JPH0353492Y2 - - Google Patents

Info

Publication number

JPH0353492Y2

JPH0353492Y2 JP1987052880U JP5288087U JPH0353492Y2 JP H0353492 Y2 JPH0353492 Y2 JP H0353492Y2 JP 1987052880 U JP1987052880 U JP 1987052880U JP 5288087 U JP5288087 U JP 5288087U JP H0353492 Y2 JPH0353492 Y2 JP H0353492Y2

Authority

JP

Japan

Prior art keywords

printed circuit

circuit board

plating layer

cathode

solid electrolytic

Prior art date

1987-04-08

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 238000007747 plating Methods 0.000 claims description 28
• 229910000679 solder Inorganic materials 0.000 claims description 23
• 239000003990 capacitor Substances 0.000 claims description 18
• 239000007787 solid Substances 0.000 claims description 16
• 230000008018 melting Effects 0.000 claims description 10
• 238000002844 melting Methods 0.000 claims description 10
• ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 9
• 238000005476 soldering Methods 0.000 description 6
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
• 229910000881 Cu alloy Inorganic materials 0.000 description 2
• 229910000990 Ni alloy Inorganic materials 0.000 description 2
• 239000010949 copper Substances 0.000 description 2
• 230000006866 deterioration Effects 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 230000002093 peripheral effect Effects 0.000 description 1
• 239000011347 resin Substances 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1
• 238000003466 welding Methods 0.000 description 1