JPH0362664U - - Google Patents
Info
- Publication number
- JPH0362664U JPH0362664U JP12007189U JP12007189U JPH0362664U JP H0362664 U JPH0362664 U JP H0362664U JP 12007189 U JP12007189 U JP 12007189U JP 12007189 U JP12007189 U JP 12007189U JP H0362664 U JPH0362664 U JP H0362664U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- solder
- moved
- molten solder
- movement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- 238000007654 immersion Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12007189U JPH0362664U (de) | 1989-10-13 | 1989-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12007189U JPH0362664U (de) | 1989-10-13 | 1989-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0362664U true JPH0362664U (de) | 1991-06-19 |
Family
ID=31668161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12007189U Pending JPH0362664U (de) | 1989-10-13 | 1989-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0362664U (de) |
-
1989
- 1989-10-13 JP JP12007189U patent/JPH0362664U/ja active Pending
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