JPH0356144U - - Google Patents

Info

Publication number
JPH0356144U
JPH0356144U JP1989116274U JP11627489U JPH0356144U JP H0356144 U JPH0356144 U JP H0356144U JP 1989116274 U JP1989116274 U JP 1989116274U JP 11627489 U JP11627489 U JP 11627489U JP H0356144 U JPH0356144 U JP H0356144U
Authority
JP
Japan
Prior art keywords
signal wiring
ceramic
semiconductor chip
gold
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989116274U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989116274U priority Critical patent/JPH0356144U/ja
Publication of JPH0356144U publication Critical patent/JPH0356144U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
JP1989116274U 1989-10-02 1989-10-02 Pending JPH0356144U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989116274U JPH0356144U (cg-RX-API-DMAC10.html) 1989-10-02 1989-10-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989116274U JPH0356144U (cg-RX-API-DMAC10.html) 1989-10-02 1989-10-02

Publications (1)

Publication Number Publication Date
JPH0356144U true JPH0356144U (cg-RX-API-DMAC10.html) 1991-05-30

Family

ID=31664557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989116274U Pending JPH0356144U (cg-RX-API-DMAC10.html) 1989-10-02 1989-10-02

Country Status (1)

Country Link
JP (1) JPH0356144U (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009166901A (ja) * 2009-03-16 2009-07-30 Mochida Pharmaceut Co Ltd スティック型包装体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009166901A (ja) * 2009-03-16 2009-07-30 Mochida Pharmaceut Co Ltd スティック型包装体

Similar Documents

Publication Publication Date Title
JPH01161736A (ja) 半導体装置用パッケージ
JPH0356144U (cg-RX-API-DMAC10.html)
JPH0442924Y2 (cg-RX-API-DMAC10.html)
JPS6329949U (cg-RX-API-DMAC10.html)
JPH0373444U (cg-RX-API-DMAC10.html)
JPH0336137U (cg-RX-API-DMAC10.html)
JPH02131353U (cg-RX-API-DMAC10.html)
JPH0295246U (cg-RX-API-DMAC10.html)
JPS62145341U (cg-RX-API-DMAC10.html)
JPH0367430U (cg-RX-API-DMAC10.html)
JPH0310540U (cg-RX-API-DMAC10.html)
JPS6185162U (cg-RX-API-DMAC10.html)
JPH0476045U (cg-RX-API-DMAC10.html)
JPH0343738U (cg-RX-API-DMAC10.html)
JPS58196843U (ja) 半導体装置
JPH0474441U (cg-RX-API-DMAC10.html)
JPS63228647A (ja) マイクロ波集積回路装置
JPS6120050U (ja) 集積回路用セラミツクパツケ−ジ
JPS60121649U (ja) 気密端子
JPH0766311A (ja) 半導体装置用パッケージ
JPS63178340U (cg-RX-API-DMAC10.html)
JPS6245837U (cg-RX-API-DMAC10.html)
JPS63157946U (cg-RX-API-DMAC10.html)
JPH0279046U (cg-RX-API-DMAC10.html)
JPH0247058U (cg-RX-API-DMAC10.html)