JPH0363822B2 - - Google Patents

Info

Publication number
JPH0363822B2
JPH0363822B2 JP13465885A JP13465885A JPH0363822B2 JP H0363822 B2 JPH0363822 B2 JP H0363822B2 JP 13465885 A JP13465885 A JP 13465885A JP 13465885 A JP13465885 A JP 13465885A JP H0363822 B2 JPH0363822 B2 JP H0363822B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP13465885A
Other versions
JPS61292346A (en
Inventor
Toshihiro Kato
Original Assignee
Tokyo Shibaura Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co filed Critical Tokyo Shibaura Electric Co
Priority to JP13465885A priority Critical patent/JPH0363822B2/ja
Priority claimed from DE8686304725A external-priority patent/DE3684184D1/en
Publication of JPS61292346A publication Critical patent/JPS61292346A/en
Publication of JPH0363822B2 publication Critical patent/JPH0363822B2/ja
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
JP13465885A 1985-06-20 1985-06-20 Expired - Lifetime JPH0363822B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13465885A JPH0363822B2 (en) 1985-06-20 1985-06-20

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP13465885A JPH0363822B2 (en) 1985-06-20 1985-06-20
KR8604702A KR900001833B1 (en) 1985-06-20 1986-06-13 Packaged semiconductor device
DE8686304725A DE3684184D1 (en) 1985-06-20 1986-06-19 Encapsulated semiconductor arrangement.
EP86304725A EP0206771B1 (en) 1985-06-20 1986-06-19 Packaged semiconductor device
US07/334,771 US4924351A (en) 1985-06-20 1989-04-10 Recessed thermally conductive packaged semiconductor devices

Publications (2)

Publication Number Publication Date
JPS61292346A JPS61292346A (en) 1986-12-23
JPH0363822B2 true JPH0363822B2 (en) 1991-10-02

Family

ID=15133527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13465885A Expired - Lifetime JPH0363822B2 (en) 1985-06-20 1985-06-20

Country Status (2)

Country Link
JP (1) JPH0363822B2 (en)
KR (1) KR900001833B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2503029B2 (en) * 1987-10-06 1996-06-05 沖電気工業株式会社 A method of manufacturing a semiconductor device of the thin structure
US5172213A (en) * 1991-05-23 1992-12-15 At&T Bell Laboratories Molded circuit package having heat dissipating post

Also Published As

Publication number Publication date
KR900001833B1 (en) 1990-03-24
JPS61292346A (en) 1986-12-23

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term