
第５図において、挿入指令に基づいて電子部品
３６ａが順次供給されると、挿入爪４５ａで順次
部品挿入を繰り返すが電子部品３６ｂが指令に基
づいて供給されると、部品挿入機３は、挿入爪収
納機３５上に移動し、挿入爪を収納していない空
スペースに挿入爪４５ａを取外す。次に、モータ
５９を動作させ、挿入爪４５ｂを挿入ヘツド５６
の直下に移動させ、挿入爪４５ｂを保持させる。
この動作が完了すると、部品挿入機３は、電子部
品３６ｂ用の自動挿入機となり、前記同様順次挿
入動作を繰り返す。 In FIG. 5, when the electronic components 36a are sequentially supplied based on the insertion command, the component insertion is repeated sequentially by the insertion claw 45a, but when the electronic component 36b is supplied based on the command, the component insertion machine 3 The user moves onto the nail storage device 35 and removes the insertion nail 45a into the empty space where no insertion nail is stored. Next, operate the motor 59 to move the insertion claw 45b to the insertion head 56.
, and hold the insertion claw 45b.
When this operation is completed, the component insertion machine 3 becomes an automatic insertion machine for the electronic component 36b, and repeats the same sequential insertion operation as described above.
このように本実施例の自動挿入機では、挿入爪
４５を部品形状に合わせて、かつリード整形機１
０と対応させて、複数台用意しておけば、１台の
装置で多品種，多形状の電子部品を自動的に挿入
することができる。なお、上記説明の部品供給動
作と部品挿入動作は機械的に干渉することなく互
いに独立して動作するようになつているので、部
品の種類が増加しても挿入能力が低下することは
ない。 In this way, in the automatic insertion machine of this embodiment, the insertion claw 45 can be adjusted to match the part shape, and the lead shaping machine 1 can
If a plurality of devices are prepared in correspondence with 0, electronic components of various types and shapes can be automatically inserted with one device. Note that the component supply operation and the component insertion operation described above operate independently of each other without mechanical interference, so even if the number of types of components increases, the insertion ability will not decrease.
なお、上記実施例では、トランジスタ１００と
固定抵抗１０のリード整形例について説明した
が、他のどのような部品に適用しても同様の効果
がある。また、リードの加工例として第６図ｂ，
ｄ，ｆに示したようにリードに凹部を設けたり、
２段曲げ等の形状例を示したが、この形状に限ら
ず、挿入仕様に合わせたリード加工機を備えれば
よい。 In the above embodiment, an example of lead shaping of the transistor 100 and the fixed resistor 10 has been described, but the same effect can be obtained even if the lead shaping is applied to any other component. In addition, as an example of lead processing, Fig. 6b,
Providing a recess in the lead as shown in d and f,
Although an example of a shape such as a two-stage bend is shown, the shape is not limited to this shape, and a lead processing machine matching the insertion specifications may be provided.
以上のように、この発明によれば、複数種類の
部品を収納する部品収納機と部品を自動挿入する
部品挿入機との中間工程に挿入仕様に合わせて部
品形状毎にリード加工ができるリード加工装置を
具備し、これら各構成機素を同一の基台に配置さ
せたものとし、上記部品収納機から部品をリード
加工機に搬送してリード整形した後、部品挿入機
で部品を基板に実装する一連の動作を行なうよう
にすることで、多品種，多形状の電子部品を自動
挿入できる効果がある。
As described above, according to the present invention, lead processing can be performed for each part shape according to insertion specifications in an intermediate process between a parts storage machine that stores multiple types of parts and a parts insertion machine that automatically inserts parts. The components are placed on the same base, the components are transferred from the component storage machine to the lead processing machine, the leads are shaped, and then the components are mounted on the board using the component insertion machine. By performing a series of operations, it is possible to automatically insert electronic components of various types and shapes.
第１図はこの発明の一実施例による電子部品自
動挿入機の全体斜視図、第２図はその構成を示し
た簡略図、第３図はその主要部分の構成を示した
ブロツク図、第４図は上記実施例の部品収納機の
構成を示した第２図の側面図、第５図は上記実施
例の部品挿入機を簡略化して示した斜視図、第６
図は多重の電子部品のリード整形例を示す図であ
る。
３６ａ〜３６ｃ…電子部品、１１…プリント基
板、１２ａ〜１２ｃ…部品ケース、１…部品収納
機、３…部品挿入機、１０ａ〜１０ｃ…リード整
形機、７…基台。なお図中同一符号は同一又は相
当部分を示す。
FIG. 1 is an overall perspective view of an automatic electronic component insertion machine according to an embodiment of the present invention, FIG. 2 is a simplified diagram showing its configuration, FIG. 3 is a block diagram showing the configuration of its main parts, and FIG. The figures are a side view of FIG. 2 showing the configuration of the parts storage machine of the above embodiment, FIG. 5 is a perspective view of the parts insertion machine of the above embodiment, and FIG.
