JPH0350631Y2 - - Google Patents

Description

[Detailed Description of the Invention] Technical Field The present invention relates to the structure of a socket for contacting a flat type IC package.

Prior Art An IC package socket accommodates an IC package and is used for performance testing of IC products, for example, by being incorporated into a checker or the like as is. Accordingly
When accommodating an IC package in a cage, each lead and contact pin must be connected accurately, but in recent years, the leads of IC package cages have been becoming smaller and more dense, and accurate engagement between the leads of such IC package and contact pins has become necessary. requires advanced socket molding technology. However, socket manufacturing technology such as resin molding has certain limitations in terms of mold processing and mold strength, so it is necessary to accommodate the IC packages appropriately in response to the trend toward higher density IC packages. The reality is that it is extremely difficult to manufacture a socket that can be used with

Purpose In view of the above-mentioned circumstances, the purpose of the present invention is to provide a socket for an IC package that can accommodate even an IC package having high-density leads accurately and easily.

Overview This purpose, according to the present invention, is to provide contact pin insertion grooves in parallel in the socket body that accommodates the IC,
In an IC package socket in which contact pins are planted in these grooves and the contact portions with the corresponding leads protrude above the contact pin insertion grooves,
A lead guide wall that intervenes between each lead of the IC is raised above the height of the contact pin, and on the other hand, the lead guide wall is placed on the inner surface of the cover attached to the socket body in the direction along each contact portion between the lead and the contact pin. A pad is provided on the inside or outside of the wall, so that when the cover is closed, the pad presses on each lead, bringing the contact pin into contact with the lead.

Embodiments Hereinafter, the present invention will be explained in detail based on illustrated embodiments.

As shown in FIG. 1, the basic structure of the socket for an IC package is a socket body 1, a cover 2 pivotally attached to one end of the body 1 so that it can be opened and closed, and a stopper 3 that is attached to the other end of the body 1 so that it can be opened and closed. It consists of

The socket body 1 has an IC accommodating part 4 in the center of the upper surface, and contact pin insertion grooves 5 are arranged in parallel on two opposing peripheries of the accommodating part 4.
The number and arrangement of these grooves are determined according to the leads of the IC to be accommodated, and in this embodiment, they are provided on two opposing sides, but when the leads are provided along the four sides of a rectangular IC, this groove is provided. They are provided on four sides corresponding to a rectangle. A contact pin 6 is planted in the contact pin insertion groove 5, and a contact portion 7 of the pin that contacts the lead b protrudes above the upper surface of the socket body 1, and a contact portion 7 of the pin that contacts the lead b protrudes above the upper surface of the socket body 1. The leg 8 of the contact pin 6 is extended. The contact portion 7 of each contact pin corresponds one-to-one with the lead b of the accommodated IC package, and each lead is stacked on top of the respective contact portion. Further, between each contact pin insertion groove 5, a guide rib 9 projects onto the upper surface of the socket body 1 integrally with the socket body 1, and both side surfaces of each guide rib 9 on the contact pin insertion groove side are provided with lead guide walls 10. It is raised to the same height as the contact pin 6 or higher. That is, the lead guide wall 10 has a height that is at least greater than the height of the contact portion 7 of the contact pin 6. When the IC package is accommodated, the lead guide wall 10 intervenes between the leads, thereby preventing the leads b from shifting laterally, and ensuring accurate one-to-one correspondence with the contact pins 6.
Further, the guide ribs may be provided over all the locations, or may be provided in several locations.

A cover 2 is pivotally attached to one end of the socket body 1, and a lead pressing pad 11 is integrally formed with the cover 2 on its inner surface. The pad 11 has a horizontally elongated shape, extends along the longitudinal direction of the IC when the IC is housed, and has at least the length of the lead array as seen in the longitudinal direction of the IC.

The pivoting of the cover 2 to the socket body 1 is smooth and free of play, and the cover 2 can always be accurately closed to the socket body 1. Padded 11
When the socket body 1 containing the IC is closed,
The upper surface of each lead is traversed along each contact portion between each lead and the contact pin to bring each lead into resilient contact with the contact pin. In this embodiment, the lead is placed outside the guide rib 9 when the cover is closed as shown in FIG. 3, but it may be placed inside the guide rib 9 to press against the lead as shown in FIG. good.

A stopper 3 attached to the other end of the socket main body 1 has a convex portion 12 that engages with a recess (not shown) provided in the cover 2, and when the cover 2 is closed, the cover 2 closes in the socket. It is securely fixed to the main body 1.

FIG. 3 shows a state in which the IC package is accommodated in the socket, the cover 2 is closed, and the cover is locked by the stopper 3. Since the pad 11 presses the lead b on the outside of the guide rib 9 and is locked by the cover 2 by the stopper 3, the resilient contact between the lead and the contact pin is maintained.

The position at which the pad 11 presses the lead b is either outside or inside the guide rib 9, and this position is appropriately selected depending on the type of IC package to be accommodated. Conventional slit plate intervention
In IC holding, in order to press each lead with each slit plate corresponding to each IC lead, the slit plate must be formed to fit the same narrow pitch as the pitch of the IC lead. When using the IC holder, even the slightest misalignment of each slit plate was not allowed.

Effects of the invention As mentioned above, the lead guide wall interposed between each lead of the IC package cage is raised above the height of the contact pin, so the IC package cage is accurately positioned and housed, and the entire lead is covered by the pads. Since the leads are pressed all at once, accurate pressure contact with the contact pin can be obtained. Moreover, since this elastic pressure is applied at a position outside or inside the guide rib, the lead guide wall and the pad do not interfere with each other, and can be properly held by closing and locking the cover. Furthermore, the structure of the pad can be extremely simplified compared to conventional pads, which is advantageous in terms of molding process.

[Brief explanation of the drawing]

Figures 1 and 2 are an overall perspective view and a plan view of the IC package socket of the present invention, and Figure 3 is an IC package socket.
FIG. 4 is a sectional view showing a state in which the IC package is accommodated and a guide rib wall is provided on the inside; FIG. 4 is a sectional view showing a state in which the IC package is accommodated and a guide rib wall is provided on the outside. DESCRIPTION OF SYMBOLS 1...Socket body, 2...Cover, 3...Stopper, 4...Accommodation part, 5...Contact pin insertion groove, 6...Contact pin, 7...Contact part,
8...leg, 9...guide rib, 10...lead guide wall, 11...pad, a...IC package,
b...Lead.

Claims (1)

[Scope of utility model registration request] A large number of contact pin insertion grooves are arranged in parallel in the socket body that accommodates the IC, and the contact pins in each groove are planted so that the contact portion with the lead protrudes above the contact pin insertion groove to correspond to each of the contact portions. In a socket for an IC package in which the leads can be brought into contact, a lead guide wall intervening between the leads is raised to a height higher than the contact pin, and the inner surface of a cover pivotally attached to the socket body is raised to a height above the contact pin. A pad is provided on the inside or outside of the lead guide wall in a direction along each contact portion between the lead and the contact pin, and when the cover is closed, the pad presses the lead to bring the contact pin and the lead into contact. A socket for an IC package cage, which is characterized by the following features: