JPH0348485A - Reinforcing method for conductive property of polymer type copper paste circuit board - Google Patents
Reinforcing method for conductive property of polymer type copper paste circuit boardInfo
- Publication number
- JPH0348485A JPH0348485A JP18250789A JP18250789A JPH0348485A JP H0348485 A JPH0348485 A JP H0348485A JP 18250789 A JP18250789 A JP 18250789A JP 18250789 A JP18250789 A JP 18250789A JP H0348485 A JPH0348485 A JP H0348485A
- Authority
- JP
- Japan
- Prior art keywords
- copper paste
- type copper
- paste
- circuit board
- polymer type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 30
- 239000010949 copper Substances 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 9
- 229920000642 polymer Polymers 0.000 title claims abstract description 8
- 230000003014 reinforcing effect Effects 0.000 title claims description 6
- 229910000679 solder Inorganic materials 0.000 claims abstract description 22
- 238000010304 firing Methods 0.000 claims abstract description 17
- 238000007639 printing Methods 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 abstract description 5
- 238000007650 screen-printing Methods 0.000 abstract description 4
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 2
- 230000003311 flocculating effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000007796 conventional method Methods 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電気接続箱などの内部回路構威部品として用
いられるポリマー型銅ペースト回路板の導電性補強方法
に関する．
〔従来の技術〕
従来、ポリマー型銅ペースト印刷回路の導電性を向上さ
せるために半田ペーストが使用されている．これは、第
２図に示すように、回路基板１に所望の回路パターンを
有して銅ペースト２を印刷し、焼成硬化により形成され
た回路の表面に半田ペースト３を塗布し、再び焼成を行
って製造するものであった．
〔発明が解決しようとする課題〕
従来の方法では、銅ペーストと半田ペーストの印刷およ
び焼成を２工程行わなければならず、また、半田ペース
トは焼成時に凝集しやすく、とくに回路巾が広い場合に
は使用が難しく、品質の安定という点で問題であった．
本発明は上記の問題に着目してなされたもので、ポリマ
ー型銅ペースト等の印刷および焼戒を一工程で行うこと
ができ、回路巾の広狭に左右されず、安定な品質のもの
を製造できる導電性補強方法を提供することにある．
〔課題を解決するための手段〕
前記の課題は、請求項１に記載のように、回路基板にポ
リマー型銅ペーストを印刷して所望の回路パターンを形
成し、該回路パターンを焼戒硬化してなるポリマー型銅
ぺ一人ト回路板の製造に際し、前記ポリマー型銅ペース
トに半田ペーストを混合して印刷および焼成を行うこと
により達成される．
半田ペーストはポリマー型銅ペーストに対して３５〜６
０重量％、好ましくは４０〜５０重量％混合される。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for reinforcing the conductivity of a polymer-type copper paste circuit board used as an internal circuit component of an electrical connection box or the like. [Prior Art] Solder paste has traditionally been used to improve the conductivity of polymer-type copper paste printed circuits. As shown in Fig. 2, a copper paste 2 with a desired circuit pattern is printed on a circuit board 1, a solder paste 3 is applied to the surface of the circuit formed by baking and hardening, and baking is performed again. It was something to go and manufacture. [Problems to be Solved by the Invention] In the conventional method, printing and firing of copper paste and solder paste must be performed in two steps, and solder paste tends to aggregate during firing, especially when the circuit width is wide. was difficult to use and had problems in terms of quality stability. The present invention was made with attention to the above problem, and it is possible to print and burn polymer-type copper paste etc. in one step, and to manufacture products with stable quality regardless of the width of the circuit. The objective is to provide a method for reinforcing conductivity that is possible. [Means for Solving the Problem] The above problem is solved by printing a polymer-type copper paste on a circuit board to form a desired circuit pattern, and then hardening the circuit pattern by burning. This is achieved by mixing solder paste with the polymer-type copper paste, printing and firing the polymer-type copper paste. Solder paste is 35-6 for polymer type copper paste
0% by weight, preferably 40-50% by weight.
