JPH0366028B2 - - Google Patents
Info
- Publication number
- JPH0366028B2 JPH0366028B2 JP56073503A JP7350381A JPH0366028B2 JP H0366028 B2 JPH0366028 B2 JP H0366028B2 JP 56073503 A JP56073503 A JP 56073503A JP 7350381 A JP7350381 A JP 7350381A JP H0366028 B2 JPH0366028 B2 JP H0366028B2
- Authority
- JP
- Japan
- Prior art keywords
- instant adhesive
- adhesive
- coating
- dispenser
- instant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7350381A JPS57190666A (en) | 1981-05-18 | 1981-05-18 | Coating mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7350381A JPS57190666A (en) | 1981-05-18 | 1981-05-18 | Coating mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57190666A JPS57190666A (en) | 1982-11-24 |
| JPH0366028B2 true JPH0366028B2 (enExample) | 1991-10-15 |
Family
ID=13520116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7350381A Granted JPS57190666A (en) | 1981-05-18 | 1981-05-18 | Coating mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57190666A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6848468B2 (ja) * | 2017-01-20 | 2021-03-24 | 富士通株式会社 | 接着剤塗布方法及び接着剤塗布装置 |
-
1981
- 1981-05-18 JP JP7350381A patent/JPS57190666A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57190666A (en) | 1982-11-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0238181A3 (en) | Cover for semiconductor device packages | |
| EP0444701A3 (en) | Method for preparing a substrate surface for glueing with activatable adhesives by applying an activator containing layer onto the substrate surface | |
| JPH0366028B2 (enExample) | ||
| EP0145900A3 (en) | Automatic application device for a lining material in liquid or paste form | |
| JPH0213110Y2 (enExample) | ||
| SG66565A1 (en) | Method of applying adhesive to lead of lead frame and method of making semiconductor device using the same | |
| JPH0722730B2 (ja) | 接着剤の塗布装置 | |
| US2150212A (en) | Method of making center spot crowns | |
| JPS5357233A (en) | Bonding | |
| JPH0515989Y2 (enExample) | ||
| JPS645948B2 (enExample) | ||
| JPS57121874A (en) | Method for coating of solder | |
| JPS5866085A (ja) | 風防付時計用側 | |
| JP2751623B2 (ja) | 接着剤付着装置 | |
| JPS55102670A (en) | Heat-sensitive adhesive material for cover | |
| JPS6320378B2 (enExample) | ||
| JPS55146419A (en) | Display device | |
| JPH0256269A (ja) | ペースト途布装置 | |
| JPS5227438A (en) | Adhesion of components | |
| JPS6122627A (ja) | 感光性樹脂塗布装置 | |
| JPS5920696Y2 (ja) | 熱螢光線量計素子の製造装置 | |
| JPS52123438A (en) | Base material for panel | |
| JPS51144436A (en) | Method for applying and keeping alpha-cyanoacrylate adhesive | |
| JPS63260040A (ja) | 半導体素子の固着方法 | |
| JPH0471243A (ja) | 半導体装置用ダイボンディング装置 |