JPH0358181B2 - - Google Patents

Info

Publication number
JPH0358181B2
JPH0358181B2 JP58046879A JP4687983A JPH0358181B2 JP H0358181 B2 JPH0358181 B2 JP H0358181B2 JP 58046879 A JP58046879 A JP 58046879A JP 4687983 A JP4687983 A JP 4687983A JP H0358181 B2 JPH0358181 B2 JP H0358181B2
Authority
JP
Japan
Prior art keywords
lead
brazing
lead frame
ceramic package
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58046879A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59172254A (ja
Inventor
Mitsunori Ueno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP58046879A priority Critical patent/JPS59172254A/ja
Publication of JPS59172254A publication Critical patent/JPS59172254A/ja
Publication of JPH0358181B2 publication Critical patent/JPH0358181B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58046879A 1983-03-19 1983-03-19 フラットタイプのセラミックパツケ−ジにおけるリ−ドフレ−ムのろう付け方法およびそのリ−ドフレ−ム Granted JPS59172254A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58046879A JPS59172254A (ja) 1983-03-19 1983-03-19 フラットタイプのセラミックパツケ−ジにおけるリ−ドフレ−ムのろう付け方法およびそのリ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58046879A JPS59172254A (ja) 1983-03-19 1983-03-19 フラットタイプのセラミックパツケ−ジにおけるリ−ドフレ−ムのろう付け方法およびそのリ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS59172254A JPS59172254A (ja) 1984-09-28
JPH0358181B2 true JPH0358181B2 (cs) 1991-09-04

Family

ID=12759639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58046879A Granted JPS59172254A (ja) 1983-03-19 1983-03-19 フラットタイプのセラミックパツケ−ジにおけるリ−ドフレ−ムのろう付け方法およびそのリ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS59172254A (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2608287B2 (ja) * 1987-06-12 1997-05-07 イビデン 株式会社 黒鉛製治具

Also Published As

Publication number Publication date
JPS59172254A (ja) 1984-09-28

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