この混合物を通常ポリマー型銅ペーストの溶剤として使
用するジエチレングリコールモノメチルエーテルなどで
希釈し、スクリーン印刷に適した粘度３ ０ ０〜４
０ ０ｐｏｉｓｅに調整する．上記の希釈混合物をスク
リーン印刷などの既知の手段を用いて前記回路基板（第
２図参照）に回路パターンを形成し、焼成、硬化する．
焼戒は一段で行ってもよいが、仮焼成と本焼成の二段に
分けて行うのが好ましい。仮焼成は８０〜１００゜Ｃで
５〜１０分、また本焼成は１４０〜１８０℃、好ましく
は１５０〜１６０℃で１５〜３０分行う．これにより導
電性の良好な回路体が得られる．
半田ペーストの添加量を３５〜６０！ｆｔ％に限定した
理由は、３５重量％を下まわると、本焼成中に溶融ハン
ダが銅ペーストの銅粉粒子間に均一に行きわたらず安定
な導電性が得られず、逆に６０重量％を超えると、溶融
ハンダの凝集が生じ、回路表面が平滑で、かつ導電性の
よい回路体が得られないためである。This mixture is diluted with diethylene glycol monomethyl ether, which is usually used as a solvent for polymer-type copper paste, to a viscosity of 300 to 4, which is suitable for screen printing.
Adjust to 0 0poise. A circuit pattern is formed on the circuit board (see FIG. 2) using the above diluted mixture using known means such as screen printing, followed by firing and curing.
The firing command may be performed in one stage, but it is preferable to perform it in two stages: preliminary firing and final firing. Preliminary firing is performed at 80-100°C for 5-10 minutes, and main firing is performed at 140-180°C, preferably 150-160°C for 15-30 minutes. This results in a circuit with good conductivity. Add amount of solder paste from 35 to 60! The reason why it is limited to ft% is that if it is less than 35% by weight, the molten solder will not spread evenly between the copper powder particles of the copper paste during the main firing, making it impossible to obtain stable conductivity. This is because, if it exceeds 100%, the molten solder will agglomerate, making it impossible to obtain a circuit body with a smooth circuit surface and good conductivity.
ポリマー型銅ペース｝Ｓ−５０００ （三井金属鉱業■
製）１００ｆｉｆ部と半田ペーストＳ−９３１３（■日
本スペリア製）１００重量部とを混合してメチルカルビ
トール６重量部で希釈し、粘度４ ０ ０ ｐｏｉｓｅ
のペースト液を調製した．このペースト液を２００メッ
シュのスクリーンを用いて紙・フェノール樹脂製の回路
基板にスクリーン印刷し、回路パターンを形成した．こ
の回路板を熱風乾燥器中８０℃で５分仮焼成したのち、
１６０℃で２０分本焼成を行い、厚さ１５〜２０ａｍを
もつ回路導体が得られた．この回路導体の比抵抗を測定
した結果、８．５Ｘ１０−’・０であった。Polymer type copper paste} S-5000 (Mitsui Metal Mining ■
100 parts by weight of solder paste S-9313 (made by Nippon Superior) and diluted with 6 parts by weight of methyl carbitol to give a viscosity of 400 poise.
A paste solution was prepared. This paste solution was screen printed on a paper/phenol resin circuit board using a 200 mesh screen to form a circuit pattern. After pre-baking this circuit board at 80℃ for 5 minutes in a hot air dryer,
Main firing was performed at 160°C for 20 minutes, and a circuit conductor with a thickness of 15 to 20 am was obtained. As a result of measuring the specific resistance of this circuit conductor, it was found to be 8.5×10−′·0.
次に、ポリマー型銅ペーストの量を一定にして、半田ペ
ーストの配合量を変えて上記と同様にして回路体を製作
し、その比抵抗を測定し、結果を第１図に示した。Next, circuit bodies were manufactured in the same manner as described above by keeping the amount of polymer-type copper paste constant and varying the amount of solder paste, and the specific resistance thereof was measured. The results are shown in FIG.
