JPH035027B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an IC socket having contacts arranged to make contact with a large number of leads projecting laterally of an IC package body.

2. Prior Art As shown in FIG. 7, an IC package called a flat type IC package has a large number of leads 2 projecting laterally from an IC package body 1 and arranged in a row.

The lead 2 can be bent in two stages and arranged in a crab-leg shape, protruding to the side, as shown in Figure 7A, or straight, as shown in Figure 7B. There are some that are arranged in a shape that projects laterally.

Conventionally, a socket for an IC package as described above has been provided with, for example, a horizontal U-shaped mounting piece having elasticity in the vertical direction on its contacts, and the lower surface of the IC lead 2 is placed on the tip of the mounting contact piece. It is common to press the contact portion from above with a presser cover to displace the contact piece downward, and to obtain contact pressure by its upward restoring elasticity.

Problems to be solved by the invention In the above-mentioned contact type IC socket,
It is necessary to provide the contact with good vertical elasticity, and therefore it is necessary to provide the contact piece with a horizontally U-shaped bend as described above.

Since the mounting contact piece is extended horizontally so as to support the lead at its tip, a large amount of space is required for installing the contact in the area outside the lead tip, which has the drawback of increasing the external size of the socket body.

Furthermore, even if the IC package is made smaller, the socket body becomes larger, which is a factor that reduces the packaging density.

In addition, in the above-mentioned contact type IC socket, since the upward force of the above-mentioned contact piece acts on the lead, the lead is closed against the elasticity of the contact piece to prevent it from popping out and to maintain the contact pressure. The attachment of the presser foot cover and its lock lever is essential.

Means for Solving the Problems The present invention provides a socket for an IC package that completely changes the contact form of the contact type IC socket described above and eliminates the above-mentioned problems inherent in the conventional example. Unlike conventional sockets in which the lead is placed on the contact and contact pressure is obtained by the upward elasticity of the lead, the contact piece of the contact is placed on the IC.
When mounting the package cage, while intervening from the bottom to the top of the lead, the engaging part provided on the contact piece is engaged with the upper edge of one side of the lead to maintain the contact position. The structure is such that lateral pressure is applied to one side, and the lateral pressure brings the other side of the lead into contact with the contact partition wall to obtain positioning and contact pressure from the engaging portion.

Effect In the present invention, the contact portion of the contact is interposed between the leads from below to above, and the contact is laterally displaced so as to apply lateral pressure to one side of the lead, so that the contact extends vertically. Therefore, it is possible to design the contact installation area to approximately the area where the leads protrude.
Unlike the conventional method, a large amount of installation space is not required in the outer area of the lead tip, and the outer shape of the socket body can be made as small as possible.

Also, in the present invention, as described above, the socket body is made as close to the size of the IC package as possible,
It is possible to improve the packaging density.

Further, in the present invention, while applying lateral pressure to one side of the lead, the lateral pressure causes the engaging portion provided on the contact to engage with the upper edge of the one side of the lead, and at the same time, the lateral pressure causes the other side of the lead to contact the contact partition wall. Since the configuration is adopted to obtain the positioning of the lead and the contact pressure by the lateral force, the contact can be made without the necessity of attaching a presser cover and its lock lever, which are closed against the upward elasticity of the contact, as in the past. The pressure can be ensured, and contact can be properly maintained by engaging the engaging portion provided on the contact piece of the contact with the upper edge of one side of the lead by the lateral pressure.

Embodiment The drawings illustrate, as an embodiment, a socket intended for an IC package in which the leads 2 as shown in FIG. 7A are arranged in a crab-like shape on the side of the IC package body 1 and protrude.

In the figure, reference numeral 3 denotes a socket body made of an insulating housing, and the socket body 3 has a large number of contact housing chambers 6 arranged in parallel and separated by partition walls 5 that are open at the upper surface. 6 has a contact 4 arranged corresponding to the lead 2 described above. An IC package storage chamber 7 is defined between the rows of the contact storage chambers 6 as described above,
The contact accommodating chamber 6 is opened at a portion facing the IC package accommodating chamber 7, so that the lead 2 can be freely moved in and out. That is, the IC package cage 1 is housed in the housing chamber 7, its bottom is supported by the housing chamber bottom wall 7a, and the leads 2 are supported by the partition wall 5 of the housing chamber 6.
Intervene between them and make contact with Contact 4, which will be described below.

The contact 4 has a first contact piece 4a and a second contact piece 4 extending vertically in the contact housing chamber 6.
b, the connecting base of the first contact piece 4a and the second contact piece 4b is press-fitted into the bottom of the storage chamber, and the male terminal 4c connected to the connecting base is inserted into the socket body 3.
protrudes downward.

The first contact piece 4a and the second contact piece 4b are arranged side by side in the lead extension direction as shown in the figure, and each is arranged so that its tip faces the side surface of the lead. That is, as described above, the first contact piece 4a extends vertically from below the lead toward above the lead 2 so as to be substantially perpendicular to the lead extension direction, and its tip part intervenes between the leads from below to above, thereby extending the lead. 2 upper shoulder part 2a
Similarly, the second contact piece 4b is arranged so as to face the side surface.
is extended in the vertical direction, and its tip is inserted between the leads from below to above, and is arranged so as to face the side surface of the lower shoulder portion 2b of the lead 2.

A lead guide piece 4d having a constant elevation angle is provided at the tips of the first contact piece 4a and the second contact piece 4b, and the lead 2 is slid into the lead guide piece 4d using the guide piece 4d as a guide. The first contact piece 4a and the second contact piece 4b can be elastically displaced in the direction toward or away from the side surface of the lead 2, and as the lead slides in, the first contact piece 4a and the second contact piece 4b are elastically displaced in the direction away from the lead side surface and exert a spring force. The contact pressure is applied to the side of the lead with a predetermined contact pressure. Due to the contact pressure, the first and second contact pieces 4a and 4b apply lateral force to the lead 2, and the lead 2
The side surface opposite to the side where 4b contacts is abutted and supported by the partition wall 5 for positioning. At the same time, the lateral pressure applied to one side of the lead 2 by the first and second contact pieces 4a and 4b brings the other side of the lead 2 into contact with the partition wall and positions it, thereby reducing the contact pressure of the contact piece in contact with the one side of the lead 2. Hold securely. The partition wall 5, ie, the lead positioning wall, may be provided at a location corresponding to all the leads, or may be provided at a limited location to restrict a plurality of leads in each lead row.

An engaging portion 4e that engages with the upper edge of the side portion of the lead 2 is curved at the contact portion of the first contact piece 4a and the second contact piece 4b with the side portion of the lead 2. In other words, the first contact piece 4a applies a lateral force to the side of the upper shoulder 2a of the lead 2, engages with the upper edge of the upper shoulder 2a with the lateral force, and at the same time the second contact piece 4a engages with the upper edge of the upper shoulder 2a. 4b engages with the upper edge of the lower shoulder portion 2b of the lead 2 while applying lateral force to the side of the lower shoulder portion 2b of the lead 2, and by this engagement, the IC package is pushed in the direction in which the IC package is pushed. This will prevent it from coming off in the opposite direction. The above-mentioned engaging portion 4e makes the slip-off prevention more reliable.

As for the form of contact between the lead 2 and the contact 4, in addition to contacting the lead facing surfaces (plate surfaces) of the first and second contact pieces 4a and 4b with one side surface (thickness surface) of the lead, as shown in FIG. 6A. As shown, the first contact piece 4a and the second
When the contact portion of the contact piece 4b is configured to make contact at the upper edge and lower edge of one side of the lead, or as another example, as shown in FIG. 6B, it makes contact with the upper edge and side surface of one side of the lead. The form shall be Each of the contact parts functions as an engaging part 4e for the lead 2, and receives the lead 2 slid into the contact part by the guide piece 4d connected to the contact part, and engages with one side thereof.

In the above embodiment, the first
Although the case is shown in which the contact piece and the second contact piece are used to make contact at two locations, the present invention includes the case where the contact is made using a single contact piece. This also applies to the case where the lead 2 has a linear shape as shown in FIG. 7B.

