JPH0364952A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPH0364952A JPH0364952A JP20192589A JP20192589A JPH0364952A JP H0364952 A JPH0364952 A JP H0364952A JP 20192589 A JP20192589 A JP 20192589A JP 20192589 A JP20192589 A JP 20192589A JP H0364952 A JPH0364952 A JP H0364952A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- gate
- resin
- sealing
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000004065 semiconductor Substances 0.000 claims abstract description 6
- 238000000465 moulding Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract 2
- 238000005336 cracking Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は樹脂モールド半導体に用いるリードフレームに
関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a lead frame used for resin-molded semiconductors.
従来の技術
以下、図面を参照しながら従来のリードフレームについ
て説明する。第３図は従来のリードフレームの平面図で
、第４図は第３図におけるＢＢ断面図である。第３図に
おいて１１はリードフレーム、１２は半導体チップ（図
示せず）を封止する樹脂モールドパッケージ、１５．１
６は樹脂モールドパッケージ１２を成形するためのそれ
ぞれ上型、下型で、１３，１４．はそれぞれ上型１５、
下型１６に設けられた溶融樹脂流入用の上ゲート、下ゲ
ートであり、樹脂モールドパッケージ２を封止する際、
上ゲート１３と下ゲート１４がリードフレーム１１をは
さみ込む形状となる。2. Description of the Related Art A conventional lead frame will be described below with reference to the drawings. FIG. 3 is a plan view of a conventional lead frame, and FIG. 4 is a sectional view taken along line BB in FIG. In FIG. 3, 11 is a lead frame, 12 is a resin mold package for sealing a semiconductor chip (not shown), and 15.1
6 are an upper mold and a lower mold, respectively, for molding the resin mold package 12; 13, 14. are respectively upper mold 15,
These are the upper gate and lower gate for molten resin inflow provided in the lower mold 16, and when sealing the resin mold package 2,
The upper gate 13 and the lower gate 14 are shaped to sandwich the lead frame 11 therebetween.
発明が解決しようとする課題
しかしながら従来のリードフレーム１１は、第４図に示
すように樹脂モールドパッケージ１２を封止する際、上
ゲート１３、下ゲート１４を経由して流入する樹脂には
さまれ、封止完了後ゲート処理を容易にする事はむずか
しいという課題を有していた。そこで本発明は、ゲート
処理を簡単にできるリードフレームを提供するものであ
る。Problems to be Solved by the Invention However, as shown in FIG. 4, the conventional lead frame 11 is pinched by the resin flowing through the upper gate 13 and the lower gate 14 when sealing the resin mold package 12. However, the problem was that it was difficult to facilitate gate processing after sealing was completed. Therefore, the present invention provides a lead frame that allows easy gate processing.
課題を解決するための手段
上記課題を解決するため、本発明のリードフレームは、
半導体素子を封止する金型に設けた溶融樹脂流入用のゲ
ートと交わる部分に切欠部を設けたものである。Means for Solving the Problems In order to solve the above problems, the lead frame of the present invention includes:
A notch is provided at a portion that intersects with a gate for inflow of molten resin provided in a mold for sealing a semiconductor element.
作 用
本発明においては上記した構成によってリードフレーム
の溶融樹脂流入用ゲートと交わる部分に切欠部を設けて
いるため、ゲート部の樹脂がリードフレームをはさみこ
まないため、封止部の変形や割れを防止しながら、ゲー
ト処理を容易にすることができる。Function In the present invention, with the above-described configuration, a notch is provided at the part of the lead frame that intersects with the molten resin inflow gate, so the resin at the gate does not pinch the lead frame, preventing deformation or cracking of the sealing part. Gate processing can be facilitated while preventing this.
実施例
本発明の一実施例のリードフレームについて以下、図面
を参照しながら説明する。第１図は本発明の一実施例の
リードフレームの平面図、第２図は第１図におけるＡＡ
断面図である。Embodiment A lead frame according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of a lead frame according to an embodiment of the present invention, and FIG. 2 is an AA in FIG. 1.
FIG.
