JPH0349909U - - Google Patents
Info
- Publication number
- JPH0349909U JPH0349909U JP10955389U JP10955389U JPH0349909U JP H0349909 U JPH0349909 U JP H0349909U JP 10955389 U JP10955389 U JP 10955389U JP 10955389 U JP10955389 U JP 10955389U JP H0349909 U JPH0349909 U JP H0349909U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- attached
- taping device
- spherical
- rail surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
Landscapes
- Package Closures (AREA)
Description
第１図は本考案の実施例１を示す断面図、第２
図は本考案の実施例２を示す断面図、第３図は従
来の半導体素子テーピング装置におけるシールテ
ープ貼付け機構を示す側面図、第４図は従来の半
導体素子テーピング装置におけるシールテープ貼
付け機構を示す側面図、第５図は半導体素子テー
ピング状態を示す斜視図である。
１…半導体素子、２…レール、３…貼付けヒー
ターブロツク、４…シールテープ、５…エンボス
テープ、６…球面体、６ａ…球面、７…球面座、
８…真空口、９…開閉コツク、１０…断熱材、１
１…スプリング、１２…ヒーター、１３…電磁弁
。
Fig. 1 is a sectional view showing the first embodiment of the present invention;
The figure is a sectional view showing Embodiment 2 of the present invention, FIG. 3 is a side view showing a sealing tape pasting mechanism in a conventional semiconductor device taping device, and FIG. 4 is a side view showing a sealing tape pasting mechanism in a conventional semiconductor device taping device. The side view and FIG. 5 are perspective views showing the semiconductor element taped state. DESCRIPTION OF SYMBOLS 1... Semiconductor element, 2... Rail, 3... Adhesive heater block, 4... Seal tape, 5... Embossed tape, 6... Spherical body, 6a... Spherical surface, 7... Spherical seat,
8...Vacuum port, 9...Opening/closing handle, 10...Insulating material, 1
1... Spring, 12... Heater, 13... Solenoid valve.
Claims (1)
圧着によりシールテープをエンボステープの上面
に貼付けるテーピング装置において、貼付けヒー
ターブロツクを球面と球面座によりレール面に追
従させこれを真空固定しレール面との平行度を維
持するシールテープ貼付け機構を有することを特
徴とする半導体素子テーピング装置。 In a taping device that automatically inserts a semiconductor element into an embossed tape and then attaches the sealing tape to the top surface of the embossed tape using thermocompression bonding, the attached heater block follows the rail surface using a spherical surface and a spherical seat, and this is vacuum-fixed and attached to the rail surface. A semiconductor device taping device characterized by having a seal tape pasting mechanism that maintains parallelism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10955389U JPH0349909U (en) | 1989-09-19 | 1989-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10955389U JPH0349909U (en) | 1989-09-19 | 1989-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0349909U true JPH0349909U (en) | 1991-05-15 |
Family
ID=31658140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10955389U Pending JPH0349909U (en) | 1989-09-19 | 1989-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0349909U (en) |
-
1989
- 1989-09-19 JP JP10955389U patent/JPH0349909U/ja active Pending