JPH02128411A - Lead terminal of surface package component - Google Patents
Lead terminal of surface package componentInfo
- Publication number
- JPH02128411A JPH02128411A JP28195188A JP28195188A JPH02128411A JP H02128411 A JPH02128411 A JP H02128411A JP 28195188 A JP28195188 A JP 28195188A JP 28195188 A JP28195188 A JP 28195188A JP H02128411 A JPH02128411 A JP H02128411A
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- fillets
- lead
- soldering
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims abstract description 14
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 10
- 239000011889 copper foil Substances 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 2
- 238000004299 exfoliation Methods 0.000 abstract 2
- 241000272168 Laridae Species 0.000 description 5
- 239000000428 dust Substances 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は表面実装部品のリード端子に関し、特に基板表
面へのはんだ付けを行う表面実装部品のリード端子に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead terminal for a surface mount component, and more particularly to a lead terminal for a surface mount component that is soldered to the surface of a substrate.
従来、この種の表面実装部品のリード端子としては、ガ
ルウィング端子、Ｊリード端子、バット端子などが一般
的に用いられている。Conventionally, gull wing terminals, J lead terminals, butt terminals, and the like have been commonly used as lead terminals for this type of surface mount component.
第３図（ａ）〜（ｃ）はそれぞれかかる従来の例を示す
リード端子の斜視図である。FIGS. 3(a) to 3(c) are perspective views of lead terminals showing such conventional examples.
まず、第３１ｆｆｉ（ａ＞に示すガルウィング端子１１
Ａは銅箔塵１４との接合面積を大きくとれる利点がある
。また、第３図（ｂ）に示すＪリード端子１１Ｂは立上
り部が両側にあるので小さなフィレットも両側に形成さ
れる。更に、第３図（Ｃ）に示すバット端子１１Ｃは接
合面積が小さいので、銅箔塵１４を小さく高密度実装を
可能にしている。First, the gull wing terminal 11 shown in the 31st ffi (a>
A has the advantage that the bonding area with the copper foil dust 14 can be increased. Further, since the J lead terminal 11B shown in FIG. 3(b) has rising portions on both sides, small fillets are also formed on both sides. Furthermore, since the butt terminal 11C shown in FIG. 3(C) has a small bonding area, the copper foil dust 14 is small and high-density mounting is possible.
第４図は第３図（ａ）に示すガルウィング形リード端子
のはんだ付け後の断面図である。FIG. 4 is a sectional view of the gull wing type lead terminal shown in FIG. 3(a) after soldering.
第４図に示すように、かかるリード端子１１Ａはプリン
ト基板１３上に設けられた銅箔塵１４にはんだ付けされ
、フィレット１５Ａ、１５Ｂにより固定される。この場
合、リード端子１１Ａの立上り部に形成されるフィレッ
ト１５Ａは大きく、リード端子１１Ａの先端に形成され
るフィレット１５Ｂは小さくなってい゛る。As shown in FIG. 4, this lead terminal 11A is soldered to a copper foil dust 14 provided on a printed circuit board 13 and fixed by fillets 15A and 15B. In this case, the fillet 15A formed at the rising portion of the lead terminal 11A is large, and the fillet 15B formed at the tip of the lead terminal 11A is small.
しかしながら、上述した第３図（ａ）〜（ｃ、 ）およ
び第４図に示す従来の表面実装部品のリード端子の形状
では、はんだ付後の部品取付けの信頼性に最も重要なフ
ィレットが大きく形成されにくく、はんだ付け後の振動
や衝撃に対し表面実装部品がプリント基板から剥離しや
すいという欠点を有している。However, in the shapes of the lead terminals of conventional surface mount components shown in FIGS. 3(a) to 3(c) and FIG. This method has the disadvantage that surface-mounted components are easily peeled off from the printed circuit board due to vibrations and shocks after soldering.
本発明の目的は、かかるはんだ付け後の部品取り付けの
信頼性を高めることのできる表面実装部品のリード端子
を提供することにある。An object of the present invention is to provide a lead terminal for a surface mount component that can improve the reliability of component attachment after soldering.
本発明の表面実装部品のリード端子は、プリント基板等
の表面に実装しはんだ付けにより固定する表面実装部品
のリード端子において、リード先端に前記基板表面に対
する屈曲部を形成し、はんだ付け時のはんだフィレット
を三箇所以上に形成するように構成される。The lead terminal of a surface mount component of the present invention is a lead terminal of a surface mount component that is mounted on the surface of a printed circuit board etc. and fixed by soldering. It is configured to form fillets at three or more locations.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を示す表面実装部品リード端
子の斜視図である。FIG. 1 is a perspective view of a surface mount component lead terminal showing one embodiment of the present invention.
