JPH0363822B2 - - Google Patents

Info

Publication number
JPH0363822B2
JPH0363822B2 JP60134658A JP13465885A JPH0363822B2 JP H0363822 B2 JPH0363822 B2 JP H0363822B2 JP 60134658 A JP60134658 A JP 60134658A JP 13465885 A JP13465885 A JP 13465885A JP H0363822 B2 JPH0363822 B2 JP H0363822B2
Authority
JP
Japan
Prior art keywords
resin
heat sink
mold layer
resin mold
bed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60134658A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61292346A (ja
Inventor
Toshihiro Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP60134658A priority Critical patent/JPS61292346A/ja
Priority to KR1019860004702A priority patent/KR900001833B1/ko
Priority to EP86304725A priority patent/EP0206771B1/en
Priority to DE8686304725T priority patent/DE3684184D1/de
Publication of JPS61292346A publication Critical patent/JPS61292346A/ja
Priority to US07/334,771 priority patent/US4924351A/en
Publication of JPH0363822B2 publication Critical patent/JPH0363822B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/10—
    • H10W72/884—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60134658A 1985-06-20 1985-06-20 樹脂封止型半導体装置 Granted JPS61292346A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP60134658A JPS61292346A (ja) 1985-06-20 1985-06-20 樹脂封止型半導体装置
KR1019860004702A KR900001833B1 (ko) 1985-06-20 1986-06-13 수지봉합형 반도체장치
EP86304725A EP0206771B1 (en) 1985-06-20 1986-06-19 Packaged semiconductor device
DE8686304725T DE3684184D1 (de) 1985-06-20 1986-06-19 Verkapselte halbleiteranordnung.
US07/334,771 US4924351A (en) 1985-06-20 1989-04-10 Recessed thermally conductive packaged semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60134658A JPS61292346A (ja) 1985-06-20 1985-06-20 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS61292346A JPS61292346A (ja) 1986-12-23
JPH0363822B2 true JPH0363822B2 (enExample) 1991-10-02

Family

ID=15133527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60134658A Granted JPS61292346A (ja) 1985-06-20 1985-06-20 樹脂封止型半導体装置

Country Status (2)

Country Link
JP (1) JPS61292346A (enExample)
KR (1) KR900001833B1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2503029B2 (ja) * 1987-10-06 1996-06-05 沖電気工業株式会社 薄型構造の半導体装置の製造方法
US5172213A (en) * 1991-05-23 1992-12-15 At&T Bell Laboratories Molded circuit package having heat dissipating post

Also Published As

Publication number Publication date
KR870000753A (ko) 1987-02-20
JPS61292346A (ja) 1986-12-23
KR900001833B1 (ko) 1990-03-24

Similar Documents

Publication Publication Date Title
US7061080B2 (en) Power module package having improved heat dissipating capability
US7671453B2 (en) Semiconductor device and method for producing the same
JP3435271B2 (ja) 半導体装置
KR100478883B1 (ko) 반도체장치
US7501700B2 (en) Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same
US5767573A (en) Semiconductor device
US9171773B2 (en) Semiconductor device
US4924351A (en) Recessed thermally conductive packaged semiconductor devices
US20100013070A1 (en) Power module package having excellent heat sink emission capability and method for manufacturing the same
US20010048148A1 (en) Semiconductor device and a method of manufacturing the same
JPH09139461A (ja) 半導体パワーモジュール
US5317194A (en) Resin-sealed semiconductor device having intermediate silicon thermal dissipation means and embedded heat sink
US5448825A (en) Method of making electrically and thermally enhanced integrated-circuit package
KR900001984B1 (ko) 수지봉합형 반도체장치
JPH0363822B2 (enExample)
EP0415106B1 (en) Lead frames for semiconductor device
JPH04249353A (ja) 樹脂封止型半導体装置
US6846697B2 (en) Integrated circuit packages and the method for making the same
JP2005353805A (ja) 半導体装置及びその製造方法
JPH0329307B2 (enExample)
US12464669B2 (en) Electronic devices and methods of manufacturing electronic devices
JP3142322B2 (ja) 樹脂封止型半導体装置
JPS6214944B2 (enExample)
JP2003258163A (ja) 半導体装置
JP2001015645A (ja) 樹脂封止型半導体装置およびその製造方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term