JPH0248274U - - Google Patents
Info
- Publication number
- JPH0248274U JPH0248274U JP12834188U JP12834188U JPH0248274U JP H0248274 U JPH0248274 U JP H0248274U JP 12834188 U JP12834188 U JP 12834188U JP 12834188 U JP12834188 U JP 12834188U JP H0248274 U JPH0248274 U JP H0248274U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- molten solder
- semiconductor device
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 230000004907 flux Effects 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12834188U JPH0248274U (de) | 1988-09-29 | 1988-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12834188U JPH0248274U (de) | 1988-09-29 | 1988-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0248274U true JPH0248274U (de) | 1990-04-03 |
Family
ID=31381593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12834188U Pending JPH0248274U (de) | 1988-09-29 | 1988-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0248274U (de) |
-
1988
- 1988-09-29 JP JP12834188U patent/JPH0248274U/ja active Pending