第１図に示すように、本実施例は従来のＪリード端子に
相当するものであるが、このＪリード形状部１の先端に
屈曲部２Ａ、２Ｂ、２Ｃを形成し、はんだ付け時のはん
だフィレットを三箇所以上に形成するようにしたもので
ある。すなわち、本実施例においては、Ｊリード形状部
１に続く領域で一つの７字部を形成するとともに、屈曲
部２Ａと屈曲部２Ｂ、２Ｃとで別の７字部を形成するこ
とにより、この両側にもはんだフィレットが形成されや
すいようにしている。さらに、本実施例では屈曲部２Ａ
、２Ｂと屈曲部２Ｃとの間にスリット（溝）を形成して
いる。As shown in FIG. 1, this embodiment corresponds to a conventional J-lead terminal, but bent portions 2A, 2B, and 2C are formed at the tip of this J-lead shaped portion 1 to prevent soldering during soldering. Fillets are formed in three or more places. That is, in this embodiment, one character 7 part is formed in the region following the J lead shape part 1, and another character 7 part is formed by the bent part 2A and the bent parts 2B and 2C. Solder fillets are also easily formed on both sides. Furthermore, in this embodiment, the bent portion 2A
, 2B and the bent portion 2C.
要するに、本実施例は二つの７字部を屈曲部として形成
することにより合計四箇所のフィレットの形成を実現し
ている。In short, this embodiment realizes the formation of fillets at four locations in total by forming the two 7-shaped portions as bent portions.
第２図は第１図に示すリード端子のはんだ付け後の断面
図である。FIG. 2 is a sectional view of the lead terminal shown in FIG. 1 after soldering.
第２図に示すように、リード端子１をプリント基板３上
の銅箔座４にはんだ付けし、Ｊリード形状部１と屈曲部
２Ａ、２Ｂと銅箔座４との間にはんだフィレット５Ａ〜
５Ｄを形成している。このように、本実施例では大きな
四箇所のフィレットが形成されるため、前述した従来例
のガルウィング形リード端子（第４図）と比較しても、
フィレット５Ａ〜５Ｄが倍になり、しかもフィレット１
５Ｂが小さかったのに対し大きく形成できるため、表面
実装部品と銅箔座４との剥離強度は飛躍的に高まり、は
んだ付け後の振動や衝撃等に対する信頼性が向上する。As shown in FIG. 2, the lead terminal 1 is soldered to the copper foil seat 4 on the printed circuit board 3, and solder fillets 5A to 5 are placed between the J lead shaped portion 1, the bent portions 2A and 2B, and the copper foil seat 4.
It forms 5D. In this way, since four large fillets are formed in this embodiment, even compared to the conventional gull wing type lead terminal (Fig. 4) described above,
Fillets 5A to 5D are doubled, and fillet 1
5B was small, but since it can be formed larger, the peel strength between the surface mount component and the copper foil seat 4 is dramatically increased, and reliability against vibrations, shocks, etc. after soldering is improved.
以上説明したように、本発明の表面実装部品のリード端
子はその先端に屈曲部を形成し、基板表面との間で三箇
所以上のフィレットを形成することができるので、表面
実装部品と基板表面の銅箔座とを強固に固定し、もって
剥離強度を飛躍的に高め、振動や衝撃等に対する信頼性
を向上させることができるという効果がある。As explained above, the lead terminal of the surface mount component of the present invention can form a bent part at its tip and form fillets in three or more places between the surface mount component and the surface of the board. This has the effect of firmly fixing the copper foil seat to the copper foil seat, thereby dramatically increasing peel strength and improving reliability against vibrations, shocks, etc.
第１図は本発明の一実施例を示す表面実装部品リード端
子の斜視図、第２図は第１図に示すリード端子のはんだ
付け後の断面図、第３図（ａ）〜（Ｃ）はそれぞれ異っ
た従来の例を示すリード端子の斜視図、第４図は第３図
（ａ）に示すガルウィング形リード端子のはんだ付け後
の断面図である。
１・・・Ｊリード形状部、２Ａ〜２Ｃ・・・屈曲部、３
・・・プリント基板、４・・・銅箔座、５Ａ〜５Ｄ・・
・はんだフィレット。Fig. 1 is a perspective view of a surface mount component lead terminal showing an embodiment of the present invention, Fig. 2 is a sectional view of the lead terminal shown in Fig. 1 after soldering, and Figs. 3 (a) to (C). 4 is a perspective view of a lead terminal showing different conventional examples, and FIG. 4 is a cross-sectional view of the gull wing type lead terminal shown in FIG. 3(a) after soldering. 1...J lead shape part, 2A to 2C...bending part, 3
...Printed circuit board, 4...Copper foil seat, 5A-5D...
・Solder fillet.
Claims (1)
する表面実装部品のリード端子において、リード先端に
前記基板表面に対する屈曲部を形成し、はんだ付け時の
はんだフィレットを三箇所以上に形成するようにしたこ
とを特徴とする表面実装部品のリード端子。In a lead terminal of a surface mount component mounted on the surface of a printed circuit board, etc. and fixed by soldering, a bending portion relative to the surface of the board is formed at the tip of the lead, and solder fillets are formed at three or more locations during soldering. A lead terminal for surface mount components characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28195188A JPH02128411A (en) | 1988-11-07 | 1988-11-07 | Lead terminal of surface package component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28195188A JPH02128411A (en) | 1988-11-07 | 1988-11-07 | Lead terminal of surface package component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02128411A true JPH02128411A (en) | 1990-05-16 |
Family
ID=17646182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28195188A Pending JPH02128411A (en) | 1988-11-07 | 1988-11-07 | Lead terminal of surface package component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02128411A (en) |
-
1988
- 1988-11-07 JP JP28195188A patent/JPH02128411A/en active Pending
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