JPH0348247U - - Google Patents
Info
- Publication number
- JPH0348247U JPH0348247U JP10990389U JP10990389U JPH0348247U JP H0348247 U JPH0348247 U JP H0348247U JP 10990389 U JP10990389 U JP 10990389U JP 10990389 U JP10990389 U JP 10990389U JP H0348247 U JPH0348247 U JP H0348247U
- Authority
- JP
- Japan
- Prior art keywords
- electrode wiring
- semiconductor device
- wiring
- insulating film
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10990389U JPH0348247U (US07498051-20090303-C00003.png) | 1989-09-19 | 1989-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10990389U JPH0348247U (US07498051-20090303-C00003.png) | 1989-09-19 | 1989-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0348247U true JPH0348247U (US07498051-20090303-C00003.png) | 1991-05-08 |
Family
ID=31658462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10990389U Pending JPH0348247U (US07498051-20090303-C00003.png) | 1989-09-19 | 1989-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348247U (US07498051-20090303-C00003.png) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4948280A (US07498051-20090303-C00003.png) * | 1972-09-08 | 1974-05-10 | ||
| JPS554970A (en) * | 1978-06-27 | 1980-01-14 | Nippon Telegr & Teleph Corp <Ntt> | Formation of electrode or wiring layer on substrate |
| JPS63202953A (ja) * | 1987-02-19 | 1988-08-22 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
| JPS63299140A (ja) * | 1987-05-28 | 1988-12-06 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPH01100924A (ja) * | 1987-10-14 | 1989-04-19 | Seiko Epson Corp | アクティプマトリクス基板の製造方法 |
| JPH01204330A (ja) * | 1988-02-08 | 1989-08-16 | Toshiba Corp | 塗布装置 |
| JPH01235353A (ja) * | 1988-03-16 | 1989-09-20 | Nec Corp | 半導体装置の製造方法 |
| JPH02250316A (ja) * | 1989-03-23 | 1990-10-08 | Sony Corp | 半導体装置 |
-
1989
- 1989-09-19 JP JP10990389U patent/JPH0348247U/ja active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4948280A (US07498051-20090303-C00003.png) * | 1972-09-08 | 1974-05-10 | ||
| JPS554970A (en) * | 1978-06-27 | 1980-01-14 | Nippon Telegr & Teleph Corp <Ntt> | Formation of electrode or wiring layer on substrate |
| JPS63202953A (ja) * | 1987-02-19 | 1988-08-22 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
| JPS63299140A (ja) * | 1987-05-28 | 1988-12-06 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPH01100924A (ja) * | 1987-10-14 | 1989-04-19 | Seiko Epson Corp | アクティプマトリクス基板の製造方法 |
| JPH01204330A (ja) * | 1988-02-08 | 1989-08-16 | Toshiba Corp | 塗布装置 |
| JPH01235353A (ja) * | 1988-03-16 | 1989-09-20 | Nec Corp | 半導体装置の製造方法 |
| JPH02250316A (ja) * | 1989-03-23 | 1990-10-08 | Sony Corp | 半導体装置 |
