JPH0348676B2 - - Google Patents
Info
- Publication number
- JPH0348676B2 JPH0348676B2 JP59147832A JP14783284A JPH0348676B2 JP H0348676 B2 JPH0348676 B2 JP H0348676B2 JP 59147832 A JP59147832 A JP 59147832A JP 14783284 A JP14783284 A JP 14783284A JP H0348676 B2 JPH0348676 B2 JP H0348676B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- copper
- paste
- atmosphere
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 66
- 239000010949 copper Substances 0.000 claims description 46
- 229910052802 copper Inorganic materials 0.000 claims description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 35
- 239000011230 binding agent Substances 0.000 claims description 35
- 229960004643 cupric oxide Drugs 0.000 claims description 34
- 239000012298 atmosphere Substances 0.000 claims description 32
- 238000007639 printing Methods 0.000 claims description 23
- 238000010304 firing Methods 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 21
- 239000000919 ceramic Substances 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 16
- 239000011521 glass Substances 0.000 claims description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 2
- 230000001590 oxidative effect Effects 0.000 claims description 2
- 238000000197 pyrolysis Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 53
- 239000004020 conductor Substances 0.000 description 15
- 230000008569 process Effects 0.000 description 12
- 238000005245 sintering Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- 230000009467 reduction Effects 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- 238000001465 metallisation Methods 0.000 description 8
- 230000008859 change Effects 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 5
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 4
- 230000009977 dual effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000001856 Ethyl cellulose Substances 0.000 description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 3
- -1 W and Mo Chemical class 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229920001249 ethyl cellulose Polymers 0.000 description 3
- 235000019325 ethyl cellulose Nutrition 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- 239000001293 FEMA 3089 Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000006112 glass ceramic composition Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14783284A JPS6126292A (ja) | 1984-07-17 | 1984-07-17 | セラミック多層配線基板の製造方法 |
| US06/756,081 US4714570A (en) | 1984-07-17 | 1985-07-17 | Conductor paste and method of manufacturing a multilayered ceramic body using the paste |
| US07/066,182 US4863683A (en) | 1984-07-17 | 1987-06-24 | Conductor paste and method of manufacturing a multilayered ceramic body using the paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14783284A JPS6126292A (ja) | 1984-07-17 | 1984-07-17 | セラミック多層配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6126292A JPS6126292A (ja) | 1986-02-05 |
| JPH0348676B2 true JPH0348676B2 (fr) | 1991-07-25 |
Family
ID=15439251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14783284A Granted JPS6126292A (ja) | 1984-07-17 | 1984-07-17 | セラミック多層配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6126292A (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4906405A (en) * | 1987-05-19 | 1990-03-06 | Matsushita Electric Industrial Co., Ltd. | Conductor composition and method of manufacturing a multilayered ceramic body using the composition |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60133794A (ja) * | 1983-12-21 | 1985-07-16 | 富士通株式会社 | 多層プリント基板の製造方法 |
-
1984
- 1984-07-17 JP JP14783284A patent/JPS6126292A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60133794A (ja) * | 1983-12-21 | 1985-07-16 | 富士通株式会社 | 多層プリント基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6126292A (ja) | 1986-02-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4795512A (en) | Method of manufacturing a multilayer ceramic body | |
| US4714570A (en) | Conductor paste and method of manufacturing a multilayered ceramic body using the paste | |
| JPH04169002A (ja) | 導電性ペーストとそれを用いた多層セラミック配線基板の製造方法 | |
| JPH06237081A (ja) | 多層セラミック基板の製造方法 | |
| JPH0348676B2 (fr) | ||
| JPH0320914B2 (fr) | ||
| JPH06223621A (ja) | 導体ペースト組成物 | |
| JPH0341997B2 (fr) | ||
| JPH0797447B2 (ja) | メタライズ組成物 | |
| JPH0680897B2 (ja) | セラミツク銅多層配線基板の製造方法 | |
| JP2000114724A (ja) | 多層配線基板 | |
| JPH0753625B2 (ja) | セラミック用メタライズ組成物 | |
| JPH0588557B2 (fr) | ||
| JPS61289691A (ja) | メタライズ組成物 | |
| JPH0632379B2 (ja) | セラミツク配線基板の製造方法 | |
| JPH0554718B2 (fr) | ||
| JP3628088B2 (ja) | 窒化アルミニウム多層配線基板およびその製造方法 | |
| JPS62198198A (ja) | セラミツク多層配線基板の製造方法 | |
| JPH0321109B2 (fr) | ||
| JPH0321107B2 (fr) | ||
| JPH03285208A (ja) | 導電性ペースト | |
| JPH0680898B2 (ja) | セラミツク銅多層基板の製造方法 | |
| JPS61292394A (ja) | セラミツク配線基板用メタライズ組成物 | |
| JPS63291304A (ja) | メタライズ組成物 | |
| JPH0321110B2 (fr) |