JPH036893A - Multilayer thin film wiring board - Google Patents

Abstract

PURPOSE:To remove primary factors which cause wire breaking of a conductive layer so as to enable further multilayer advancement by forming a layer out of an insulating layer, formed in specified thickness, and a conductor layer of the thickness same as the insulating layer, and laminating that layer in plural numbers so as to flaten each layer. CONSTITUTION:Laminated layer 2-1-2-N are formed by insulating layers 3, each of which is laminated in specified thickness, and conductor layers 4-1-4-N, each of which consists of a metallic film 5 by electrode metallic sputtering and a plated layer by plating, and individual thickness of the conductor layers 4-1-4-N is made the same as the thickness of the insulating layer 3. The laminated conductor layers 4-1-4-N turn out to be spread on a smooth face at all times, and even if the conductor layers to be laminated increase by making them into multilayer, the conductor layers are never set being bent, so wire breaking never occurs. Accordingly, it becomes possible to laminate more layers, and obstacles by wire breaking disappears, and quality improvement can be realized.

Description

[Detailed Description of the Invention] [Summary] Regarding a multilayer thin film wiring board formed by sequentially laminating a plurality of layers on the surface of a base made of a ceramic material, flattening each layer causes disconnection in the conductor layer. In order to eliminate the factors that cause the layering to become more multi-layered, and to improve reliability, we have developed an insulating layer made of an organic insulating material laminated to a predetermined thickness, and a lamination of the insulating layer. A layer is formed by a conductor layer formed to the same thickness as the conductor layer, and the conductor layer is formed by a metal film formed by electrode metal sputtering and a plating film formed by plating the metal film. Configure to be formed.

[Industrial Application Field] The present invention relates to a multilayer thin film wiring board formed by sequentially laminating a plurality of layers on the surface of a base made of a ceramic material.

In recent years, as the speed of electronic devices such as computers has increased, the circuit boards used in these devices have become denser.

Therefore, such circuit boards are formed in such a way that high-density wiring can be achieved by forming a pattern using a thin film and stacking a large number of patterned layers to create a multilayer structure. There is.

Therefore, in such a circuit board, it is desired that more layers be laminated.

(Prior Art) Conventionally, the structure was as shown in the conventional side cross-sectional view of FIG.

As shown in FIG. 4, a first layer 10-1 made of a conductor 11-1 and an insulator 12-1 is laminated on a surface 1A of a base l made of a ceramic material, and further a first layer 10- By similarly laminating the second layer 10-2 on the upper layer of 1,
The third layer 10-3. The fourth layer 10-4 was formed to be laminated.

In addition, the first layer 7!10-1 and the second layer 10-2. Connection between upper and lower conductor layers such as the second layer 10-2 and the third layer 10-3 is achieved by providing vias 13.

This kind of lamination is suitable for boat fishing, as shown in (a) to (h) in Figure 5.
It is formed by the manufacturing process shown in the manufacturing process diagram.

As shown in FIG. 5(a), first, a metal film 11A having a predetermined thickness is formed on the surface of the base 1 by metal sputtering, and as shown in FIG. 5(b), a resist is formed on the upper layer of the metal film 11A. ) 14 are laminated, and unnecessary portions of the metal film 11^ are removed by etching to form a first conductor layer 11-1 forming a predetermined pattern, as shown in FIG.

Next, as shown in (d), a first insulating layer 12-1 is formed so as to cover the entire first conductive layer 11-1 with an organic insulating material.
1 is laminated to form a first layer 10-1.

For this first insulating layer 12-1, as shown in FIG.
5 is provided, and as shown in (f), a first insulating layer 12-
A metal film 1 having a predetermined thickness is formed on the upper layer of 1 by metal sputtering.
18, a via 13 is formed in the pier hole 15.

Therefore, as shown in (f), a resist 14 is laminated on the metal film 11A, and a second conductor layer 11-2 constituting the second layer 10-2 is formed by etching (h
), the first conductor layer 11-1 is connected to the second conductor layer 11-2 stacked on top of the first conductor layer 11-1 through a via 13.

Therefore, by repeating the same process, the third layer 10
-3. Lamination of the fourth layer 10-4 is performed.

[Problem to be solved by the invention]

In a configuration in which the first to fourth conductor layers 11-1 to 11-4 connected by such vias 13 are laminated, particularly,
The higher up the second to fourth conductor layers 11-2 to 11-4 are, the less smooth the surface is, and the more curved the second to fourth conductor layers 11-2 to 11-4 are. If you do so, you will be put on hold.

Further, such second to fourth conductor layers 11-2 to 11-
Stress is concentrated at the bent part 4, which can cause wire breakage.

Therefore, such a configuration has a problem in that it is particularly difficult to laminate a large number of layers.

Therefore, an object of the present invention is to flatten each layer to eliminate the factors that cause disconnection of the conductor layer, to enable more multilayering, and to improve reliability.

[Means to solve the problem]

FIG. 1 is a diagram explaining the principle of the present invention.

