JPH036050A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPH036050A JPH036050A JP14059989A JP14059989A JPH036050A JP H036050 A JPH036050 A JP H036050A JP 14059989 A JP14059989 A JP 14059989A JP 14059989 A JP14059989 A JP 14059989A JP H036050 A JPH036050 A JP H036050A
- Authority
- JP
- Japan
- Prior art keywords
- inner leads
- lead
- island
- prevent
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000510 noble metal Inorganic materials 0.000 claims abstract description 4
- 238000007789 sealing Methods 0.000 abstract description 4
- 238000007747 plating Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 1
- 239000000725 suspension Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体装置用のリードフレームに関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a lead frame for a semiconductor device.
従来のリードフレームは第3Q?l (a)〜(c)に
示すように、アイランド1と、アイランド1を枠2に支
持する吊ビン3と、アイランド1の周囲に配置して設け
た内部リードが、同一平面上に設けられており、内部リ
ードの先端部にはボンディング用のAu層等をめっきし
たバッド5が設けられていた。このなめ、第4図に示す
ようにリードフレームを重ねておくと、内部リードの先
端のバット部同志がAu層により互にくっついてしまう
ことがあった。Is the conventional lead frame in the 3rd Q? l As shown in (a) to (c), the island 1, the hanging bin 3 that supports the island 1 on the frame 2, and the internal leads arranged around the island 1 are provided on the same plane. A pad 5 plated with an Au layer or the like for bonding was provided at the tip of the internal lead. If the lead frames were overlapped as shown in FIG. 4, the butt portions at the tips of the internal leads would sometimes stick to each other due to the Au layer.
上述した従来のリードフレームは、同一平面上に形成し
ているため、リードフレームを重ね合わせた時に内部リ
ード先端のバット部同志がくっついてしまい、れを引剥
す際に内部リードが変形するという欠点がある。The above-mentioned conventional lead frames are formed on the same plane, so when the lead frames are overlapped, the butt parts of the tips of the internal leads stick together, and the internal leads are deformed when they are peeled off. There is.
また、モールド封止領域より内側の内部リードの長さが
短いものについては引張り強度が小さく抜けやすいとい
う欠点がある。Furthermore, a short length of the internal lead inside the mold sealing area has a disadvantage that the tensile strength is low and it is easy to come off.
本発明のリードフレームは、素子搭載用のアイランドと
、前記アイランドの周囲に配置し且つ先端部に貴金属膜
を設けたパッド部を有する内部リードとを備えたリード
フレームにおいて、前記内部リードの前記パッド部以外
の領域に設けた突起部を有する。The lead frame of the present invention includes an island for mounting an element, and an internal lead having a pad portion disposed around the island and having a noble metal film at the tip, wherein the pad of the internal lead is It has a protrusion provided in an area other than the area.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第1図(a)〜(c)は本発明の一実施例を示す平面図
及びx−x’線断面図並びにA部拡大図である。FIGS. 1(a) to 1(c) are a plan view, a sectional view taken along line xx', and an enlarged view of part A, showing an embodiment of the present invention.
第1図(a)〜(c)に示すように、素子搭載用のアイ
ランド1と、アイランド1を枠2に支持する吊ビン3と
、アイランド1の周囲に配置して枠2に支持された内部
リード4と、内部リード4の先端部にAu層等をめっき
して設けたパッド部5と、パッド部5を設けた領域以外
で且つ封止領域6の内側の内部リード4の一部にプレス
加工により設けた突起部7とを有してリードフレームが
構成される。As shown in FIGS. 1(a) to (c), there is an island 1 for mounting elements, a hanging bin 3 that supports the island 1 on the frame 2, and a hanging bin 3 arranged around the island 1 and supported on the frame 2. The internal lead 4, the pad portion 5 provided by plating the tip of the internal lead 4 with an Au layer, etc., and a portion of the internal lead 4 outside the area where the pad portion 5 is provided and inside the sealing area 6. A lead frame is constituted by the protrusion 7 provided by press working.
第2図(a)、(b)は本発明のり−ドフレームを重ね
た状態を示す断面図及びB部拡大図である。FIGS. 2(a) and 2(b) are a sectional view and an enlarged view of part B showing a state in which the glued frames of the present invention are stacked.
