JPH0351849U - - Google Patents

Info

Publication number
JPH0351849U
JPH0351849U JP1989112645U JP11264589U JPH0351849U JP H0351849 U JPH0351849 U JP H0351849U JP 1989112645 U JP1989112645 U JP 1989112645U JP 11264589 U JP11264589 U JP 11264589U JP H0351849 U JPH0351849 U JP H0351849U
Authority
JP
Japan
Prior art keywords
semiconductor device
land portion
arrangement
pellet
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989112645U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0741164Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989112645U priority Critical patent/JPH0741164Y2/ja
Publication of JPH0351849U publication Critical patent/JPH0351849U/ja
Application granted granted Critical
Publication of JPH0741164Y2 publication Critical patent/JPH0741164Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1989112645U 1989-09-26 1989-09-26 半導体装置 Expired - Lifetime JPH0741164Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989112645U JPH0741164Y2 (ja) 1989-09-26 1989-09-26 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989112645U JPH0741164Y2 (ja) 1989-09-26 1989-09-26 半導体装置

Publications (2)

Publication Number Publication Date
JPH0351849U true JPH0351849U (it) 1991-05-20
JPH0741164Y2 JPH0741164Y2 (ja) 1995-09-20

Family

ID=31661088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989112645U Expired - Lifetime JPH0741164Y2 (ja) 1989-09-26 1989-09-26 半導体装置

Country Status (1)

Country Link
JP (1) JPH0741164Y2 (it)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012108011A1 (ja) * 2011-02-09 2012-08-16 三菱電機株式会社 パワー半導体モジュール

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109194153A (zh) 2010-11-02 2019-01-11 三菱电机株式会社 电动式动力转向用电源模块及使用其的电动式动力转向驱动控制装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63151055A (ja) * 1986-12-16 1988-06-23 Matsushita Electronics Corp 複合型半導体装置
JPS63255953A (ja) * 1987-04-13 1988-10-24 Sanken Electric Co Ltd 絶縁物封止型回路装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63151055A (ja) * 1986-12-16 1988-06-23 Matsushita Electronics Corp 複合型半導体装置
JPS63255953A (ja) * 1987-04-13 1988-10-24 Sanken Electric Co Ltd 絶縁物封止型回路装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012108011A1 (ja) * 2011-02-09 2012-08-16 三菱電機株式会社 パワー半導体モジュール
JP5669866B2 (ja) * 2011-02-09 2015-02-18 三菱電機株式会社 パワー半導体モジュール
US9129949B2 (en) 2011-02-09 2015-09-08 Mitsubishi Electric Corporation Power semiconductor module

Also Published As

Publication number Publication date
JPH0741164Y2 (ja) 1995-09-20

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