図から明らかなように、銅ペーストに対する半田ペース
トの配合量が３５〜６０重量％で比抵抗が安定化する。As is clear from the figure, the specific resistance is stabilized when the amount of solder paste to copper paste is 35 to 60% by weight.
以上説明したように、本発明によれば、銅ペースト回路
板の製造に際して銅ペーストおよび半田ペーストの印刷
、焼成を一工程で行うことができ、回路体の生産性向上
と共に、半田ペーストの凝集がなく導電性が改良された
安定な品質の回路板を得ることができる．As explained above, according to the present invention, printing and firing of copper paste and solder paste can be performed in one step when manufacturing a copper paste circuit board, and the productivity of circuit bodies is improved and agglomeration of solder paste is reduced. It is possible to obtain a circuit board of stable quality with improved conductivity without any problems.
第１図は本発明方法により得られたポリマー型銅ペース
ト回路板の導電特性を示すグラフであり、横軸は半田ペ
ーストの銅ペーストに対する重量％、縦軸は比抵抗（Ω
・備）である。
第２図は従来のポリマー型銅ペースト回路板の製造方法
の説明図である。
１・・・回路基板、２・・・銅ペースト、３・・・半田
べ一スト。FIG. 1 is a graph showing the conductive properties of a polymer-type copper paste circuit board obtained by the method of the present invention, where the horizontal axis is the weight percent of solder paste to copper paste, and the vertical axis is specific resistance (Ω
・Preparation). FIG. 2 is an explanatory diagram of a conventional method for manufacturing a polymer type copper paste circuit board. 1... Circuit board, 2... Copper paste, 3... Solder paste.
Claims (3)
の回路パターンを形成し、該回路パターンを焼成硬化し
てなるポリマー型銅ペースト回路板の製造に際し、前記
ポリマー型銅ペーストに半田ペーストを混合して印刷お
よび焼成を行うことを特徴とするポリマー型銅ペースト
回路板の導電性補強方法。(1) When manufacturing a polymer-type copper paste circuit board by printing a polymer-type copper paste on a circuit board to form a desired circuit pattern and baking and hardening the circuit pattern, solder paste is applied to the polymer-type copper paste. A method for reinforcing conductivity of a polymer-type copper paste circuit board, which comprises mixing, printing and firing.
の半田ペーストを混合して印刷する請求項１の導電性補
強方法。(2) 35 to 60% by weight based on polymer type copper paste
2. The conductive reinforcing method according to claim 1, wherein the solder paste is mixed and printed.
１８０℃の本焼成の二段階で行う請求項１または２の導
電性補強方法。(3) Temporary firing at 80-100°C and 140-100°C
The conductive reinforcing method according to claim 1 or 2, which is carried out in two stages: main firing at 180°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18250789A JPH0348485A (en) | 1989-07-17 | 1989-07-17 | Reinforcing method for conductive property of polymer type copper paste circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18250789A JPH0348485A (en) | 1989-07-17 | 1989-07-17 | Reinforcing method for conductive property of polymer type copper paste circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0348485A true JPH0348485A (en) | 1991-03-01 |
Family
ID=16119509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18250789A Pending JPH0348485A (en) | 1989-07-17 | 1989-07-17 | Reinforcing method for conductive property of polymer type copper paste circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348485A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6054175A (en) * | 1997-05-28 | 2000-04-25 | Yazaki Corporation | Conductive filler, conductive paste and method of fabricating circuit body using the conductive paste |
| KR100965500B1 (en) * | 2002-07-30 | 2010-06-25 | 아이신에이더블류 가부시키가이샤 | Motor manufacturing process |
-
1989
- 1989-07-17 JP JP18250789A patent/JPH0348485A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6054175A (en) * | 1997-05-28 | 2000-04-25 | Yazaki Corporation | Conductive filler, conductive paste and method of fabricating circuit body using the conductive paste |
| KR100965500B1 (en) * | 2002-07-30 | 2010-06-25 | 아이신에이더블류 가부시키가이샤 | Motor manufacturing process |
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