JP2016528722A - 発光ダイオードデバイス - Google Patents
発光ダイオードデバイス Download PDFInfo
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- JP2016528722A JP2016528722A JP2016522917A JP2016522917A JP2016528722A JP 2016528722 A JP2016528722 A JP 2016528722A JP 2016522917 A JP2016522917 A JP 2016522917A JP 2016522917 A JP2016522917 A JP 2016522917A JP 2016528722 A JP2016528722 A JP 2016528722A
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- conductive substrate
- led
- lens
- light emitting
- polymer body
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- 229920000642 polymer Polymers 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000004033 plastic Substances 0.000 claims description 10
- 229920003023 plastic Polymers 0.000 claims description 10
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 230000003750 conditioning effect Effects 0.000 claims description 2
- 229920000098 polyolefin Polymers 0.000 claims description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 2
- 229920006375 polyphtalamide Polymers 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
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- 239000000463 material Substances 0.000 description 34
- 239000004065 semiconductor Substances 0.000 description 21
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- 238000000465 moulding Methods 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
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- 239000002096 quantum dot Substances 0.000 description 2
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- 239000010980 sapphire Substances 0.000 description 2
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
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- 125000003700 epoxy group Chemical group 0.000 description 1
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- -1 for example Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
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- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
Description
Claims (18)
- 導電基体上にマウントされた発光ダイオード(LED)と、
前記LEDを覆って配設されたレンズと、
前記導電基体を覆って且つ前記レンズと直に接触して成形されたポリマーボディと
を有するデバイス。 - 前記基体は金属フレームである、請求項1に記載のデバイス。
- 前記ポリマーボディは、ポリカーボネート、ポリオレフィン、PPA及びPPSの群から選択された耐熱プラスチックである、請求項1に記載のデバイス。
- 前記ポリマーボディは、不透明であり且つ前記レンズの一部を覆っている、請求項1に記載のデバイス。
- 前記導電基体の一部が前記ポリマーボディから突出している、請求項1に記載のデバイス。
- 前記ポリマーボディから突出している前記導電基体の前記一部は、PAR16ソケット及びP21ソケットのうちの一方と適合する、請求項5に記載のデバイス。
- 前記ポリマーボディ内で前記導電基体に取り付けられた非発光電子部品、を更に有する請求項1に記載のデバイス。
- 前記非発光電子部品は、静電放電保護回路、電力調整回路、ドライバ回路、制御回路、リード付き抵抗器、及びリード付きダイオードのうちの1つである、請求項7に記載のデバイス。
- 前記ポリマーボディは、1W/mK以上の熱伝導率を有する、請求項1に記載のデバイス。
- 前記導電基体は、100W/mK以上の熱伝導率を有する金属である、請求項1に記載のデバイス。
- 前記レンズは、シリコーン及びエポキシのうちの一方を有する、請求項1に記載のデバイス。
- 前記導電基体は、前記ポリマーボディの外部にある前記導電基体の部分に前記ポリマーボディが直に接触しないように、電気絶縁性のコーティングで少なくとも部分的に被覆されている、請求項1に記載のデバイス。
- 前記導電基体は、前記ポリマーボディの外側まで延在し、前記ポリマーボディの外側まで延在する前記導電基体の部分は、前記LEDへの電気接続用の電気コンタクトを有する、請求項1に記載のデバイス。
- 前記ポリマーボディは、10000Ω・m以上の電気抵抗率を有する、請求項1に記載のデバイス。
- 請求項1に記載のデバイスを有するシステムであって、
車両に配線され且つ完成ランプセットとして車両回路内で機能するランプ、
交換可能でないようにランプに更に一体化される、車両ランプの従属部品、
方向指示器、日中の走行ランプ、ヘッドランプ、又はテイルランプなどの車両照明として使用されるランプ、
なる用途のうちの1つ以上で使用されるシステム。 - 導電基体に発光ダイオード(LED)を取り付けることと、
前記LED及び前記導電基体を覆ってボディを成形することと
を有し、
前記ボディは、熱伝導性且つ電気絶縁性であり、且つ
前記LEDと前記導電基体の一部とを覆って配設されたレンズが前記ボディから突出する、
方法。 - 前記レンズは前記ボディと直に接触し、
前記ボディは不透明なプラスチックであり、且つ
前記ボディは前記レンズの一部を覆う、
請求項16に記載の方法。 - 当該方法は更に、前記導電基体に非発光電子部品を取り付けることを有し、前記成形することは、前記非発光電子部品を前記ボディ内に封入することを有する、請求項16に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNPCT/CN2013/000785 | 2013-06-28 | ||
CNPCT/CN2013/000785 | 2013-06-28 | ||
PCT/IB2014/062477 WO2014207635A1 (en) | 2013-06-28 | 2014-06-20 | Light emitting diode device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016528722A true JP2016528722A (ja) | 2016-09-15 |
JP6454698B2 JP6454698B2 (ja) | 2019-01-16 |
Family
ID=51178977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016522917A Active JP6454698B2 (ja) | 2013-06-28 | 2014-06-20 | 発光ダイオードデバイス |
Country Status (6)
Country | Link |
---|---|
US (1) | US10038122B2 (ja) |
EP (1) | EP3014667B1 (ja) |
JP (1) | JP6454698B2 (ja) |
KR (1) | KR102204273B1 (ja) |
ES (1) | ES2781971T3 (ja) |
WO (1) | WO2014207635A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018067630A (ja) * | 2016-10-19 | 2018-04-26 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10099800B2 (en) | 2015-05-08 | 2018-10-16 | The Boeing Company | Structurally embedded lighting for display panels and method of making the same |
JP6435526B2 (ja) | 2015-08-05 | 2018-12-12 | パナソニックIpマネジメント株式会社 | イヤホン |
JP6645781B2 (ja) * | 2015-09-11 | 2020-02-14 | アルパッド株式会社 | 半導体発光装置 |
CN110114610B (zh) | 2016-12-13 | 2021-12-21 | 亮锐控股有限公司 | Led在引线框架上的布置 |
US10475967B2 (en) | 2017-04-27 | 2019-11-12 | Osram Opto Semiconductors Gmbh | Wavelength converters with improved thermal conductivity and lighting devices including the same |
JP7279204B2 (ja) * | 2020-01-22 | 2023-05-22 | 株式会社ニフコ | Led照明装置 |
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US10038122B2 (en) | 2018-07-31 |
JP6454698B2 (ja) | 2019-01-16 |
WO2014207635A1 (en) | 2014-12-31 |
EP3014667A1 (en) | 2016-05-04 |
US20170040496A1 (en) | 2017-02-09 |
KR20160025017A (ko) | 2016-03-07 |
EP3014667B1 (en) | 2020-02-19 |
ES2781971T3 (es) | 2020-09-09 |
KR102204273B1 (ko) | 2021-01-19 |
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