As shown in FIG. 1, an insulating layer 3 made of an organic insulating material is laminated to a predetermined thickness T, and conductor layers 4-1 to 4- are formed to have a thickness equivalent to the laminated thickness T of the insulating layer 3. N to form layers 2-1 to 2-N, and the conductor layers 4-1 to 2-N.
4-N is formed by a metal film 5 formed by electrode metal sputtering and a plating film 6 formed by plating the metal film 5.

With this configuration, the above-mentioned problem is solved.

[Effect]

That is, an insulating layer 3 in which laminated layers 2=1 to 2-N are laminated to a predetermined thickness T, and a metal film 5 formed by electrode metal sputtering.
and a plating film formed by plating.
conductor layers 4-1 to 4-N.
The thickness of the insulating layer 3 is the same as that of the insulating layer 3.

Therefore, the laminated conductor layers 4-1 to 4-N are always stretched over a smooth surface, and even if the number of laminated conductor layers increases due to multilayering, the conductor layers 4-1 to 4-N as in the past Since the wire is not stretched due to bending, there is no possibility of wire breakage.

Therefore, it becomes possible to laminate a larger number of layers, eliminate troubles due to wire breakage, and improve quality.

〔Example〕

The present invention will be explained in detail below with reference to FIGS. 2 and 3. FIG. 2 is a side cross-sectional view of an embodiment according to the invention, and FIGS. 3(a) to 3(e) are manufacturing process diagrams of the present invention. The same reference numerals indicate the same objects throughout the figures.

As shown in FIG. 2, a layer 2-1 consisting of an insulating layer 3 and a conductive layer 4-1 is laminated on the surface 18 of the base 1, and further,
A layer 2-2 consisting of an insulating layer 3 and a conductor layer 4-2 is laminated on the layer 2-1, and a conductor layer 4-3,
4-4, 4-5 layers 2-3, 2-4, 2-
The structure is such that five layers are stacked one after another.

Moreover, the conductor layers 4-1 to 4-5 are each formed of a metal film 5 and a plating film 6.

Such a laminated layer can be formed by the manufacturing steps shown in FIGS. 3(a) to 3(e).

As shown in FIG. 3(a), first, an insulating layer 3 made of an organic insulating material with a predetermined thickness T is laminated on the surface 1 of the base 1.
A and as shown in FIG.
Formation of

Next, as shown in (c), a resist 7 is formed so as to cover the upper layer 5A of the metal film 5 formed on the protrusion of the insulating layer 3, and further, plating is applied as shown in (d). As a result, a plating film 6 is formed on the exposed upper layer 5A of the metal film 5 other than that covered by the resist 7.

Finally, as shown in (e), the resist 7 is peeled off and the metal film 5 exposed by the peeling of the resist 7 is removed by etching to reduce the thickness T of the metal film 5 and the plating film 6. The conductor 4-1 can be formed into an insulation N3.

Thereafter, by repeating the same process, layer 2-2 having conductor layer 4-2 on top of layer 2-1 is laminated, and layers 2-2 are laminated one after another.
-3.2-4.2-5 stacking can be performed sequentially.

Therefore, with this configuration, layers 2-1 to 2-5
Even if the conductor layers 4-1 to 4-
5 will be stretched smoothly, and even if it is multi-layered, the conductor layer will not bend like in the conventional case and will be stretched.

In addition, in such a configuration, for example, layer 2 shown in FIG.
-1.2-3 and 2-5 conductor layer 4-1.4-3.4
-5 as a predetermined pattern, and the layer 22 laminated therebetween
．． 2-4 conductor layer 4-2. Conductor layer 4 using 4-4 as a via
-14-3 and 4-5 can be connected to each other.

[Effects of the Invention] As explained above, according to the present invention, a layer is formed by an insulating layer formed to a predetermined thickness and a conductive layer having the same thickness as the insulating layer, and the layers are laminated. Even if a large number of layers are laminated, the conductor layer can always be formed so as to be stretched smoothly.

Therefore, the conductor layer tension is not bent due to multilayering as in the past, and more layers can be laminated, and the quality can be improved, which has a great practical effect. .

[Brief explanation of drawings]

FIG. 1 is a diagram explaining the principle of the present invention. FIG. 2 is a side sectional view of an embodiment according to the present invention. 3(a) to 3(e) are manufacturing process diagrams of the present invention. FIG. 4 is a conventional side sectional view. FIGS. 5(a) to 5(h) show conventional manufacturing process diagrams. In the figure, 1 is a base, and 2-1 to 2-N are layers. 3 is an insulating layer 1; 4-1 to 4-N are conductor layers. 5 is a metal film, 6 is a plating film. 1A indicates the surface.

Claims (1)

[Claims] A multilayer thin film wiring board formed by sequentially laminating a plurality of layers (2-1 to 2-N) on a surface (1A) of a base (1) made of a ceramic material, comprising: an insulating layer (3) made of an organic insulating material laminated to a thickness (T) of , and a conductor layer (4-1 to 4-4- a metal film (5) in which the conductor layers (4-1 to 4-N) are formed by electrode metal sputtering; A multilayer thin film wiring board characterized in that it is formed of (5) and a plating film (6) formed by plating.