JPH0358441A - Tape-shaped lead - Google Patents

Abstract

PURPOSE:To prevent the deformation of leads even in the case where the width between the leads and the interval between the adjacent leads are made narrow and to make it possible to connect reliably a semiconductor element with the leads by a method wherein the inner connecting lead parts, which are made to protrude in the opening part of an insulating substrate and are arranged in the opening part, of the leads are supported by auxiliary insulating substrates. CONSTITUTION:Each thin film lead 2 is constituted of an inner connecting lead part 3, an outer connecting lead part 4 and a pad part 5 for measurement use and the lead parts 3 are made to project in an opening part 1a provided in an insulating substrate 1. On the other hand, the substrate 1 has auxiliary insulating substrates 6 formed into the form of a square frame in the interior of the opening part 1a and these substrates 6 are connected to the lead parts 3 and the parts 3 are supported by the substrates 6. In such a way, as the lead parts 3 of the leads 2 are supported by the substrates 6, the deformation of the leads is prevented even in the case where the width between the leads and the interval between the adjacent leads are made narrow and the relative positional deviation of a semiconductor element to electrode pads is prevented. Thereby, the connection of the element with the leads can be reliably conducted an the integration of the leads 2 can be further increased.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a tape-shaped lead used in a semiconductor integrated circuit [Prior Art] Conventionally, this type of tape-shaped lead, so-called TAB (T
Ape Autos+ated Bonding) tape is shown in plan view and C-
As shown in the sectional view taken along line C, an opening 1a is formed in the wAa substrate 1, and a plurality of thin film leads 2 made of thin conductive foil are attached facing the opening 1a. These thin film leads 2 include an internal connection lead part 3 protruding into the opening la, an external connection lead part 4, and a measurement pad part 5, and are arranged around the opening la.

Then, a semiconductor element (not shown) is connected to the internal connection lead part 3 in the opening la, and then a conduction test is performed using the measurement pad part 5. , connects to external lead-out terminals, etc. of packages, etc.

[Problem to be solved by the invention]

In the conventional TAB tape described above, the thin film lead 2 is made of a thin conductive foil or the like, and the internal connection lead part 3 is formed in the opening l.
Since the internal connection lead part 3 is protruded into the inside part 3, as the number of bins increases in semiconductor integrated circuits, the width of the internal connection lead part 3 and the distance between adjacent leads become narrower. This causes a problem in that the relative position of the semiconductor element with the electrode pad becomes misaligned, making it difficult to connect the semiconductor element. SUMMARY OF THE INVENTION An object of the present invention is to provide a TAB tape that prevents deformation of internal connection lead portions and enables reliable connection of semiconductor elements.

[Means for Solving the Problems] In the TAB tape of the present invention, an internal connection lead portion protruding from an opening provided in an insulating substrate is supported by an auxiliary insulating substrate disposed within the opening.

[Effect]

In the above-described configuration, each internal connection lead portion of the thin film lead is supported by the auxiliary insulating substrate, so that deformation can be prevented even if the lead width or the interval between adjacent leads is narrowed.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 shows a first embodiment of the present invention, and FIG.
is a plan view, and FIG. 3(b) is a longitudinal cross-sectional view taken along the line A-A. In the figure, ■ is an insulating substrate, 2 is this insulating substrate 1
This is a thin film lead with a conductive foil or the like formed into a desired pattern on the surface.

This thin film lead 2 has internal connection lead parts 3,
It consists of an external connection lead part 4 and a measurement pad part 5, and the internal connection lead part 3 is made to protrude into an opening la provided in the insulating substrate l. On the other hand, the insulating substrate 1 has a rectangular frame-shaped auxiliary insulating substrate 6 inside the opening 1a, and this auxiliary insulating substrate 6 is connected and supported by the internal connection reat portion 3.

This auxiliary insulating substrate 6 is used when forming the thin film adhesive 2 on the insulating substrate 1 and then opening the opening 1a in the insulating substrate 1.
By leaving a part of it, it is possible to make a statement at the same time.

In this TAB tape, each internal connection lead part 3 of the thin film lead 2 is supported by the auxiliary insulating substrate 6, so even if the lead width or the interval between adjacent leads is narrowed, deformation is prevented, and the electrode pad of the semiconductor element Relative positional deviation with respect to is prevented.

This makes it possible to reliably connect semiconductor elements and to further increase the integration of thin film leads. Incidentally, in this example, compared to the conventional TAB tape, the interval between the internal connection lead portions 3 can be reduced to 1/2, and the number of thin film leads can be increased by 20%.

FIG. 2 shows a second embodiment of the present invention, and FIG.
is a plan view, and FIG.

Note that the same parts as in FIG. 1 are given the same reference numerals.

In this embodiment, the auxiliary insulating substrate 6A has a simple square shape, and each internal connection lead portion 3 of the thin film lead is supported on the auxiliary insulating substrate 6A.

According to this configuration, it is possible to obtain the same effect as in the first embodiment, and here, the surface of the semiconductor element connected to the internal connection lead part 3 can be covered with the auxiliary insulating substrate 6A. This has the effect of protecting semiconductor elements from mechanical contact. [Effects of the Invention] As explained above, in the present invention, the internal connection lead portions protruding into the opening of the insulating substrate are supported by the auxiliary insulating substrate, so each internal connection lead portion is supported by the auxiliary insulating substrate. Even if the lead width or the interval between adjacent leads is narrowed, deformation can be prevented and semiconductor elements can be reliably connected.

[Brief explanation of drawings]

FIG. 1 shows a first embodiment of the present invention, and FIG.
is a plan view, FIG. 2(b) is a sectional view taken along the line A-Ai, and FIG. A cross-sectional view along the line B-B, the third
The figures show a conventional TAB tape, where (a) is a plan view and (b) is a cross-sectional view taken along the line CC. l... Insulating substrate, 1a... Opening, 2... Thin film lead, 3... Internal connection lead part, 4... External connection lead part, 5... Measurement pad part, 6, 6A... Auxiliary insulation board. (b) Figure 2 (b)

Claims (1)

[Claims] 1. In a tape-shaped lead in which a thin film lead is formed on an insulating substrate, and an internal connection lead portion of the thin film lead is arranged to protrude into an opening provided in the insulating substrate, an auxiliary insulating substrate is disposed within the opening, A tape-shaped lead characterized in that the internal connection lead portion is supported by the auxiliary insulating substrate.