JPH0356173U - - Google Patents
Info
- Publication number
- JPH0356173U JPH0356173U JP11614489U JP11614489U JPH0356173U JP H0356173 U JPH0356173 U JP H0356173U JP 11614489 U JP11614489 U JP 11614489U JP 11614489 U JP11614489 U JP 11614489U JP H0356173 U JPH0356173 U JP H0356173U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- board
- soldered
- plate
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案に係る電子部品の実装構造の一
実施例の構成を示す図で、ａは側面図、ｂは平面
図、第２図は従来の電子部品の実装構造の一例の
構成を示す側面図である。
１……パワーデバイス、２……金属ベース基板
、３……端子リード、１４……クリツプ、１４ａ
……略Ｕ字形部、１４ｂ……略Ｌ字形部。
FIG. 1 is a diagram showing the configuration of an embodiment of an electronic component mounting structure according to the present invention, in which a is a side view, b is a plan view, and FIG. 2 is a diagram showing the configuration of an example of a conventional electronic component mounting structure. FIG. DESCRIPTION OF SYMBOLS 1... Power device, 2... Metal base board, 3... Terminal lead, 14... Clip, 14a
...Approximately U-shaped part, 14b... Approximately L-shaped part.
Claims (1)
するように該基板上に立てて配設し、該電子部品
の端子リードを基板に半田付けすると共に、該電
子部品の上端部を挟み込んだクリツプの下端部を
基板に半田付けしたことを特徴とする電子部品の
実装構造。 A plate-shaped electronic component is placed upright on the board so that its plate surface is substantially orthogonal to the board surface, and the terminal leads of the electronic component are soldered to the board, and the upper end of the electronic component is sandwiched. An electronic component mounting structure characterized in that the lower end of the clip is soldered to the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11614489U JPH0356173U (en) | 1989-10-04 | 1989-10-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11614489U JPH0356173U (en) | 1989-10-04 | 1989-10-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0356173U true JPH0356173U (en) | 1991-05-30 |
Family
ID=31664444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11614489U Pending JPH0356173U (en) | 1989-10-04 | 1989-10-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356173U (en) |
-
1989
- 1989-10-04 JP JP11614489U patent/JPH0356173U/ja active Pending
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