JPH0362789B2 - - Google Patents
Info
- Publication number
- JPH0362789B2 JPH0362789B2 JP30614387A JP30614387A JPH0362789B2 JP H0362789 B2 JPH0362789 B2 JP H0362789B2 JP 30614387 A JP30614387 A JP 30614387A JP 30614387 A JP30614387 A JP 30614387A JP H0362789 B2 JPH0362789 B2 JP H0362789B2
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- target
- plate
- magnetron sputtering
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 11
- 230000000694 effects Effects 0.000 description 8
- 239000000696 magnetic material Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 230000003628 erosive effect Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000011651 chromium Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910000889 permalloy Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30614387A JPH01147063A (ja) | 1987-12-03 | 1987-12-03 | マグネトロン・スパッタ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30614387A JPH01147063A (ja) | 1987-12-03 | 1987-12-03 | マグネトロン・スパッタ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01147063A JPH01147063A (ja) | 1989-06-08 |
| JPH0362789B2 true JPH0362789B2 (enrdf_load_stackoverflow) | 1991-09-27 |
Family
ID=17953572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30614387A Granted JPH01147063A (ja) | 1987-12-03 | 1987-12-03 | マグネトロン・スパッタ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01147063A (enrdf_load_stackoverflow) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19622607B4 (de) * | 1996-06-05 | 2007-12-27 | Oerlikon Deutschland Holding Gmbh | Sputterkathode |
| DE19622606C2 (de) * | 1996-06-05 | 2002-02-28 | Applied Films Gmbh & Co Kg | Sputterkathode |
| DE19747923C2 (de) * | 1997-10-30 | 2002-09-12 | Leybold Systems Gmbh | Sputterkathode |
| DE19754986C2 (de) * | 1997-12-11 | 2002-09-12 | Leybold Systems Gmbh | Sputterkathode |
| US7485210B2 (en) * | 2004-10-07 | 2009-02-03 | International Business Machines Corporation | Sputtering target fixture |
| EP2067874B1 (de) | 2007-11-29 | 2011-03-02 | W.C. Heraeus GmbH | Magnetische Shunts in Rohrtargets |
| DE102007060306B4 (de) | 2007-11-29 | 2011-12-15 | W.C. Heraeus Gmbh | Magnetische Shunts in Rohrtargets |
| US20110108416A1 (en) * | 2009-11-10 | 2011-05-12 | Cheng-Tsung Liu | Magnetron sputter |
| WO2012102092A1 (ja) * | 2011-01-24 | 2012-08-02 | 日立金属株式会社 | マグネトロンスパッタリング用磁場発生装置 |
| CN103562433B (zh) | 2011-05-30 | 2016-05-04 | 日立金属株式会社 | 跑道形状的磁控溅射用磁场产生装置 |
| JP5971262B2 (ja) | 2012-01-30 | 2016-08-17 | 日立金属株式会社 | マグネトロンスパッタリング用磁場発生装置 |
| TW201335405A (zh) * | 2012-02-24 | 2013-09-01 | Sumika Technology Co Ltd | 複合式靶材及其製作方法 |
| CN105900209B (zh) * | 2013-12-17 | 2018-03-23 | 应用材料公司 | 用于沉积设备的电极组件以及用于组装电极组件的方法 |
-
1987
- 1987-12-03 JP JP30614387A patent/JPH01147063A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01147063A (ja) | 1989-06-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |