JP2982871B1 - IC socket - Google Patents

Abstract

An object of the present invention is to effectively deal with a narrow pitch of an external contact of an IC, and to easily assemble a contact to a socket body while achieving a narrow pitch of a contact. Planting accuracy is effectively ensured in narrowing the pitch of the contact. The contact unit includes a plurality of contact units that are formed by connecting a plurality of contacts in a side-by-side state by an insulating plate. The contact units are arranged side by side with respect to a socket body. A plurality of contacts 1 are arranged side by side on a vertical plane, and one end of each of the contacts 2 has a contact portion 10 which is in pressure contact with an external contact 9 of the IC 5 and a printed circuit board or the like at the other end. An IC socket having terminal portions 11 connected to the IC socket, wherein the contact portions 10 are arranged in rows on a line crossing substantially horizontally with the side of the IC 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a BGA type or an LGA
The present invention relates to an IC socket which can be effectively applied to ICs of a shape, and can effectively cope with miniaturization of external contacts in these ICs.

[0002]

2. Description of the Related Art Japanese Patent Publication No. 6-77467 (USP 568).
No. 5725) employs a contact structure in which stamped and formed vertically long contacts are individually planted in the socket body, and the upper end of the contact is brought into pressure contact with an external contact arranged on the lower surface of the IC body. .

[0003]

The above-mentioned IC socket has a problem that a large number of assembling steps are required when planting a large number of contacts into the socket body, and the planting accuracy of each contact is reduced. In addition, the fine pitch of the external contacts of the IC has been advanced, and for example, BGA or LGA ICs having a pitch of 0.5 mm or less have appeared. It is difficult to respond, and the planting accuracy error is becoming unacceptable.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to provide an IC socket which effectively solves the above-mentioned problems. This IC
The socket includes a plurality of contact units formed by connecting a plurality of contacts in a juxtaposed state by an insulating plate.

Each contact unit is arranged side by side with respect to the socket body, and a plurality of contacts held by each contact unit are arranged side by side on a vertical plane.
At one end of each of the contacts, there is provided a contact portion which is brought into pressure contact with an external contact of the IC, and at the other end, a terminal portion which is connected to a printed circuit board or the like is provided. It has a configuration in which rows are arranged on a line that intersects with the side of the IC substantially horizontally, in other words, on a line that intersects with the side of the IC and is substantially parallel to the lower surface of the IC.

Each contact in each contact unit has a structure in which the pitch is changed so that the contact portion has a narrow pitch and the terminal portion has a wide pitch.

Each of the contacts has a hairpin bending lead connected to the upper end of the vertical lead, and an elastic arm which can be elastically displaced in the vertical direction protruding from the insulating plate from the lower end of each hairpin bending lead. It is taken out on a line intersecting the side of the IC, and the contact portion is provided at the tip of each elastic arm, and the height level of each contact portion is set to the height level of the projecting base of each elastic arm from the insulating plate. Set almost the same as.

The socket body has a mounting structure that can move the contact unit along a line intersecting the side of the IC and change the installation position of the contact portion.

The above-mentioned contact units are arranged in parallel so that the vertical planes of the respective insulating plates are in close contact with each other.

The socket body is provided with means for setting the upper and lower levels of each of the contact units.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIGS. 1A and 1B, a contact unit 1 is formed by connecting a plurality of contacts 2 by an insulating plate 3 and juxtaposing them.

As shown in FIGS. 3 to 6, a plurality of contact units 1 are arranged side by side with respect to the socket body 4 and a plurality of contacts 2 held by each contact unit 1 are arranged in a vertical plane. 7 on top.

As a specific example, as shown in FIG. 2, each of the contact units 1 has an insulating plate 3 forming each unit. The insulating plate 3 extends along a side 6 of an IC 5 mounted on a socket body 4 in a vertical plane 7 of the insulating plate 3. Are arranged side by side so as to be orthogonal to each side.

The insulating plate 3 connecting the contacts 2 is a single insulating plate as shown in FIG. 1A.
Or a plurality of separated insulating plates 3 as shown in FIG. 1B. As shown in FIG. 2AB, a plurality of contacts 2 forming each unit are insert-molded in the insulating plate 3.

Accordingly, each contact 2 extends through the insulating plate 3 and is integrated, and one insulating plate 3 shown in FIG. 1A fixes an intermediate extending portion of the juxtaposed contacts 2. The separated insulating plate 3 shown in FIG. 1B fixes the upper end and the lower end of the intermediate extension of the contacts 2 arranged in parallel.

The IC 5 has a rectangular shape. When the contact units 1 are arranged side by side in the horizontal direction, the surface of each insulating plate 3 rises substantially perpendicularly to the upper and lower surfaces of the socket body 4 and the IC 5, and a vertical plane is formed. 7 is formed.

The vertical plane 7 of each unit 1 is an IC.
5 are formed so as to be substantially parallel to each other in the horizontal direction along the side 6 and to be orthogonal to the side 6 of the IC 5 in the vertical direction. Each contact 2 held by each unit 1 is juxtaposed on this one vertical plane 7.

At one end of each of the contacts 2 is provided a contact portion 10 which is brought into pressure contact with the external contact 9 of the IC 5, and at the other end, a terminal portion 11 which is connected to a printed circuit board or the like is provided. Each contact 2 in each contact unit 1 has a pitch-converted structure in which each contact portion 10 has a narrow pitch P1 and each terminal portion 11 has a wide pitch P2.

Each of the contacts has an elastic arm 12 protruding and extending from the insulating plate 3 and capable of being elastically displaced in a vertical direction (longitudinal direction). The contact portion 10 is formed at an end of the elastic arm 12. The contact portions 10 of the contacts 2 in each unit 1 are arranged horizontally in a row on a line X intersecting substantially horizontally with the side 6 of the IC 5, for example, on a line X substantially orthogonal to the side 6. This line X is substantially parallel to the lower surface of the IC 5 and crosses the side 6.

The terminal 11 extends downward from the lower edge of the insulating plate 3 and is further connected to the socket body 4.
And extends downward from the lower surface of the substrate for connection to a printed circuit board or the like. The pitch conversion between the terminal portion 11 and the contact portion 10 is performed in the intermediate extension portion restrained by the insulating plate 3.

Each of the contact units 1 is arranged in parallel so that the vertical planes 7 of the insulating plates 3 forming the unit 1 are closely attached to each other and are arranged in one block. At this time, the plates 3 can be adhered to each other with the adhesive on the flat surface 7 to form one block. Alternatively, the insulating plates 3 are juxtaposed at a small interval. By closely contacting the insulating plates 3, the horizontal pitch of each unit 1 and the contact portion 10 is reduced, and even if each contact has a narrow pitch, by extending inside the plate 3, insulation from adjacent contacts is achieved. Is achieved favorably.

The socket body 4 sets the upper and lower (longitudinal) levels of the contact units 1 to form contact portions 10.
Means for setting the level above and below.

As a specific example, one or a plurality of mounting holes 13 are provided in the insulating plate 3 forming each unit 1 as shown in FIG. 1, and as shown in FIGS.
3 is aligned with the mounting hole 13 of the insulating plate 3 adjacent in the lateral direction, one or a plurality of pins 14 are inserted through the mounting hole 13, and both ends of the pin 14 are supported by the socket body 4,
The upper and lower levels of each unit 1, that is, the upper and lower levels of the contact portion 10 are determined.

Each of the units 1 is fixedly mounted on the socket body 4 by inserting both ends of the pin 14 into the mounting hole of the socket body 4 or by press-fitting the edge of the insulating plate 3 into the socket body 4 or the like. I do. Alternatively, the terminal unit 11 is press-fitted into the mounting hole of the socket main body 4 to fix each unit 1 to the socket main body 4.

The socket body 4 has a mounting structure that can move the contact unit 1 along a line X crossing the side 6 of the IC 5 to change the position of the contact portion 10.
The IC 5 has various sizes, and the position of the external contact 9 is also changed by this.

The position of the contact portion 10 can be adjusted to correspond to the position of the external contact 9 of the IC 5 by moving and fixing the contact unit 1 along the line X.

As a specific example of the unit mounting means, a guide which can move each unit 1 along the line X is provided, and is fixed to the socket body 4 with an adhesive at each moving position, or a press-fitting position of the insulating plate 3 Alternatively, the press-fitting position of the terminal portion 11 can be changed along the set line X, and the mounting position of each unit 1 is adjusted. Alternatively, a plurality of mounting holes or grooves 15 for engaging both ends of the pins 14 in the socket body 4 are arranged in parallel with the line X, and each of the mounting holes or grooves 15 is selected to engage both ends of the pins 14 for contact. The position of the unit 10 on the line X is adjusted.

As shown in FIGS. 3, 5, and 6, an IC mounting space 16 is provided at the center of the socket body 4.
An IC mounting table 17 is provided in the IC mounting space 16, and the IC mounting table 17 is supported by a spring 18 so as to be vertically movable. The IC mounting table 17 descends while compressing the spring 18 and rises by the restoring force of the spring 18. The IC 5 is mounted on the IC mounting table 17, and the external contact 9 of the IC 5 is brought into pressure contact with the contact portion 10 by pressing down the IC 5 together with the IC mounting table 17.

That is, the elastic arm 12 is pressed by the external contact 9 and is displaced downward, and the restoring force brings the contact portion 10 into press contact with the external contact 9. IC5 is BGA or LGA
And many external contacts 9 of these ICs 5 come into pressure contact with the contact portions 10 through many through holes 19 provided in the IC mounting table 17.

In the case of the BGA type IC or the PGA type IC 5 as shown in the figure, the external contacts 9 of these ICs, that is, the ball type contacts or the pin type contacts are inserted into the through holes 19 of the IC mounting base 17 from above. On the other hand, the contact portion 10 of each contact 2 is inserted from below the through-hole 19 and the contact between the contact 9 and the contact portion 10 is made in the through-hole 19. Secured by the inner surface of 19.

Alternatively, the various ICs are guided by the positioning walls 20 provided at the corners of the IC mounting table 17 to insert the ICs 5. A press cover 21 is rotatably attached to one end of the socket main body 4 via a shaft 22, and the press cover 21 is closed to the upper surface of the socket main body 4, so that the IC 5 mounted on the IC mount 17 is mounted. The upper surface is pushed down, and the external contact 9 is brought into pressure contact with the contact portion 10.

In this pressure contact state, a lock lever 24 rotatably attached to the other end of the socket body 4 by a shaft 23 is locked and held at the free end of the cover 21. The cover 21
The IC5 may be pushed down by the manipulator of the robot without providing.

Alternatively, a presser cover that can move up and down is provided on the upper surface of the socket body 4, and the IC presser latch provided on the socket body 4 is pivoted outward by lowering this cover, so that the IC 5
, And the IC holding latch is rotated inward by the upward movement to engage with the IC 5 to form a holding state.
The holding structure of the IC is not particularly limited.

Further, details of the contact unit will be described.

As shown in FIG. 1A, the contact 2 has an intermediate extending portion (intermediate extending lead portion) 25 extending along the surface of one insulating plate 3 through the inside of the plate. Alternatively, the upper end portion and the lower end portion of the intermediate extension lead portion 25 of the contact 2 penetrate along the surface of the separate insulating plate 3 and are connected.

The intermediate extension lead portion 25 comprises a vertical lead portion 26 and a hairpin bent lead portion 27 connected to the upper end of the vertical lead portion 26. The arm 12 is taken out on the line X, and the contact portion 10 is formed at the tip thereof.

The contact portions 10 of the respective contacts 2 are arranged in a line on the line X, and the height of the contact portions 10 is adjusted to the height of the elastic arm 12 projecting from the lower edge of the base of the elastic arm 12, that is, the upper end of the insulating plate 3. The height level is set to be substantially the same as the height level of the protruding base 28.

The elastic arms 12 extend horizontally in the same plane and are arranged in multiple stages in the vertical direction.
Can be bent downward with the fulcrum as a fulcrum. At this time, by setting the contact portion 10 and the protruding base portion 28 at substantially the same height level, the contact portion 10 can be displaced downward along a locus that approximates a substantially straight line as much as possible.

The hairpin bending lead portion 27 is a contact portion 1
The level is set higher than 0 to enable the level setting.

[0040]

According to the present invention, it is possible to easily assemble the contact with the socket body while effectively coping with the narrow pitch of the external contact of the IC and achieving the narrow pitch of the contact.

Also, the accuracy of planting the contacts with respect to the socket main body is effectively ensured in narrowing the pitch of the contacts. In addition, pitch conversion between the contact portion of the contact and the terminal portion can be easily realized. That is, it is easy to narrow the pitch of the contact portion corresponding to the external contact of the IC and widen the pitch of the terminal portion corresponding to the connection of the printed circuit board, and it is easy to manufacture a socket for mounting the IC having the external contact of the narrow pitch. become.

In particular, the above object can be effectively achieved by using a plurality of contact units having the same structure.
It is economical.

[Brief description of the drawings]

FIG. 1A is a side view of a contact unit, and FIG. 1B is a side view showing another example of the same unit.

2A is a longitudinal sectional view of the contact unit shown in FIG. 1A, and FIG. 2B is a sectional view taken along line AA of FIG.

FIG. 3 is a plan view of a socket incorporating the contact unit.

FIG. 4 shows I in the contact unit of the socket.
The top view which shows arrangement | positioning of the contact part with respect to the external contact of C.

FIG. 5 is a sectional view showing the IC socket in a state before the IC is mounted.

FIG. 6 is a cross-sectional view showing the IC socket in a state in which an IC is mounted and brought into pressure contact with the IC socket.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Contact unit 2 Contact 3 Insulating plate 4 Socket body 5 IC 6 IC side 7 Vertical plane 9 External contact 10 Contact part 11 Terminal part 12 Elastic arm 13 Mounting hole 14 Pin 16 IC mounting space 17 IC mounting base 18 Spring 19 Penetration Hole 21 Cover 22, 23 Shaft 24 Lock lever 25 Intermediate extending lead part 26 Vertical lead part 27 Hairpin bending lead part 28 Projection base P1 Narrow pitch P2 Wide pitch X Line crossing the side of IC

Claims (5)

(57) [Claims] A plurality of contact units each having a plurality of contacts connected in parallel by an insulating plate are provided. Each of the insulating plates forming each contact unit is arranged side by side with respect to the socket body, and each of the contact units is arranged side by side. A plurality of contacts held by the contact unit are juxtaposed on a vertical plane, and one end of each of the above contacts has a contact portion to be pressed into contact with an external contact of the IC, and the other end is connected to a wiring circuit board or the like. And the contact portions are arranged in a row on a line intersecting substantially horizontally with the side of the IC, and each of the contacts has a hairpin bending lead portion connected to an upper end of a vertical lead portion. An elastic arm protruding from the insulating plate from a lower end of each hairpin bending lead portion is brought out on a line intersecting a side of the IC, and a tip of each elastic arm is taken out. The contact portion is provided, IC socket, characterized in that the height levels of the respective contact portion is set to be substantially equal to the height level of the projection base portion from said insulation plate of each elastic arm. 2. The IC socket according to claim 1, wherein a pitch of said terminal portions is larger than a pitch of said contact portions. 3. The IC according to claim 1, wherein said socket body has a mounting structure capable of moving said contact unit along a line intersecting said side of said IC to change a position of a contact portion. socket. 4. The IC socket according to claim 1, wherein the insulating plates forming the contact units are arranged side by side so that their vertical planes are in close contact with each other. 5. The IC socket according to claim 1, wherein said socket body has means for setting upper and lower levels of each of said contact units.