JPH0352726Y2 - - Google Patents

Info

Publication number
JPH0352726Y2
JPH0352726Y2 JP16900885U JP16900885U JPH0352726Y2 JP H0352726 Y2 JPH0352726 Y2 JP H0352726Y2 JP 16900885 U JP16900885 U JP 16900885U JP 16900885 U JP16900885 U JP 16900885U JP H0352726 Y2 JPH0352726 Y2 JP H0352726Y2
Authority
JP
Japan
Prior art keywords
tray
electronic components
electronic component
sensor
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16900885U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6277109U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16900885U priority Critical patent/JPH0352726Y2/ja
Publication of JPS6277109U publication Critical patent/JPS6277109U/ja
Application granted granted Critical
Publication of JPH0352726Y2 publication Critical patent/JPH0352726Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Chutes (AREA)
  • Stacking Of Articles And Auxiliary Devices (AREA)
JP16900885U 1985-10-31 1985-10-31 Expired JPH0352726Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16900885U JPH0352726Y2 (enrdf_load_stackoverflow) 1985-10-31 1985-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16900885U JPH0352726Y2 (enrdf_load_stackoverflow) 1985-10-31 1985-10-31

Publications (2)

Publication Number Publication Date
JPS6277109U JPS6277109U (enrdf_load_stackoverflow) 1987-05-18
JPH0352726Y2 true JPH0352726Y2 (enrdf_load_stackoverflow) 1991-11-15

Family

ID=31102417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16900885U Expired JPH0352726Y2 (enrdf_load_stackoverflow) 1985-10-31 1985-10-31

Country Status (1)

Country Link
JP (1) JPH0352726Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6084846B2 (ja) * 2013-01-15 2017-02-22 株式会社イシダ 箱詰め装置

Also Published As

Publication number Publication date
JPS6277109U (enrdf_load_stackoverflow) 1987-05-18

Similar Documents

Publication Publication Date Title
JPH0352726Y2 (enrdf_load_stackoverflow)
EP0269336A3 (en) Semiconductor integrated circuit packages
EP0371172B1 (en) Device for automatically weighing objects in conveyance
EP0960665A1 (en) Control device of continuous material feed device
TW588011B (en) A leadframe loader system
CN113787276A (zh) 一种自适应调整水平度的封装机焊头
JPH01312862A (ja) 半導体装置のリード成形装置
JPH0126174B2 (enrdf_load_stackoverflow)
JP2808726B2 (ja) 電子部品実装方法
JP2798654B2 (ja) ボンディング装置
CN209766389U (zh) 一种适用于芯片封装植球工位自动运转托盘的定位结构
JPH11283999A (ja) リードフレーム搬送装置
JPH05283463A (ja) ワイヤボンディング方法
JPH09183525A (ja) 板状物への保護シート挿入装置
KR0139478Y1 (ko) Bga 반도체패키지용 오토트림 시스템의 자재감지장치
KR100212018B1 (ko) 엘오씨 패캐이지 제조용 칩 부착장치 및 칩 부착방법
JPH05235233A (ja) リ−ドフレ−ム
JPS649175A (en) Method for packaging precise processed electronic part such as lead frame
KR0117626Y1 (ko) 반도체 제조장비의 패키지 오 정렬 검지장치
KR100658887B1 (ko) 반도체패키지 제조용 금형
JPS5868032U (ja) ワイヤボンデイング装置
KR19990043902A (ko) 회로기판 파손방지장치를 갖는 언로더
SU1709571A1 (ru) Устройство дл подачи плоских ферромагнитных изделий
JPH0644900Y2 (ja) 移替装置に於ける被処理物の支持片
KR0127522Y1 (ko) 반도체패키지의 포밍장치