Further, the present invention is applied to an IC package in which the leads 2 protrude in two directions from a pair of opposing side surfaces of the IC package body 1 as in the above-mentioned embodiments, as well as in an IC package in which the leads 2 protrude in two directions from two pairs of opposing side surfaces of the IC package body 1. It is also possible to implement the present invention in an IC package in which the lead 2 is made to protrude, or in an IC package in which the lead 2 is made to protrude on one side.

Effects of the Invention As explained above, in the conventional mounting type IC socket, the mounting piece, which is bent in a horizontal U shape, is extended horizontally so as to support the lead at its tip. However, in the present invention, the contact part of the contact is inserted between the leads from below to above, and the contact is placed on one side of the lead. Since the contacts are displaced laterally so as to apply lateral pressure, and the contacts are made to extend vertically, it is possible to design the contact installation area to remain approximately within the area where the leads protrude, and the leads can be placed in the same way as in the past. A large amount of installation space is not required in the outer area of the tip, and the external shape of the socket body can be made as small as possible.

In addition, in conventional mounting type IC sockets, even if the IC package is made smaller, the socket body becomes larger, which results in a reduction in packaging density.However, in the present invention, as described above, This allows the socket body to be made as close to the size of the IC package as possible, and packaging density can be significantly improved.

In addition, in the conventional contact type IC socket described above,
Since the upward elasticity of the above-mentioned contact piece acts on the lead, it is essential to attach the above-mentioned presser cover and its lock lever to prevent the contact piece from popping out and maintain the contact pressure, but in the present invention, one side of the lead While applying lateral pressure to the part, the lateral pressure causes the engaging part provided on the contact to engage with the upper edge of one side of the lead, reliably preventing the above-mentioned protrusion, and at the same time, the lateral pressure causes the other side of the lead to close to the contact partition wall. In order to ensure the positioning of the lead and the contact pressure due to the lateral force, it is necessary to include a retainer cover and its lock lever that can be closed against the upward elasticity of the conventional contact. Contact pressure can be ensured without any contact pressure, and contact can be maintained properly.

[Brief explanation of the drawing]

FIG. 1A is a partially cutaway perspective view of a socket for an IC package showing an embodiment of the present invention, FIG. 1B is a perspective view of the same with an IC package loaded, and FIG. 2 is a contact Figure 3 is a plan view of the IC package explaining the contact state between the lead and the lead.
IC socket plan view, Figure 4A is a sectional view taken along the line A-A in Figure 3, Figure B is the same sectional view showing the IC package loaded, Figure 5A is a sectional view taken along the line B-B in Figure 3 , FIG. 6B is a sectional view of the same with the IC package loaded, FIG. 6A is a sectional view of the same contact part showing another example of the contact form between the lead and the contact, and FIG. 7A and 7B are flat-type ICs to which the present invention is applied.
FIG. 3 is a perspective view illustrating various forms of packages. 1...IC package body, 2...Lead, 2
a... Upper shoulder, 2b... Lower shoulder, 3... Socket body, 4... Contact, 4a... First contact piece, 4b... Second contact piece, 4e... Engaging portion, 5... …
Partition wall and positioning wall, 6...Contact accommodation chamber, 7
...IC package storage room.

Claims (1)

[Scope of Claims] 1. An IC socket having contacts arranged in the socket body to make contact with a large number of leads protruding laterally of the IC package body, wherein the contacts extend vertically from below the leads upward. A contact piece is provided, and the contact piece has a tip contact portion.
The contact is arranged so as to intervene from below to above between the leads of the IC package, and the contact is provided with an engaging part that applies lateral pressure to one side of the lead and engages the upper edge of the lead with the lateral pressure. A socket for an IC package, characterized in that the side surface opposite to the side where the contact piece contacts is configured to abut against a contact partition wall with the above-mentioned lateral pressure for positioning. 2. Claim 1, characterized in that the engaging portion applies lateral pressure to one side of the upper piece of the lead bent in two stages, and engages the upper edge of the lead with the lateral pressure. Socket for IC package cage. 3. According to claim 1, the engaging portion applies lateral pressure to one side of the lower piece of the lead bent in two stages, and uses the lateral pressure to engage the upper edge of the lead. Socket for IC package cage.