JPH0362789B2 - - Google Patents

Info

Publication number
JPH0362789B2
JPH0362789B2 JP30614387A JP30614387A JPH0362789B2 JP H0362789 B2 JPH0362789 B2 JP H0362789B2 JP 30614387 A JP30614387 A JP 30614387A JP 30614387 A JP30614387 A JP 30614387A JP H0362789 B2 JPH0362789 B2 JP H0362789B2
Authority
JP
Japan
Prior art keywords
magnetic
target
plate
magnetron sputtering
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP30614387A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01147063A (ja
Inventor
Kyuzo Nakamura
Yoshifumi Oota
Yasushi Higuchi
Akira Ishibashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP30614387A priority Critical patent/JPH01147063A/ja
Publication of JPH01147063A publication Critical patent/JPH01147063A/ja
Publication of JPH0362789B2 publication Critical patent/JPH0362789B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
JP30614387A 1987-12-03 1987-12-03 マグネトロン・スパッタ装置 Granted JPH01147063A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30614387A JPH01147063A (ja) 1987-12-03 1987-12-03 マグネトロン・スパッタ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30614387A JPH01147063A (ja) 1987-12-03 1987-12-03 マグネトロン・スパッタ装置

Publications (2)

Publication Number Publication Date
JPH01147063A JPH01147063A (ja) 1989-06-08
JPH0362789B2 true JPH0362789B2 (enrdf_load_stackoverflow) 1991-09-27

Family

ID=17953572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30614387A Granted JPH01147063A (ja) 1987-12-03 1987-12-03 マグネトロン・スパッタ装置

Country Status (1)

Country Link
JP (1) JPH01147063A (enrdf_load_stackoverflow)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19622606C2 (de) * 1996-06-05 2002-02-28 Applied Films Gmbh & Co Kg Sputterkathode
DE19622607B4 (de) * 1996-06-05 2007-12-27 Oerlikon Deutschland Holding Gmbh Sputterkathode
DE19747923C2 (de) * 1997-10-30 2002-09-12 Leybold Systems Gmbh Sputterkathode
DE19754986C2 (de) * 1997-12-11 2002-09-12 Leybold Systems Gmbh Sputterkathode
US7485210B2 (en) 2004-10-07 2009-02-03 International Business Machines Corporation Sputtering target fixture
EP2067874B1 (de) 2007-11-29 2011-03-02 W.C. Heraeus GmbH Magnetische Shunts in Rohrtargets
DE102007060306B4 (de) 2007-11-29 2011-12-15 W.C. Heraeus Gmbh Magnetische Shunts in Rohrtargets
US20110108416A1 (en) * 2009-11-10 2011-05-12 Cheng-Tsung Liu Magnetron sputter
US9580797B2 (en) * 2011-01-24 2017-02-28 Hitachi Metals, Ltd. Magnetic-field-generating apparatus for magnetron sputtering
DE112012001988T5 (de) 2011-05-30 2014-02-20 Hitachi Metals Ltd. Racetrack-förmige Magnetfeld-erzeugende Vorrichtung für Magnetron-Sputtern
WO2013115030A1 (ja) 2012-01-30 2013-08-08 日立金属株式会社 マグネトロンスパッタリング用磁場発生装置
TW201335405A (zh) * 2012-02-24 2013-09-01 Sumika Technology Co Ltd 複合式靶材及其製作方法
WO2015090373A1 (en) * 2013-12-17 2015-06-25 Applied Materials, Inc. Electrode assembly for deposition apparatus and method for assembling said electrode assembly

Also Published As

Publication number Publication date
JPH01147063A (ja) 1989-06-08

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