The figure shows an example of lead shaping for multiple electronic components. 36a-36c...Electronic components, 11...Printed circuit board, 12a-12c...Component case, 1...Component storage machine, 3...Component insertion machine, 10a-10c...Lead shaping machine, 7...Base. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
いて、 電子部品をその種類毎に収納する複数の部品ケ
ースからなる部品収納機と、 所望の形状にリード整形された電子部品をプリ
ント基板上の所望の位置に挿入する部品挿入機
と、 上記部品収納機と上記部品挿入機との間に設け
られ上記各部品ケースからの電子部品を部品形状
及び上記プリント基板への挿入仕様に合わせリー
ド整形する複数のリード整形機とを備えており、 上記部品収納機と部品挿入機とリード整形機と
は同一基台上に配置され、該基台上で上記部品収
納機から部品をリード整形機に搬送してリード整
形した後、上記部品挿入機で部品を基板に実装す
る一連の動作を行うようにしたことを特徴とする
電子部品自動挿入機。[Claims] 1. A device for mounting electronic components on a printed circuit board, comprising: a component storage machine consisting of a plurality of component cases that store electronic components by type; and a device for printing electronic components whose leads are shaped into desired shapes. A component insertion machine that inserts into a desired position on the board, and a component insertion machine that is installed between the component storage machine and the component insertion machine and adjusts the electronic components from each component case to the component shape and insertion specifications to the printed circuit board. It is equipped with a plurality of lead shaping machines for shaping leads, and the component storage machine, the component insertion machine, and the lead shaping machine are arranged on the same base, and the components from the component storage machine are shaped into leads on the base. 1. An automatic electronic component insertion machine, characterized in that after conveying the lead to a machine and shaping the lead, the component insertion machine performs a series of operations for mounting the component on a board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59117197A JPS60258994A (en) | 1984-06-05 | 1984-06-05 | Automatic electronic part inserting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59117197A JPS60258994A (en) | 1984-06-05 | 1984-06-05 | Automatic electronic part inserting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60258994A JPS60258994A (en) | 1985-12-20 |
| JPH0369199B2 true JPH0369199B2 (en) | 1991-10-31 |
Family
ID=14705795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59117197A Granted JPS60258994A (en) | 1984-06-05 | 1984-06-05 | Automatic electronic part inserting machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60258994A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0691349B2 (en) * | 1987-01-20 | 1994-11-14 | 松下電器産業株式会社 | Electronic component reversing device |
| JPH04199800A (en) * | 1990-11-29 | 1992-07-20 | Matsushita Electric Ind Co Ltd | Lead inserting device for component |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4855470A (en) * | 1971-11-15 | 1973-08-03 | ||
| JPS50127173A (en) * | 1974-01-22 | 1975-10-06 | ||
| JPS5419177A (en) * | 1977-07-12 | 1979-02-13 | Matsushita Electric Ind Co Ltd | Automatic electronic parts mounting device |
| JPS5443574A (en) * | 1977-09-12 | 1979-04-06 | Seiko Instr & Electronics | Electrical parts insertion device |
| JPS55118689A (en) * | 1979-03-05 | 1980-09-11 | Matsushita Electric Ind Co Ltd | Device for automatically inserting electric part |
| JPS5739600A (en) * | 1980-08-20 | 1982-03-04 | Hitachi Ltd | Device for conveying electronic part |
| JPS5754386A (en) * | 1980-09-18 | 1982-03-31 | Tdk Electronics Co Ltd | |
| JPS58112387A (en) * | 1981-12-26 | 1983-07-04 | 池上通信機株式会社 | Device for automatically inserting electronic part into printed board |
| JPS58114493A (en) * | 1982-12-13 | 1983-07-07 | 池上通信機株式会社 | Device for automatically inserting electronic part into printed board |
| JPS59225599A (en) * | 1983-06-06 | 1984-12-18 | 三洋電機株式会社 | Device for automatically inserting electronic part |
-
1984
- 1984-06-05 JP JP59117197A patent/JPS60258994A/en active Granted
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4855470A (en) * | 1971-11-15 | 1973-08-03 | ||
| JPS50127173A (en) * | 1974-01-22 | 1975-10-06 | ||
| JPS5419177A (en) * | 1977-07-12 | 1979-02-13 | Matsushita Electric Ind Co Ltd | Automatic electronic parts mounting device |
| JPS5443574A (en) * | 1977-09-12 | 1979-04-06 | Seiko Instr & Electronics | Electrical parts insertion device |
| JPS55118689A (en) * | 1979-03-05 | 1980-09-11 | Matsushita Electric Ind Co Ltd | Device for automatically inserting electric part |
| JPS5739600A (en) * | 1980-08-20 | 1982-03-04 | Hitachi Ltd | Device for conveying electronic part |
| JPS5754386A (en) * | 1980-09-18 | 1982-03-31 | Tdk Electronics Co Ltd | |
| JPS58112387A (en) * | 1981-12-26 | 1983-07-04 | 池上通信機株式会社 | Device for automatically inserting electronic part into printed board |
| JPS58114493A (en) * | 1982-12-13 | 1983-07-07 | 池上通信機株式会社 | Device for automatically inserting electronic part into printed board |
| JPS59225599A (en) * | 1983-06-06 | 1984-12-18 | 三洋電機株式会社 | Device for automatically inserting electronic part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60258994A (en) | 1985-12-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |