JPH0360100A - Surface mounting component - Google Patents
Surface mounting componentInfo
- Publication number
- JPH0360100A JPH0360100A JP1195516A JP19551689A JPH0360100A JP H0360100 A JPH0360100 A JP H0360100A JP 1195516 A JP1195516 A JP 1195516A JP 19551689 A JP19551689 A JP 19551689A JP H0360100 A JPH0360100 A JP H0360100A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- lead
- punched hole
- component
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims abstract description 23
- 229910000679 solder Inorganic materials 0.000 claims abstract description 10
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 238000004080 punching Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は表面実装用部品に関し、特に半田付リード部に
半田フィレットを長く形成する様なぬき穴構造を有する
半田付リードを持つ表面実装用部品に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a surface mount component, and particularly to a surface mount component having a soldering lead having a perforated hole structure in which a long solder fillet is formed in the soldering lead portion. Regarding parts.
従来、この種の表面実装用部品においては、半田付され
るリードは、半田付部の外形が長方形又は円形の形状と
なっていた。Conventionally, in this type of surface mount component, the lead to be soldered has a soldered portion having a rectangular or circular outer shape.
上述した従来のリード形状を有した表面実装用部品にお
いては、半田付時のフィレット長さは外形そのものに依
存している。その為、半田付された後の衝撃力などに対
する部品の半田付強度を上げようとすれば、リード面積
を大きく取る必要がある。即ち、従来こうした表面実装
用部品の取り付けにおいては、例えば１．５ｍの高さか
らの自由落下衝撃時、０．４グラム−以下の単位リード
面積当りの荷重でないと、半田付強度が保てないという
不具合があり、その為、取付強度を向上させる為には、
本体固定部のリード面積自体を広げなければならないと
いう欠点がある。In the above-mentioned conventional surface mount components having lead shapes, the fillet length during soldering depends on the outer shape itself. Therefore, in order to increase the soldering strength of components against impact forces after soldering, it is necessary to increase the lead area. In other words, conventionally, when attaching such surface mount components, soldering strength cannot be maintained unless the load per unit lead area is 0.4 grams or less when subjected to a free fall impact from a height of 1.5 m, for example. Therefore, in order to improve the mounting strength,
There is a drawback that the lead area of the main body fixing part itself must be increased.
ところが近年、表面実装部品の品種が拡大し、自重が１
グラムを越える部品が多く採用されるに至り、半田付強
度をスルーホール実装レベルに改善する必要性が求めら
れているが製品設計面においては半田付リード部の面積
拡大が受は入れ難いという問題があった。However, in recent years, the variety of surface mount components has expanded, and the dead weight has decreased by 1.
As more and more parts are being used, it is necessary to improve the soldering strength to the level of through-hole mounting, but in terms of product design, the problem is that it is difficult to accept the increased area of soldering leads. was there.
本発明は、部品本体から外側方向へ突出されたり又は該
部品本体の下部に曲げられた半田付用リード部を有する
表面実装用部品において、半田付フィレットの長さを長
く形成する様なぬき穴構造を前記半田付用リード部に備
えている。The present invention provides a surface mount component having a soldering lead portion that is protruded outward from the component body or bent at the bottom of the component body, in which a perforated hole is formed to form a long soldering fillet. A structure is provided on the soldering lead portion.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）、（ｂ）、（ｃ）は本発明の一実施例の平
面図、正面図、側面図、第２図（ａ）ないしくｄ）は本
実施例に用いるぬき穴構造の４例を示す平面図、第３図
及び第４図は本実施例に係る引っ張り試験の状況を示す
断面図及び引っ張り変位量と荷重の特性を示すグラフで
ある。Figures 1 (a), (b), and (c) are a plan view, front view, and side view of one embodiment of the present invention, and Figures 2 (a) to d) are hole structures used in this embodiment. FIGS. 3 and 4 are plan views showing the four examples, and sectional views showing the situation of the tensile test according to the present example, and graphs showing the characteristics of the amount of tensile displacement and load.
本実施例は部品本体１、この部品本体１から外側に半田
付される本体固定用リード２ａ、２ｂ及び信号線用リー
ド３ａ、３ｂ、３ｃ、３ｄから形成されている。ここで
本体固定用リード２ａ、２ｂにはリードフィレット長を
長く形成させるためのＵ字形ぬき穴構造が採用されてい
る。This embodiment consists of a component body 1, body fixing leads 2a, 2b, and signal line leads 3a, 3b, 3c, and 3d soldered to the outside of the component body 1. Here, the main body fixing leads 2a and 2b have a U-shaped perforation structure for forming a long lead fillet.
このぬき穴構遺の形状としては、第２図（ａ）ないしく
ｄ）に示すようなものが考えられる。Possible shapes of this hole structure are as shown in Figures 2 (a) to d).
第２図（ａ）は本実施例に用いたのと同じＵ字形ぬき穴
形状４を示し、その他第２図（ｂ）。FIG. 2(a) shows the same U-shaped hole shape 4 as used in this embodiment, and FIG. 2(b) shows the other shape.
（Ｃ）、（ｄ）の如く、それぞれ円形ぬき穴形状５、長
円形ぬき穴形状６及びＵ字形連結ぬき穴形状７が実用に
供し得る。As shown in (C) and (d), a circular perforation shape 5, an oval perforation shape 6, and a U-shaped connecting perforation shape 7 can be used practically.
このように、半田付リードの強度を保つ要素として、半
田付フィレットの長さが支配的である。As described above, the length of the soldering fillet is a dominant factor in maintaining the strength of the soldering lead.
これは第３図のリード形状での引っ張りによる強度試験
において明らかとなる。第３図の強度試験はＱＦＰ部品
リーす形の部品リード１１、半田フィレット１２、銅箔
１３及びプリント基板の基材１４の構成において、矢印
Ａ方向に引っ張り荷重をかける。こうした条件の下では
、第４図に示す様な引っ張り変位−荷重の特性を示す。This becomes clear in a tensile strength test using the lead shape shown in FIG. In the strength test shown in FIG. 3, a tensile load is applied in the direction of arrow A on the QFP component leash-shaped component lead 11, solder fillet 12, copper foil 13, and printed circuit board base material 14. Under these conditions, the tensile displacement-load characteristics shown in FIG. 4 are exhibited.
第４図のＢ部は最大強度点であるが、これは第３図の半
田フィレット１２が破断す・る瞬間まで保ち、この半田
フィレット１２の破断によって著しく減少する。この結
果、半田付強度においては、半田フィレット１２が支配
的であることがわかる。The point B in FIG. 4 is the maximum strength point, which is maintained until the moment when the solder fillet 12 in FIG. 3 breaks, and is significantly reduced by the breakage of the solder fillet 12. As a result, it can be seen that the solder fillet 12 is dominant in terms of soldering strength.
かかる条件の下で半田付面積を拡大せずに半田付強度を
向上せしめる為には、半田付リード部にぬき穴構造を設
け、半田付フィレット長を長く取ることが有効である。In order to improve the soldering strength without increasing the soldering area under such conditions, it is effective to provide a perforated structure in the soldering lead portion and to increase the soldering fillet length.
こうしたリード形状の適用は、部品リードが部品本体か
ら外側に形成されているもののみならず、部品本体下部
に曲げ形成された表面実装用部品についても有効なこと
は明らかである。It is clear that the application of such a lead shape is effective not only for components in which component leads are formed outside the component body, but also for surface mount components that are bent and formed at the bottom of the component body.
以上説明した様に本発明は、半田付リード部に半田フィ
レット長を長くする様なぬき穴構造を設けることにより
、部品リード面積を拡大せずに取付強度を向上できる効
果がある。As explained above, the present invention has the effect of improving the mounting strength without enlarging the component lead area by providing the solder lead portion with a hole structure that increases the solder fillet length.
第１図＜ａ）、（ｂ）、（ｃ）は本発明の一実施例の平
面図、正面図、側面図、第２図（ａ）ないしくｄ）は本
実施例に用いるぬき穴構造の４例を示す平面図、第３図
及び第４図は本実施例に係る引っ張り試験の状況を示す
断面図及び引っ張り変位量と荷重の特性を示すグラフで
ある。
ｌ・・・部品本体、２ａ、２ｂ・・・本体固定用リード
、３ａ、３ｂ、３ｃ、３ｄ−信号線用リード、４・・・
Ｕ字形ぬき穴形状、５・・・円形ぬき穴形状、６・・・
長円形ぬき穴形状、７・・・Ｕ字形連結ぬき穴形状、１
１・・・部品リード、１２・・・半田フィレット、１３
・・・銅箔、１４・・・プリント基板の基材。Fig. 1 <a), (b), and (c) are a plan view, front view, and side view of one embodiment of the present invention, and Fig. 2 (a) to d) are the through hole structures used in this embodiment. FIGS. 3 and 4 are plan views showing the four examples, and sectional views showing the situation of the tensile test according to the present example, and graphs showing the characteristics of the amount of tensile displacement and load. l... Part body, 2a, 2b... Lead for fixing the main body, 3a, 3b, 3c, 3d- Lead for signal line, 4...
U-shaped hole shape, 5... Circular hole shape, 6...
Oval hole shape, 7...U-shaped connected hole shape, 1
1... Component lead, 12... Solder fillet, 13
...Copper foil, 14...Base material for printed circuit board.
Claims (1)
の下部に曲げられた半田付用リード部を有する表面実装
用部品において、半田付フィレットの長さを長く形成す
る様なぬき穴構造を前記半田付用リード部に備えること
を特徴とする表面実装用部品。In a surface mount component that has a soldering lead portion that protrudes outward from the component body or is bent at the bottom of the component body, the soldering hole structure that forms a long solder fillet is used. A surface mount component characterized by being provided in an attachment lead part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1195516A JP2522399B2 (en) | 1989-07-27 | 1989-07-27 | Surface mount parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1195516A JP2522399B2 (en) | 1989-07-27 | 1989-07-27 | Surface mount parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0360100A true JPH0360100A (en) | 1991-03-15 |
| JP2522399B2 JP2522399B2 (en) | 1996-08-07 |
Family
ID=16342384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1195516A Expired - Fee Related JP2522399B2 (en) | 1989-07-27 | 1989-07-27 | Surface mount parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2522399B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015072947A (en) * | 2013-10-01 | 2015-04-16 | セイコーインスツル株式会社 | Semiconductor device and manufacturing method of the same |
| JP2019087741A (en) * | 2017-11-06 | 2019-06-06 | ローム株式会社 | Semiconductor device and method of manufacturing the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60686A (en) * | 1983-06-17 | 1985-01-05 | Hitachi Ltd | Magnetic bubble memory device |
| JPS6219776U (en) * | 1985-07-18 | 1987-02-05 | ||
| JPS6423814U (en) * | 1987-07-31 | 1989-02-08 |
-
1989
- 1989-07-27 JP JP1195516A patent/JP2522399B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60686A (en) * | 1983-06-17 | 1985-01-05 | Hitachi Ltd | Magnetic bubble memory device |
| JPS6219776U (en) * | 1985-07-18 | 1987-02-05 | ||
| JPS6423814U (en) * | 1987-07-31 | 1989-02-08 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015072947A (en) * | 2013-10-01 | 2015-04-16 | セイコーインスツル株式会社 | Semiconductor device and manufacturing method of the same |
| JP2019087741A (en) * | 2017-11-06 | 2019-06-06 | ローム株式会社 | Semiconductor device and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2522399B2 (en) | 1996-08-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |