JPH0363943U - - Google Patents

Info

Publication number
JPH0363943U
JPH0363943U JP12545689U JP12545689U JPH0363943U JP H0363943 U JPH0363943 U JP H0363943U JP 12545689 U JP12545689 U JP 12545689U JP 12545689 U JP12545689 U JP 12545689U JP H0363943 U JPH0363943 U JP H0363943U
Authority
JP
Japan
Prior art keywords
external connection
insulating container
package
area
connection terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12545689U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0741162Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989125456U priority Critical patent/JPH0741162Y2/ja
Publication of JPH0363943U publication Critical patent/JPH0363943U/ja
Application granted granted Critical
Publication of JPH0741162Y2 publication Critical patent/JPH0741162Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1989125456U 1989-10-26 1989-10-26 半導体素子収納用パッケージ Expired - Lifetime JPH0741162Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989125456U JPH0741162Y2 (ja) 1989-10-26 1989-10-26 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989125456U JPH0741162Y2 (ja) 1989-10-26 1989-10-26 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0363943U true JPH0363943U (OSRAM) 1991-06-21
JPH0741162Y2 JPH0741162Y2 (ja) 1995-09-20

Family

ID=31673326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989125456U Expired - Lifetime JPH0741162Y2 (ja) 1989-10-26 1989-10-26 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JPH0741162Y2 (OSRAM)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08306855A (ja) * 1995-04-27 1996-11-22 Lg Semicon Co Ltd 半導体パッケージ、リードフレーム、回路基板、半導体パッケージモールディング用金型及び電子回路盤並にリードフレームの製造方法
WO2018155559A1 (ja) * 2017-02-22 2018-08-30 京セラ株式会社 配線基板、電子装置および電子モジュール
WO2018155434A1 (ja) * 2017-02-21 2018-08-30 京セラ株式会社 配線基板、電子装置および電子モジュール

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55176571U (OSRAM) * 1979-06-05 1980-12-18
JPS59151443A (ja) * 1983-02-17 1984-08-29 Fujitsu Ltd 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55176571U (OSRAM) * 1979-06-05 1980-12-18
JPS59151443A (ja) * 1983-02-17 1984-08-29 Fujitsu Ltd 半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08306855A (ja) * 1995-04-27 1996-11-22 Lg Semicon Co Ltd 半導体パッケージ、リードフレーム、回路基板、半導体パッケージモールディング用金型及び電子回路盤並にリードフレームの製造方法
WO2018155434A1 (ja) * 2017-02-21 2018-08-30 京セラ株式会社 配線基板、電子装置および電子モジュール
WO2018155559A1 (ja) * 2017-02-22 2018-08-30 京セラ株式会社 配線基板、電子装置および電子モジュール
JPWO2018155559A1 (ja) * 2017-02-22 2020-01-09 京セラ株式会社 配線基板、電子装置および電子モジュール

Also Published As

Publication number Publication date
JPH0741162Y2 (ja) 1995-09-20

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term