JPH036867U - - Google Patents
Info
- Publication number
- JPH036867U JPH036867U JP1990067478U JP6747890U JPH036867U JP H036867 U JPH036867 U JP H036867U JP 1990067478 U JP1990067478 U JP 1990067478U JP 6747890 U JP6747890 U JP 6747890U JP H036867 U JPH036867 U JP H036867U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- insulating layer
- conductor pattern
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990067478U JPH0631738Y2 (ja) | 1990-06-26 | 1990-06-26 | 高密度実装混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990067478U JPH0631738Y2 (ja) | 1990-06-26 | 1990-06-26 | 高密度実装混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH036867U true JPH036867U (enExample) | 1991-01-23 |
| JPH0631738Y2 JPH0631738Y2 (ja) | 1994-08-22 |
Family
ID=31601087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990067478U Expired - Lifetime JPH0631738Y2 (ja) | 1990-06-26 | 1990-06-26 | 高密度実装混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0631738Y2 (enExample) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5788959U (enExample) * | 1980-11-20 | 1982-06-01 | ||
| JPS58105168U (ja) * | 1982-01-13 | 1983-07-18 | 日立電子株式会社 | 多層配線板の部品取付構造 |
| JPS60208859A (ja) * | 1984-04-02 | 1985-10-21 | Toshiba Corp | 混成機能回路 |
| JPS61222793A (ja) * | 1985-03-28 | 1986-10-03 | 三菱電機株式会社 | Ｉｃカ−ドの製造方法 |
-
1990
- 1990-06-26 JP JP1990067478U patent/JPH0631738Y2/ja not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5788959U (enExample) * | 1980-11-20 | 1982-06-01 | ||
| JPS58105168U (ja) * | 1982-01-13 | 1983-07-18 | 日立電子株式会社 | 多層配線板の部品取付構造 |
| JPS60208859A (ja) * | 1984-04-02 | 1985-10-21 | Toshiba Corp | 混成機能回路 |
| JPS61222793A (ja) * | 1985-03-28 | 1986-10-03 | 三菱電機株式会社 | Ｉｃカ−ドの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0631738Y2 (ja) | 1994-08-22 |