JPH0357944U - - Google Patents
Info
- Publication number
- JPH0357944U JPH0357944U JP11953489U JP11953489U JPH0357944U JP H0357944 U JPH0357944 U JP H0357944U JP 11953489 U JP11953489 U JP 11953489U JP 11953489 U JP11953489 U JP 11953489U JP H0357944 U JPH0357944 U JP H0357944U
- Authority
- JP
- Japan
- Prior art keywords
- steel
- estimating
- carbon content
- mold
- sample
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11953489U JPH0357944U (en, 2012) | 1989-10-12 | 1989-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11953489U JPH0357944U (en, 2012) | 1989-10-12 | 1989-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0357944U true JPH0357944U (en, 2012) | 1991-06-05 |
Family
ID=31667653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11953489U Pending JPH0357944U (en, 2012) | 1989-10-12 | 1989-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0357944U (en, 2012) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017195420A (ja) * | 2014-09-30 | 2017-10-26 | 株式会社三社電機製作所 | 半導体モジュール |
| JP2020053502A (ja) * | 2018-09-26 | 2020-04-02 | 株式会社ケーヒン | パワーモジュール |
| JP2020145307A (ja) * | 2019-03-06 | 2020-09-10 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
-
1989
- 1989-10-12 JP JP11953489U patent/JPH0357944U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017195420A (ja) * | 2014-09-30 | 2017-10-26 | 株式会社三社電機製作所 | 半導体モジュール |
| JP2020053502A (ja) * | 2018-09-26 | 2020-04-02 | 株式会社ケーヒン | パワーモジュール |
| JP2020145307A (ja) * | 2019-03-06 | 2020-09-10 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
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