JPH0367461U - - Google Patents

Info

Publication number
JPH0367461U
JPH0367461U JP12838289U JP12838289U JPH0367461U JP H0367461 U JPH0367461 U JP H0367461U JP 12838289 U JP12838289 U JP 12838289U JP 12838289 U JP12838289 U JP 12838289U JP H0367461 U JPH0367461 U JP H0367461U
Authority
JP
Japan
Prior art keywords
light emitting
lead frame
bonded
emitting chip
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12838289U
Other languages
English (en)
Japanese (ja)
Other versions
JP2519504Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989128382U priority Critical patent/JP2519504Y2/ja
Publication of JPH0367461U publication Critical patent/JPH0367461U/ja
Application granted granted Critical
Publication of JP2519504Y2 publication Critical patent/JP2519504Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP1989128382U 1989-10-31 1989-10-31 発光ダイオード Expired - Fee Related JP2519504Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989128382U JP2519504Y2 (ja) 1989-10-31 1989-10-31 発光ダイオード

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989128382U JP2519504Y2 (ja) 1989-10-31 1989-10-31 発光ダイオード

Publications (2)

Publication Number Publication Date
JPH0367461U true JPH0367461U (ko) 1991-07-01
JP2519504Y2 JP2519504Y2 (ja) 1996-12-04

Family

ID=31676090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989128382U Expired - Fee Related JP2519504Y2 (ja) 1989-10-31 1989-10-31 発光ダイオード

Country Status (1)

Country Link
JP (1) JP2519504Y2 (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100790347B1 (ko) * 2006-10-27 2008-01-02 주식회사 대목환경건설 수생식물용 식생블록
JP2010125647A (ja) * 2008-11-26 2010-06-10 Towa Corp 光学成形品の圧縮成形方法及び金型
CN105340090A (zh) * 2013-06-28 2016-02-17 皇家飞利浦有限公司 发光二极管器件
JP2016528722A (ja) * 2013-06-28 2016-09-15 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 発光ダイオードデバイス

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100629544B1 (ko) 1996-06-26 2006-09-27 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 발광 변환 소자를 포함하는 발광 반도체 소자

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508884U (ko) * 1973-05-18 1975-01-29
JPS587364U (ja) * 1981-07-07 1983-01-18 スタンレー電気株式会社 発光ダイオ−ドランプ
JPS6315483A (ja) * 1986-07-07 1988-01-22 Toyoda Gosei Co Ltd 発光ダイオ−ド用リ−ドフレ−ム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508884U (ko) * 1973-05-18 1975-01-29
JPS587364U (ja) * 1981-07-07 1983-01-18 スタンレー電気株式会社 発光ダイオ−ドランプ
JPS6315483A (ja) * 1986-07-07 1988-01-22 Toyoda Gosei Co Ltd 発光ダイオ−ド用リ−ドフレ−ム

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100790347B1 (ko) * 2006-10-27 2008-01-02 주식회사 대목환경건설 수생식물용 식생블록
JP2010125647A (ja) * 2008-11-26 2010-06-10 Towa Corp 光学成形品の圧縮成形方法及び金型
CN105340090A (zh) * 2013-06-28 2016-02-17 皇家飞利浦有限公司 发光二极管器件
JP2016528722A (ja) * 2013-06-28 2016-09-15 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 発光ダイオードデバイス
US10038122B2 (en) 2013-06-28 2018-07-31 Lumileds Llc Light emitting diode device

Also Published As

Publication number Publication date
JP2519504Y2 (ja) 1996-12-04

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees