JPS6171571A - Socket for reversely inserting ic package - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention In general, the IC leads of an IC package, typified by a dual in-line IC package, have a wide base and a distal end sandwiched between them.

The present invention relates to a socket for inserting an IC package upside down, in which the IC package is mounted upside down with the IC lead tip facing upward to make contact with the contacts provided on the socket.

(2) Conventional technology and problems When an IC package is mounted upside down in a socket with its lead tips facing upward, it is so-called reverse insertion and contact is made by applying elastic lateral pressure to the outer surface of the IC lead using the contacts provided in the socket. It is known that in this case, the IC package is likely to fly out due to impact or the like.

Conventionally, as a means to prevent this flying out, Japanese Unexamined Patent Application Publication No. 1983-1
No. 28584, JP-A-56-130087, etc. are provided. All of these use a single spring piece folded back in an inverted U-shape as a contact means, and at the same time function as a spring prevention means.

The main purpose of the plain contact is to obtain electrical contact with the IC lead with appropriate side pressure, and its purpose is different from the protrusion prevention means, which provides a locking action that resists upward force to prevent it from protruding. Naturally, the design conditions are different.

For example, if an attempt is made to apply side pressure from the outside to the inside near the tip of the IC lead to prevent contact and popping out, there is a risk that the lead will be deformed, making it difficult to insert and remove the IC package. Also, while applying lateral pressure to the IC lead at the end of the inverted U-shaped curved contact piece to obtain electrical contact, the curved part above the contact part is notched, and the notched piece engages with the wide part of the IC lead. It is difficult to design a spring piece that changes the spring pressure of the spring piece to make the lateral pressure of the contact part appropriate, and if the spring force is increased to obtain the appropriate contact pressure, the locking force due to the protruding notch piece will be high, and the IC package Strong force is required to insert and remove, making it difficult to put on and take off.

(3) Object of the Invention The present invention provides the socket for reverse insertion, in which the electrical contact means and the protrusion prevention means of an IC package inserted in the reverse direction do not interfere with each other, and provide highly reliable electrical contact and interface.
The purpose of preventing the C package from popping out can be accurately achieved, and in addition, the insertion and removal force of the IC package can be appropriately set without being affected by electrical contact pressure.

(4) Structure of the Invention In order to achieve the above-mentioned object, the present invention provides a socket for reverse insertion of an IC package having a wide base and an intervening IC lead at the tip. A first spring piece extends to the wide base of the IC lead, and a second spring piece extends to the narrow tip of the IC lead, and the end of the first spring piece extends to the wide base of the IC lead. It is brought into elastic contact with the outer surface of the wide base to serve as an electrical contact means, and
The end of the second spring piece is engaged with the continuous portion of the wide base and narrow tip of the IC lead to serve as means for preventing the IC package from popping out.

(5) Embodiments of the Invention The present invention described above will be described in detail below based on the embodiments shown in FIGS. 1 to 6.

1 is an IC package that is inserted backwards into the socket. The IC package 1 has IC leads 2 arranged in parallel on its left and right sides. The IC lead 2 is bent from the side surface of the IC package to the bottom side, and is made wide at the base side and sandwiched at the tip side, and has an & mark at the transition portion from the wide base portion 2a to the narrow tip portion 2b. It is formed and has a battledore shape in overall view.

Reference numeral 4 denotes a socket base that can hold contacts into which the IC package 1 is inserted upside down. The socket base has an IC accommodating part 6 in which the IC package 1 is mounted, and left and right side walls 4a defining the IC accommodating part 6 are arranged in parallel to face each row of IC leads 2. A large number of contacts 7 are arranged at the same pitch as the IC leads 2 to make contact with each IC lead 2 of the IC package 1 inserted upside down on the side surface.

In order to hold the contact 7, a hair-tooth-shaped partition is formed on the inner surface of each side wall 4a, and a contact holding groove 5 is formed between each partition.
is formed to obtain correspondence between the IC leads 2 and the IC leads 2 while maintaining each contact 7 within the area. The contact 7 includes a first spring piece 8 and a second spring piece 9, as shown in more detail in FIGS. 4 and 5. 1st. The second spring pieces 8 and 9 are both arranged on the outer side of the IC lead 2 so that their plate surfaces are parallel and facing each other in the front and back, and in the same direction as the IC lead 2 (with the tip facing upward!). In detail, the first spring piece 8
is placed in front of the IC lead facing the outer surface of the IC lead, and a second spring piece 9 is placed in parallel with the rear side of the IC lead, and the base side edges of both spring pieces 8 and 9 are connected by the connecting piece 11 so as to form a U-shape. The connecting bases of the two spring pieces are planted in the socket base portion at the bottom of the contact holding groove 5, and the planting is done by raising the first spring piece 8 along the contact holding groove 5 from the above-mentioned reverse position [ , the second spring piece 9 is extended toward the wide base 2a of the IC lead 2, and the second spring piece 9 is attached to the narrow tip 2b of the IC lead 2.
The protrusion 8a is bent into a dogleg shape at the end of the first spring, or the protrusion 8a is oriented toward the outer surface of the wide base 2a of the IC lead 2 from the outside to the inside. Elastic contact occurs with lateral pressure.

That is, the ff51 spring piece 8 is made to function as an electrical contact means for the contact 7 to the IC lead 2.

At the same time, bend the tip of the second spring piece 9 extending toward the narrow tip 2b of the IC lead into a square shape toward the IC lead 2, and insert a retaining hole 9a in the bent portion in alignment with the dogleg shape. Fill the base of the narrow tip of the IC lead 2 into the engagement hole 9a so that the dogleg-shaped bent lower piece fits into the engagement hole 9a.
Shoulder portions 2C1 of the wide base 2a on both sides, that is, the wide base 2
It is locked at the portion where the tip a transitions to the narrow tip, and prevents the IC package l from floating up. This prevention of floating does not require a strong pressing force that imparts positive downward elasticity to the IC lead 2, but rather a slight elasticity that resists a small component force (upward force) generated by the lateral pressure of the first spring piece 8. It is enough to stop.

On the other hand, the side pressure of the first spring piece 8 against the IC lead 2 can be made sufficiently large, and can be set to an appropriate side pressure necessary to obtain reliable electrical contact.

As described above, when the IC package 1 is fitted into the IC accommodating portion 6 of the socket base 4 with the narrow tip 2b of the IC lead 2 facing upward, the wide base 2a of the IC lead 2 first touches the second spring piece 9. It is inserted while pushing aside the dogleg bent part 9b, and when it is continued to be pushed, the wide base part 2a pushes away the protruding part 8a of the first spring piece 8, and it is inserted into the accommodation part 6 which sets the insertion depth of the IC package l. The wide base 2a of the IC lead 2 and the protrusion 8a of the first spring piece 8 are brought into contact with each other, and at the same time, the narrow tip 2b of the IC lead 2 and the second spring The narrow end portion 2b is engaged with the engagement hole 9a of the piece 9, and is locked with the shoulder portion 2C of the wide base portion 2a.

This creates a state in which the second spring piece 9 prevents the IC package 1 from floating due to the side pressure of the first spring piece 8.

(6) As described in detail, in the present invention, the means for making electrical contact with the IC lead and the means for preventing the IC package from popping out are provided on each contact. It can be divided into a first spring piece and a second spring piece that do not interfere with each other.

While the first spring piece ensures a sufficiently strong and appropriate contact pressure with the IC lead wide base, the second spring piece can set a smaller locking elasticity that is sufficient to prevent the IC package from popping out. It also becomes possible to insert and remove the connector without imposing a large burden.

That is, according to the present invention, the first spring piece ensures highly reliable electrical contact pressure when the IC package is inserted backwards, while the second spring piece ensures accurate prevention of the IC package from popping out. It is possible to provide an IC socket that can be inserted and removed with ease.

Although it is disadvantageous in terms of material yield compared to the case where a single spring piece performs both of the above functions, the purpose of reversing the IC package can be effectively achieved by the socket and contact structure described above.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, and FIG. 1 is a partially cutaway perspective view showing the IC package and the socket for reverse insertion before connection, FIG. 2 is a cross-sectional view of the socket, and FIG. 3 is a cross-sectional view of the socket. The diagram is I
FIG. 4 is an enlarged perspective view showing the connection state between the IC lead and the contact from the inner side of the IC lead;
FIG. 5 is an enlarged perspective view of the connection state between the IC lead and the contact as viewed from the outer side of the IC lead, and FIG. 6 is a cross-sectional view of FIG. 3. 1...IC package, 2...IC lead, 2a.
... Same width wide base, 2b... Same width narrow tip, 2C...
Shoulder of wide base, 4... Socket base, 6-IC accommodating part, 7... Contact, 8... First spring piece, 9...
...Second spring piece. Patent Applicant Yama-Denki Kogyo Co., Ltd. Agent Patent Attorney Takashi Nakahata (Figure 1, Figure 2, Figure 3)

Claims (1)

[Claims] A socket for an IC package that is mounted inverted with the tip of the IC lead facing upward, and the IC lead contact of the socket has a first spring piece extending to the wide base of the IC lead and a first spring piece of the IC lead. and a second spring piece extending to the narrow tip, the end of the first spring piece being brought into elastic contact with the outer surface of the wide base of the IC lead to serve as an electrical contact means; A socket for reversely inserting an IC package, characterized in that the end of the IC lead is engaged with a transition region from the wide base to the narrow tip of the IC lead to prevent the IC package from popping out.