JPH0349420Y2 - - Google Patents
Info
- Publication number
- JPH0349420Y2 JPH0349420Y2 JP1985204612U JP20461285U JPH0349420Y2 JP H0349420 Y2 JPH0349420 Y2 JP H0349420Y2 JP 1985204612 U JP1985204612 U JP 1985204612U JP 20461285 U JP20461285 U JP 20461285U JP H0349420 Y2 JPH0349420 Y2 JP H0349420Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- chip
- insulator
- wiring board
- spacer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012212 insulator Substances 0.000 claims description 23
- 125000006850 spacer group Chemical group 0.000 claims description 22
- 239000004020 conductor Substances 0.000 claims description 19
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- ZJPGOXWRFNKIQL-JYJNAYRXSA-N Phe-Pro-Pro Chemical compound C([C@H](N)C(=O)N1[C@@H](CCC1)C(=O)N1[C@@H](CCC1)C(O)=O)C1=CC=CC=C1 ZJPGOXWRFNKIQL-JYJNAYRXSA-N 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- -1 electrodes Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985204612U JPH0349420Y2 (US07122547-20061017-C00032.png) | 1985-12-28 | 1985-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985204612U JPH0349420Y2 (US07122547-20061017-C00032.png) | 1985-12-28 | 1985-12-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62112174U JPS62112174U (US07122547-20061017-C00032.png) | 1987-07-17 |
| JPH0349420Y2 true JPH0349420Y2 (US07122547-20061017-C00032.png) | 1991-10-22 |
Family
ID=31170612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985204612U Expired JPH0349420Y2 (US07122547-20061017-C00032.png) | 1985-12-28 | 1985-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0349420Y2 (US07122547-20061017-C00032.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH086370Y2 (ja) * | 1987-12-21 | 1996-02-21 | 株式会社村田製作所 | 電子部品用接続部品 |
| JPH0633657Y2 (ja) * | 1987-12-21 | 1994-08-31 | 株式会社村田製作所 | 表面実装型コネクタ |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5483455A (en) * | 1977-12-15 | 1979-07-03 | Seiko Epson Corp | Liquid crystal display device |
| JPS56147377A (en) * | 1980-04-16 | 1981-11-16 | Shinetsu Polymer Co | Adjesive connector |
| JPS57121176A (en) * | 1980-12-05 | 1982-07-28 | Cii | Electrically connecting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5647985Y2 (US07122547-20061017-C00032.png) * | 1975-12-15 | 1981-11-10 |
-
1985
- 1985-12-28 JP JP1985204612U patent/JPH0349420Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5483455A (en) * | 1977-12-15 | 1979-07-03 | Seiko Epson Corp | Liquid crystal display device |
| JPS56147377A (en) * | 1980-04-16 | 1981-11-16 | Shinetsu Polymer Co | Adjesive connector |
| JPS57121176A (en) * | 1980-12-05 | 1982-07-28 | Cii | Electrically connecting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62112174U (US07122547-20061017-C00032.png) | 1987-07-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6262878B1 (en) | Chip capacitor | |
| JPH0349420Y2 (US07122547-20061017-C00032.png) | ||
| JP2512828B2 (ja) | チップ部品の実装方法 | |
| JP3061031B2 (ja) | プリント配線基板 | |
| JP2596750Y2 (ja) | プリント基板 | |
| JP2528326B2 (ja) | 回路基板に対するコンデンサの取付方法 | |
| JPH0541128U (ja) | 表面実装型並列接続キヤツプ | |
| JPS58131638U (ja) | 混成集積回路装置 | |
| JPH0547446Y2 (US07122547-20061017-C00032.png) | ||
| JPH0458189B2 (US07122547-20061017-C00032.png) | ||
| JPS6242539Y2 (US07122547-20061017-C00032.png) | ||
| JPS638145Y2 (US07122547-20061017-C00032.png) | ||
| JPH0119395Y2 (US07122547-20061017-C00032.png) | ||
| JPH041744Y2 (US07122547-20061017-C00032.png) | ||
| JP2533277Y2 (ja) | チップキャパシタの接地構造 | |
| JPS6025127Y2 (ja) | ストリツプ線路フイルタのパツケ−ジ構造 | |
| JPS626675Y2 (US07122547-20061017-C00032.png) | ||
| JPH0710516Y2 (ja) | 混成集積回路基板モジュール | |
| JP2819742B2 (ja) | 混成集積回路装置 | |
| JPH0124944Y2 (US07122547-20061017-C00032.png) | ||
| JPH0410641Y2 (US07122547-20061017-C00032.png) | ||
| JPH069448Y2 (ja) | チツプ状バリスタ | |
| JPS6120737Y2 (US07122547-20061017-C00032.png) | ||
| JPH0113378Y2 (US07122547-20061017-C00032.png) | ||
| JPH0430785Y2 (US07122547-20061017-C00032.png) |
