JPH0173941U - - Google Patents
Info
- Publication number
- JPH0173941U JPH0173941U JP1987168394U JP16839487U JPH0173941U JP H0173941 U JPH0173941 U JP H0173941U JP 1987168394 U JP1987168394 U JP 1987168394U JP 16839487 U JP16839487 U JP 16839487U JP H0173941 U JPH0173941 U JP H0173941U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor elements
- face
- package
- recess
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 2
Landscapes
- Packaging Frangible Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168394U JPH0173941U (OSRAM) | 1987-11-02 | 1987-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168394U JPH0173941U (OSRAM) | 1987-11-02 | 1987-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173941U true JPH0173941U (OSRAM) | 1989-05-18 |
Family
ID=31457531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987168394U Pending JPH0173941U (OSRAM) | 1987-11-02 | 1987-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173941U (OSRAM) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5762546A (en) * | 1980-10-01 | 1982-04-15 | Narumi China Corp | Ceramic substrate for semiconductor package |
-
1987
- 1987-11-02 JP JP1987168394U patent/JPH0173941U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5762546A (en) * | 1980-10-01 | 1982-04-15 | Narumi China Corp | Ceramic substrate for semiconductor package |