JPH0352535B2 - - Google Patents

Info

Publication number
JPH0352535B2
JPH0352535B2 JP4736183A JP4736183A JPH0352535B2 JP H0352535 B2 JPH0352535 B2 JP H0352535B2 JP 4736183 A JP4736183 A JP 4736183A JP 4736183 A JP4736183 A JP 4736183A JP H0352535 B2 JPH0352535 B2 JP H0352535B2
Authority
JP
Japan
Prior art keywords
target
magnetic field
magnet
sputtering
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4736183A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59173265A (ja
Inventor
Ichiro Fujita
Hideaki Ootake
Tooru Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4736183A priority Critical patent/JPS59173265A/ja
Publication of JPS59173265A publication Critical patent/JPS59173265A/ja
Publication of JPH0352535B2 publication Critical patent/JPH0352535B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3458—Electromagnets in particular for cathodic sputtering apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP4736183A 1983-03-22 1983-03-22 スパツタ装置 Granted JPS59173265A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4736183A JPS59173265A (ja) 1983-03-22 1983-03-22 スパツタ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4736183A JPS59173265A (ja) 1983-03-22 1983-03-22 スパツタ装置

Publications (2)

Publication Number Publication Date
JPS59173265A JPS59173265A (ja) 1984-10-01
JPH0352535B2 true JPH0352535B2 (zh) 1991-08-12

Family

ID=12772973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4736183A Granted JPS59173265A (ja) 1983-03-22 1983-03-22 スパツタ装置

Country Status (1)

Country Link
JP (1) JPS59173265A (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6260866A (ja) * 1985-08-02 1987-03-17 Fujitsu Ltd マグネトロンスパツタ装置
GB8909747D0 (en) * 1989-04-27 1989-06-14 Ionic Coatings Limited Sputtering apparatus
US5417833A (en) * 1993-04-14 1995-05-23 Varian Associates, Inc. Sputtering apparatus having a rotating magnet array and fixed electromagnets
GB9606920D0 (en) * 1996-04-02 1996-06-05 Applied Vision Ltd Magnet array for magnetrons
JP4371569B2 (ja) * 2000-12-25 2009-11-25 信越化学工業株式会社 マグネトロンスパッタ装置とそれを用いたフォトマスクブランクの製造方法
CN104862653B (zh) * 2015-05-20 2017-07-07 魏永强 电弧离子镀和高功率脉冲磁控溅射复合的沉积方法
CN105803411A (zh) * 2016-05-11 2016-07-27 魏永强 电弧离子镀和孪生靶双极性高功率脉冲磁控溅射复合方法
CN109989039A (zh) * 2017-12-30 2019-07-09 魏永强 一种组合磁场、组合管和多孔挡板复合的真空沉积方法

Also Published As

Publication number Publication date
JPS59173265A (ja) 1984-10-01

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