JPH0350858A - Lead frame for semiconductor device - Google Patents
Lead frame for semiconductor deviceInfo
- Publication number
- JPH0350858A JPH0350858A JP18650189A JP18650189A JPH0350858A JP H0350858 A JPH0350858 A JP H0350858A JP 18650189 A JP18650189 A JP 18650189A JP 18650189 A JP18650189 A JP 18650189A JP H0350858 A JPH0350858 A JP H0350858A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- conductive parts
- chip
- bonded
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 6
- 239000004642 Polyimide Substances 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 229920001721 polyimide Polymers 0.000 abstract description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、主に樹脂封止型半導体装置に利用することの
できるリードフレームに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a lead frame that can be mainly used in resin-sealed semiconductor devices.
従来の技術
従来半導体装置用リードフレームは、チップサイズに応
じて、インナーリード部を設計、製作してきている。2. Description of the Related Art In conventional lead frames for semiconductor devices, inner lead portions have been designed and manufactured depending on the chip size.
発明が解決しようとする課題
しかし、従来技術においては、１つのインナリード形状
では、インナーリードからチップへのワイヤーボンドの
ワイヤー長の制限からアセンブリできるチップサイズが
限定されてしまう。そのためインナーリード形状は数種
類以上必要であった。Problems to be Solved by the Invention However, in the prior art, with one inner lead shape, the chip size that can be assembled is limited due to the limitation on the wire length of the wire bond from the inner lead to the chip. Therefore, several types or more of inner lead shapes were required.
本発明はこのような問題点を解決した半導体装置用リー
ドフレームを提供することを目的とするものである。An object of the present invention is to provide a lead frame for a semiconductor device that solves these problems.
課題を解決するための手段
この目的を達成するために本発明の半導体装置用リード
フレームは、ダイパッドに放射線状に導伝性部を有する
非導電性シートをはりつけた構造を有している。Means for Solving the Problems In order to achieve this object, the lead frame for a semiconductor device of the present invention has a structure in which a non-conductive sheet having a conductive portion in a radial manner is adhered to a die pad.
作 用
この構造により、チップを非導伝性の接着剤で非導伝性
シートにダイボンドし、チップかう放射線状の導伝性部
へ、また導伝性部からインナーリードヘワイヤーポンド
することで１つのインナーリード形状から広いチップサ
イズをアセンブリ可能とすることができる。Function: With this structure, the chip is die-bonded to a non-conductive sheet using a non-conductive adhesive, and wire bonded to the radial conductive part of the chip and from the conductive part to the inner leads. A wide range of chip sizes can be assembled from one inner lead shape.
実施例
第１図は本発明をクワッドタイプのリードフレレームに
実施したときの平面図であυ、第２図は一部拡大断面図
である。第３図と異なるのはダイパッドに放射線状に導
伝性部を有する非導伝性シートをはりつけたことで、こ
の構造により、より広いチップサイズをアセンブリ可能
とした。非導伝性シートとしては、アルミナ、ポリイミ
ド等の中から効果が大になるように選択できる。Embodiment FIG. 1 is a plan view of the present invention applied to a quad-type reed frame, and FIG. 2 is a partially enlarged sectional view. The difference from FIG. 3 is that a non-conductive sheet having radial conductive parts is attached to the die pad, and this structure allows assembly of a wider chip size. The non-conductive sheet can be selected from alumina, polyimide, etc. in order to maximize the effect.
発明の詳細
な説明したように、本発明においては、ダイパッドに放
射線状に導伝性部を有する非導伝性シートをはりつける
構造を有することにより、１つのインナーリード形状に
よシ広いチップサイズをアセンブリすることを可能にす
る。As described in detail, the present invention has a structure in which a non-conductive sheet having conductive parts in a radial manner is attached to the die pad, so that a wide chip size can be accommodated in one inner lead shape. allow for assembly.
第１図は本発明をクワッドタイプのリードフレームに実
施したときの平面図、第２図は断面図、第３図は従来の
リードフレームの平面図である。
１・・・・・・非導電性シート、２・・・・・・導電性
部、３・・・・・・ダイパッド、４・・・・・・インナ
ーリード、５・・・・・・ダムバー
第
図
？FIG. 1 is a plan view of the present invention applied to a quad-type lead frame, FIG. 2 is a sectional view, and FIG. 3 is a plan view of a conventional lead frame. 1... Non-conductive sheet, 2... Conductive part, 3... Die pad, 4... Inner lead, 5... Dam bar Diagram?
Claims (1)
する非導電性シートをはりつけたことを特徴とする半導
体装置用リードフレーム。A lead frame for a semiconductor device, characterized in that a non-conductive sheet having a radial conductive portion is attached to a die pad of the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18650189A JPH0350858A (en) | 1989-07-19 | 1989-07-19 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18650189A JPH0350858A (en) | 1989-07-19 | 1989-07-19 | Lead frame for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350858A true JPH0350858A (en) | 1991-03-05 |
Family
ID=16189597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18650189A Pending JPH0350858A (en) | 1989-07-19 | 1989-07-19 | Lead frame for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350858A (en) |
-
1989
- 1989-07-19 JP JP18650189A patent/JPH0350858A/en active Pending
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