第１図において、１はリードフレーム、２は樹脂モール
ドパッケージ、５，６は樹脂モールドパッケージ２を成
形するための、それぞれ上型、下型で３，４はそれぞれ
上型５、下型６に設けられた溶融樹脂流入用の上ゲート
及び下ゲート、５は上ゲート３と下ゲート４とがリード
フレーム１と交わる部分に設けたリードフレーム１の切
欠部である。In FIG. 1, 1 is a lead frame, 2 is a resin mold package, 5 and 6 are upper and lower molds, respectively, for molding the resin mold package 2, and 3 and 4 are upper mold 5 and lower mold 6, respectively. The provided upper and lower gates 5 for molten resin inflow are cutout portions of the lead frame 1 provided at the portion where the upper gate 3 and the lower gate 4 intersect with the lead frame 1.
本実施例によれば、リードフレーム１の上ゲート３、下
ゲート４の位置に相当する部分に切欠部５が設けられて
いる事により、封止を完了し、樹脂が硬化した後も上ゲ
ート３、下ゲート４に残留した樹脂がリードフレームを
はさみこまず、ゲート処理を容易に行なうことができる
。According to this embodiment, by providing the cutout portions 5 in the portions corresponding to the positions of the upper gate 3 and lower gate 4 of the lead frame 1, sealing is completed and the upper gate remains open even after the resin has hardened. 3. Resin remaining on the lower gate 4 does not pinch the lead frame, making gate processing easier.
発明の効果
本発明によれば、半導体素子の封止後に必要となるゲー
ト処理が容易に行なえ、その結果としてゲート残り、パ
ッケージ割れが防止でき、品質、生産性を向上する事が
可能となる。Effects of the Invention According to the present invention, the gate treatment required after sealing the semiconductor element can be easily performed, and as a result, gate residue and package cracking can be prevented, and quality and productivity can be improved.
第１図は、本発明の一実施例におけるリードフレームの
平面図、第２図は第１図におけるＡＡ断面図、第３図は
従来のリードフレームの平面図、第４図は第３図におけ
るＢＢ断面図である。
１・・・・・・リードフレーム、２・・・・・・樹脂モ
ールドパッケージ、３・・・・・・上ゲート、４・・・
・・・下ゲート、５・・・・・・切欠部。FIG. 1 is a plan view of a lead frame according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line AA in FIG. 1, FIG. 3 is a plan view of a conventional lead frame, and FIG. It is a BB sectional view. 1...Lead frame, 2...Resin mold package, 3...Top gate, 4...
...Lower gate, 5...Notch.
Claims (1)
を封止する金型に設けた前記溶融樹脂流入用のゲートと
交わる部分に切欠部を設けた事を特徴とするリードフレ
ーム。(1) A lead frame characterized in that a notch is provided at a portion intersecting with a gate for flowing the molten resin provided in a mold for allowing the molten resin to flow and molding to seal a semiconductor element.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20192589A JPH0364952A (en) | 1989-08-02 | 1989-08-02 | Lead frame |
| KR1019900011643A KR940001387B1 (en) | 1989-04-13 | 1990-07-31 | Molding method of semiconductor |
| US08/017,418 US5349136A (en) | 1989-08-02 | 1993-02-10 | Mold tool assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20192589A JPH0364952A (en) | 1989-08-02 | 1989-08-02 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0364952A true JPH0364952A (en) | 1991-03-20 |
Family
ID=16449070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20192589A Pending JPH0364952A (en) | 1989-04-13 | 1989-08-02 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0364952A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05211264A (en) * | 1991-12-03 | 1993-08-20 | Nec Corp | Lead frame for semiconductor |
| JPH09232496A (en) * | 1996-02-28 | 1997-09-05 | Nec Corp | Electronic component |
-
1989
- 1989-08-02 JP JP20192589A patent/JPH0364952A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05211264A (en) * | 1991-12-03 | 1993-08-20 | Nec Corp | Lead frame for semiconductor |
| JPH09232496A (en) * | 1996-02-28 | 1997-09-05 | Nec Corp | Electronic component |
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