第2図(a)、(b)に示すように、内部り−ド4に設
けた突起部7によりリードフレームを重ねた状態におい
てもAu層5が互に接触せず、内部リード4の先端部が
Au層5により互にくっつくことを防止する。As shown in FIGS. 2(a) and 2(b), the protrusions 7 provided on the internal leads 4 prevent the Au layers 5 from coming into contact with each other even when the lead frames are stacked, and the tips of the internal leads 4 are prevented from coming into contact with each other. The Au layer 5 prevents the parts from sticking together.
また、この突起部7により封止した樹脂体から内部リー
ド4が抜は出すことを防止する効果を有する。Further, the protrusion 7 has the effect of preventing the internal lead 4 from being pulled out from the sealed resin body.
以上説明した様に本発明は内部リードの先端部に設けた
貴金属層以外の領域に突起部を設けることにより、リー
ドフレームを重ね合わせた時の内部リード同志のくっつ
きを防止してくっつきの引剥しによる内部リードの変形
を防止できるという効果を有する。As explained above, the present invention prevents the internal leads from sticking to each other when lead frames are overlapped by providing a protrusion in an area other than the noble metal layer provided at the tip of the internal lead, thereby making it possible to peel off the sticking. This has the effect of preventing deformation of the internal leads due to
また、外部リードの引張り強度が増し、封止した樹脂体
より内部リードが抜けにくくなり、内部リードを経由し
て侵入する汚染を減少させるという効果を有する。Furthermore, the tensile strength of the external leads is increased, and the internal leads are less likely to come off than the sealed resin body, which has the effect of reducing contamination that enters via the internal leads.
第1図(a)〜(c)は本発明の一実施例を示す平面図
及びx−x’線断面図並びにA部拡大図、第2図(a)
、(b)は本発明のリードフレームを重ねた状態を示す
断面図及びB部拡大図、第3図(a)〜(C)は従来の
リードフレームの一例を示す平面図及びY−Y’線断面
図並びにC部拡大図、第4図は従来のリードフレームを
重ねた状態を示す部分断面図である。
1・・・アイランド、2・・・枠、3・・・吊ビン、4
・・・内部リード、5・・・パッド部、6・・・封止領
域、7・・・突起部。FIGS. 1(a) to (c) are a plan view, a sectional view taken along the line xx', and an enlarged view of part A, and FIG. 2(a) shows an embodiment of the present invention.
, (b) is a cross-sectional view and an enlarged view of part B showing the stacked lead frames of the present invention, and FIGS. 3(a) to (C) are plan views and Y-Y' showing an example of a conventional lead frame. A line sectional view and an enlarged view of part C, and FIG. 4 are partial sectional views showing a state in which conventional lead frames are stacked. 1...Island, 2...Frame, 3...Hanging bottle, 4
. . . Internal lead, 5. Pad portion, 6. Sealing region, 7. Projection portion.
Claims (1)
置し且つ先端部に貴金属膜を設けたパッド部を有する内
部リードとを備えたリードフレームにおいて、前記内部
リードの前記パッド部以外の領域に設けた突起部を有す
ること特徴とするリードフレーム。In a lead frame comprising an island for mounting an element, and an internal lead having a pad portion disposed around the island and having a noble metal film at the tip thereof, the internal lead is provided in an area other than the pad portion of the internal lead. A lead frame characterized by having a protrusion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14059989A JPH036050A (en) | 1989-06-02 | 1989-06-02 | Lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14059989A JPH036050A (en) | 1989-06-02 | 1989-06-02 | Lead frame |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH036050A true JPH036050A (en) | 1991-01-11 |
Family
ID=15272451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14059989A Pending JPH036050A (en) | 1989-06-02 | 1989-06-02 | Lead frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH036050A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010056372A (en) * | 2008-08-29 | 2010-03-11 | Sanyo Electric Co Ltd | Resin sealed semiconductor device, and method of manufacturing the same |
-
1989
- 1989-06-02 JP JP14059989A patent/JPH036050A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010056372A (en) * | 2008-08-29 | 2010-03-11 | Sanyo Electric Co Ltd | Resin sealed semiconductor device, and method of manufacturing the same |
US8648452B2 (en) | 2008-08-29 | 2014-02-11 | Sanyo Semiconductor Co., Ltd. | Resin molded semiconductor device and manufacturing method thereof |
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